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$5000Xilinx XC3S1000-4FG456C
XC3S1000-4FG456C: FPGA with 1000000 system gates
Brands: Amd
Mfr.Part #: XC3S1000-4FG456C
Datasheet: XC3S1000-4FG456C Datasheet (PDF)
Package/Case: FBGA-456
RoHS Status:
Stock Condition: 3,618 pcs, New Original
Product Type: FPGAs (Field Programmable Gate Array)
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $171.477 | $171.477 |
200 | $66.360 | $13272.000 |
500 | $64.028 | $32014.000 |
1000 | $62.875 | $62875.000 |
In Stock: 3,618 PCS
XC3S1000-4FG456C General Description
The XC3S1000-4FG456C is a field-programmable gate array (FPGA) from Xilinx. It belongs to the Spartan-3 family of FPGAs and is designed for high-performance applications. The device has a capacity of 1 million system gates and features 1000 logic cells, 576 user I/Os, and 24 block RAMs.The XC3S1000-4FG456C operates at a maximum frequency of 533 MHz and has a 1.2V core voltage. It is built using a 90nm CMOS process technology, which helps to achieve a balance between cost, power consumption, and performance. The FPGA supports various advanced features, including clock management resources, flexible routing resources, and on-chip configuration capabilities.In terms of package, the XC3S1000-4FG456C comes in a 456-pin fine-pitch ball grid array (FBGA) package. This package offers good signal integrity and thermal performance, making it suitable for demanding applications.
Features
- 1,000,000 system gates
- 169 of 17 x 17 block RAMs
- 740 Kb of fast distributed block RAM
- 4768 Kb of total RAM
- 81,920 logic cells
- Up to 668 user I/Os
- Multiple power down modes
Application
- Embedded systems
- Digital signal processing
- Communications systems
- Industrial automation
- Automotive systems
Specifications
Parameter | Value | Parameter | Value |
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Product Category | FPGA - Field Programmable Gate Array | Series | XC3S1000 |
Number of Logic Elements | 17280 LE | Adaptive Logic Modules - ALMs | 7680 ALM |
Embedded Memory | 432 kbit | Number of I/Os | 333 I/O |
Supply Voltage - Min | 1.14 V | Supply Voltage - Max | 1.26 V |
Minimum Operating Temperature | 0 C | Maximum Operating Temperature | + 85 C |
Mounting Style | SMD/SMT | Package / Case | FBGA-456 |
Brand | AMD / Xilinx | Distributed RAM | 120 kbit |
Embedded Block RAM - EBR | 432 kbit | Maximum Operating Frequency | 280 MHz |
Moisture Sensitive | Yes | Number of Gates | 1000000 |
Operating Supply Voltage | 1.2 V | Product Type | FPGA - Field Programmable Gate Array |
Factory Pack Quantity | 1 | Subcategory | Programmable Logic ICs |
Tradename | Spartan |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC3S1000-4FG456C chip is a Field Programmable Gate Array (FPGA) manufactured by Xilinx. It offers 1 million system gates and a 3.456-inch Fine-Pitch Ball Grid Array (FBGA) package. This chip is designed to provide programmable logic and digital signal processing capabilities for various applications, including telecommunications, industrial control, and automotive systems.
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Equivalent
Some equivalent products of the XC3S1000-4FG456C chip are XC3S1000-4FG320C, XC3S1000-4FG456I, and XC3S1000-4FG320I. -
Features
The XC3S1000-4FG456C is a Field-Programmable Gate Array (FPGA) chip designed by Xilinx. It has 1,008 configurable Logic Cells, 2,160 slices, and 34,952 logic cells. It operates at a speed of up to 401 MHz and contains embedded RAM and DSP slices. The FPGA supports various I/O standards and has a 1.2V core voltage supply. -
Pinout
The XC3S1000-4FG456C is a Field-Programmable Gate Array (FPGA) with a pin count of 456. It has multiple functions, including programmable logic, memory, and I/O capabilities, that can be configured to perform customized tasks in digital circuit designs. -
Manufacturer
The XC3S1000-4FG456C is a product of Xilinx Inc., a leading American manufacturer of field-programmable gate arrays (FPGAs) and programmable logic devices (PLDs). Xilinx specializes in designing and producing high-performance integrated circuits used in various industries, including telecommunications, automotive, and aviation. -
Application Field
The XC3S1000-4FG456C FPGA can be used in various applications such as telecommunications, industrial automation, automotive, aerospace, and medical devices. Its high performance and versatility make it suitable for applications that require real-time processing, data processing, signal processing, and control systems. -
Package
The XC3S1000-4FG456C chip is of the FG456C form and comes in a 456-pin BGA (Ball Grid Array) package. It falls under the Spartan-3 family of Field-Programmable Gate Arrays (FPGAs) and has a capacity of 1000 system gates.
Datasheet PDF
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