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Xilinx XC3S1000-4FT256C 48HRS

Spartan®-3 Field Programmable Gate Array (FPGA) IC 173 442368 17280 256-LBGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC3S1000-4FT256C

Datasheet: XC3S1000-4FT256C Datasheet (PDF)

Package/Case: BGA256

RoHS Status:

Stock Condition: 3651 pcs, New Original

Product Type: Programmable Logic ICs

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $403.755 $403.755
180 $161.102 $28998.360
540 $155.718 $84087.720
990 $153.057 $151526.430

In Stock:3651 PCS

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Quick Quote

Please submit RFQ for XC3S1000-4FT256C or email to us: Email: [email protected], we will contact you within 12 hours.

XC3S1000-4FT256C General Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 173 442368 17280 256-LBGA

Features

  • Number of Logic Cells: 1,031
  • Number of I/Os: 208
  • Embedded Multiplier Blocks: 4
  • Block RAM: 576 Kb
  • Operating Voltage: 1.2V
  • Maximum Operating Frequency: 400 MHz
XC3S1000-4FT256C

Application

  • Industrial control systems
  • Aerospace and defense electronics
  • Automotive electronics
  • Communications systems
  • Video and image processing systems
  • Medical equipment
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Mount Surface Mount Number of Pins 256
Max Operating Temperature 85 °C Min Operating Temperature 0 °C
Number of Gates 1e+06 Number of I/Os 173
Number of Logic Blocks (LABs) 1920 Number of Logic Elements/Cells 17280
Operating Supply Voltage 1.2 V RAM Size 54 kB
Speed Grade 4

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC3S1000-4FT256C component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC3S1000-4FG320C

Brands :  

Package :   BGA320

Description :   Spartan-3 FPGA Family : Complete Data Sheet

Part Number :   XC3S1000-4FG456C

Brands :  

Package :   BGA456

Description :   FPGA Spartan®-3 Family 1M Gates 17280 Cells 630MHz 90nm Technology 1.2V

Part Number :   XC3S1000-4FG900C

Brands :  

Package :   BGA

Description :  

Part Number :   XC3S1000-4FT256I

Brands :  

Package :   BGA256

Description :   Spartan-3 FPGA Family : Complete Data Sheet

Part Number :   XC3S1000-4FTG256I

Brands :  

Package :   BGA-256

Description :   FPGA Spartan®-3 Family 1M Gates 17280 Cells 630MHz 90nm Technology 1.2V

Part Number :   XC3S1000-4VQ100C

Brands :  

Package :   BGA

Description :  

Part points

  • The XC3S1000-4FT256C chip is a field-programmable gate array (FPGA) designed by Xilinx. It has a capacity of 1,000,000 system gates and is housed in a 256-pin fine-pitch ball grid array package. The chip offers a wide range of features and capabilities, making it suitable for various applications in the electronics industry.
  • Equivalent

    Some equivalent products of the XC3S1000-4FT256C chip are the XC3S1000-4VQG100C, XC3S500E-4FT256C, XC3S500E-4VQG100C, XC3S1200E-4FTG256C, and XC3S1200E-4VOG100C chips.
  • Features

    The XC3S1000-4FT256C is a Field-Programmable Gate Array (FPGA) with 1000K System Gates, 93 I/O pins, and 4Mbits of bram. It operates with a 1.5V core voltage and offers a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. The device is ideal for low-to-mid-density applications that require high I/O count and advanced logic capability.
  • Pinout

    The XC3S1000-4FT256C is an FPGA with a pin count of 256. It is part of the Spartan-3 family and has a capacity of 1,000 logic cells. It operates at a speed grade of -4 and is available in a TQFP package.
  • Manufacturer

    The manufacturer of the XC3S1000-4FT256C is Xilinx Inc. It is a semiconductor company that specializes in designing and manufacturing programmable logic devices (PLDs). Xilinx is one of the leading providers of field-programmable gate array (FPGA) technology, offering solutions for a wide range of applications in industries such as automotive, aerospace, telecommunications, and data centers.
  • Application Field

    The XC3S1000-4FT256C is an FPGA (field-programmable gate array) chip commonly used in various embedded applications such as industrial automation, telecommunications, and automotive electronics. It can be utilized in tasks such as signal processing, control systems, data acquisition, and sensor interfacing due to its flexibility and programmable nature.
  • Package

    The XC3S1000-4FT256C is a Field Programmable Gate Array (FPGA) chip. Its package type is a 256-pin Fine-Pitch Ball Grid Array (BGA), and its form and size are 17x17 mm.

Datasheet PDF

Preliminary Specification XC3S1000-4FT256C PDF Download

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