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Xilinx XC3S1000-4FG456C 48HRS

XC3S1000-4FG456C: FPGA with 1000000 system gates

ISO14001 ISO9001 DUNS

Brands: Amd

Mfr.Part #: XC3S1000-4FG456C

Datasheet: XC3S1000-4FG456C Datasheet (PDF)

Package/Case: FBGA-456

RoHS Status:

Stock Condition: 3,618 pcs, New Original

Product Type: FPGAs (Field Programmable Gate Array)

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $171.477 $171.477
200 $66.360 $13272.000
500 $64.028 $32014.000
1000 $62.875 $62875.000

In Stock: 3,618 PCS

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Quick Quote

Please submit RFQ for XC3S1000-4FG456C or email to us: Email: [email protected], we will contact you within 12 hours.

XC3S1000-4FG456C General Description

The XC3S1000-4FG456C is a field-programmable gate array (FPGA) from Xilinx. It belongs to the Spartan-3 family of FPGAs and is designed for high-performance applications. The device has a capacity of 1 million system gates and features 1000 logic cells, 576 user I/Os, and 24 block RAMs.The XC3S1000-4FG456C operates at a maximum frequency of 533 MHz and has a 1.2V core voltage. It is built using a 90nm CMOS process technology, which helps to achieve a balance between cost, power consumption, and performance. The FPGA supports various advanced features, including clock management resources, flexible routing resources, and on-chip configuration capabilities.In terms of package, the XC3S1000-4FG456C comes in a 456-pin fine-pitch ball grid array (FBGA) package. This package offers good signal integrity and thermal performance, making it suitable for demanding applications.

xc3s1000-4fg456c

Features

  • 1,000,000 system gates
  • 169 of 17 x 17 block RAMs
  • 740 Kb of fast distributed block RAM
  • 4768 Kb of total RAM
  • 81,920 logic cells
  • Up to 668 user I/Os
  • Multiple power down modes
xc3s1000-4fg456c

Application

  • Embedded systems
  • Digital signal processing
  • Communications systems
  • Industrial automation
  • Automotive systems
xc3s1000-4fg456c

Specifications

Parameter Value Parameter Value
Product Category FPGA - Field Programmable Gate Array Series XC3S1000
Number of Logic Elements 17280 LE Adaptive Logic Modules - ALMs 7680 ALM
Embedded Memory 432 kbit Number of I/Os 333 I/O
Supply Voltage - Min 1.14 V Supply Voltage - Max 1.26 V
Minimum Operating Temperature 0 C Maximum Operating Temperature + 85 C
Mounting Style SMD/SMT Package / Case FBGA-456
Brand AMD / Xilinx Distributed RAM 120 kbit
Embedded Block RAM - EBR 432 kbit Maximum Operating Frequency 280 MHz
Moisture Sensitive Yes Number of Gates 1000000
Operating Supply Voltage 1.2 V Product Type FPGA - Field Programmable Gate Array
Factory Pack Quantity 1 Subcategory Programmable Logic ICs
Tradename Spartan

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XC3S1000-4FG456C chip is a Field Programmable Gate Array (FPGA) manufactured by Xilinx. It offers 1 million system gates and a 3.456-inch Fine-Pitch Ball Grid Array (FBGA) package. This chip is designed to provide programmable logic and digital signal processing capabilities for various applications, including telecommunications, industrial control, and automotive systems.
  • Equivalent

    Some equivalent products of the XC3S1000-4FG456C chip are XC3S1000-4FG320C, XC3S1000-4FG456I, and XC3S1000-4FG320I.
  • Features

    The XC3S1000-4FG456C is a Field-Programmable Gate Array (FPGA) chip designed by Xilinx. It has 1,008 configurable Logic Cells, 2,160 slices, and 34,952 logic cells. It operates at a speed of up to 401 MHz and contains embedded RAM and DSP slices. The FPGA supports various I/O standards and has a 1.2V core voltage supply.
  • Pinout

    The XC3S1000-4FG456C is a Field-Programmable Gate Array (FPGA) with a pin count of 456. It has multiple functions, including programmable logic, memory, and I/O capabilities, that can be configured to perform customized tasks in digital circuit designs.
  • Manufacturer

    The XC3S1000-4FG456C is a product of Xilinx Inc., a leading American manufacturer of field-programmable gate arrays (FPGAs) and programmable logic devices (PLDs). Xilinx specializes in designing and producing high-performance integrated circuits used in various industries, including telecommunications, automotive, and aviation.
  • Application Field

    The XC3S1000-4FG456C FPGA can be used in various applications such as telecommunications, industrial automation, automotive, aerospace, and medical devices. Its high performance and versatility make it suitable for applications that require real-time processing, data processing, signal processing, and control systems.
  • Package

    The XC3S1000-4FG456C chip is of the FG456C form and comes in a 456-pin BGA (Ball Grid Array) package. It falls under the Spartan-3 family of Field-Programmable Gate Arrays (FPGAs) and has a capacity of 1000 system gates.

Datasheet PDF

Preliminary Specification XC3S1000-4FG456C PDF Download

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