Xilinx XC3S1600E-4FGG484C

Part points

• The XC3S1600E-4FGG484C chip is a field-programmable gate array (FPGA) produced by Xilinx. It belongs to the Spartan-3E FPGA family and has 1,600,000 system gates. This chip is highly versatile and can be configured to perform a wide range of functions. Its FG484 package type allows for easy integration into electronic systems.

• Equivalent

  Equivalent products of the XC3S1600E-4FGG484C chip include XCS20XL-4FGG484C, XCS30XL-4FGG484C and XCS40XL-4FGG484C manufactured by Xilinx.

• Features

  The XC3S1600E-4FGG484C is a field-programmable gate array (FPGA) with 1,600,000 system gates. It utilizes 90nm technology and has 484 pins. The device provides excellent performance, low power consumption, and flexible usage due to its FPGA architecture.

• Pinout

  The XC3S1600E-4FGG484C is a Field Programmable Gate Array (FPGA) from the Spartan-3E series by Xilinx. It has a pin count of 484, which refers to the number of input and output pins available on the device. The specific functions of each pin depend on the configuration of the FPGA and the design implemented on it.

• Manufacturer

  The manufacturer of the XC3S1600E-4FGG484C is Xilinx. It is a semiconductor manufacturing company specializing in the design and production of programmable logic devices, including field-programmable gate arrays (FPGAs) and system on chips (SoCs).

• Application Field

  The XC3S1600E-4FGG484C is a high-density field-programmable gate array (FPGA) that can be used in a variety of applications, including telecommunications, wireless networking, industrial automation, automotive, and defense. It offers a large number of logic cells and I/O pins, making it suitable for complex designs that require high-performance and reconfigurability.

• Package

  The package type of the XC3S1600E-4FGG484C chip is BGA (Ball Grid Array). The form is FPGA (Field-Programmable Gate Array). The size of the chip is 484 balls (pins) in a 23mm x 23mm grid.