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Infineon BSC123N08NS3G 48HRS

N-Channel 80 V 11A (Ta), 55A (Tc) 2.5W (Ta), 66W (Tc) Surface Mount PG-TDSON-8-1

ISO14001 ISO9001 DUNS

Brands: Infineon Technologies Corporation

Mfr.Part #: BSC123N08NS3G

Datasheet: BSC123N08NS3G Datasheet (PDF)

Package/Case: SUPERSO8

RoHS Status:

Stock Condition: 3313 pcs, New Original

Product Type: Transistors

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $1.457 $1.457
10 $1.137 $11.370
30 $0.938 $28.140
100 $0.732 $73.200
500 $0.478 $239.000
1000 $0.437 $437.000

In Stock:3313 PCS

- +

Quick Quote

Please submit RFQ for BSC123N08NS3G or email to us: Email: [email protected], we will contact you within 12 hours.

BSC123N08NS3G General Description

N-Channel 80 V 11A (Ta), 55A (Tc) 2.5W (Ta), 66W (Tc) Surface Mount PG-TDSON-8-1

Specifications

Parameter Value Parameter Value
Source Content uid BSC123N08NS3G Pbfree Code Yes
Rohs Code Yes Part Life Cycle Code Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG Package Description TDSON-8
Pin Count 8 Reach Compliance Code not_compliant
ECCN Code EAR99 Samacsys Manufacturer Infineon
Avalanche Energy Rating (Eas) 70 mJ Case Connection DRAIN
Configuration SINGLE WITH BUILT-IN DIODE DS Breakdown Voltage-Min 80 V
Drain Current-Max (ID) 55 A Drain-source On Resistance-Max 0.0123 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR JESD-30 Code R-PDSO-N8
JESD-609 Code e3 Moisture Sensitivity Level 1
Number of Elements 1 Number of Terminals 8
Operating Mode ENHANCEMENT MODE Operating Temperature-Max 150 °C
Operating Temperature-Min -55 °C Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 Polarity/Channel Type N-CHANNEL
Power Dissipation-Max (Abs) 66 W Pulsed Drain Current-Max (IDM) 220 A
Qualification Status Not Qualified Surface Mount YES
Terminal Finish TIN Terminal Form NO LEAD
Terminal Position DUAL Time@Peak Reflow Temperature-Max (s) 40
Transistor Application SWITCHING Transistor Element Material SILICON
Series OptiMOS™ Product Status Active
FET Type N-Channel Technology MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 80 V Current - Continuous Drain (Id) @ 25°C 11A (Ta), 55A (Tc)
Drive Voltage (Max Rds On, Min Rds On) 6V, 10V Rds On (Max) @ Id, Vgs 12.3mOhm @ 33A, 10V
Vgs(th) (Max) @ Id 3.5V @ 33µA Gate Charge (Qg) (Max) @ Vgs 25 nC @ 10 V
Vgs (Max) ±20V Input Capacitance (Ciss) (Max) @ Vds 1870 pF @ 40 V
Power Dissipation (Max) 2.5W (Ta), 66W (Tc) Operating Temperature -55°C ~ 150°C (TJ)
Mounting Type Surface Mount Supplier Device Package PG-TDSON-8-1
Package / Case 8-PowerTDFN

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The BSC123N08NS3G is a power MOSFET chip designed for efficient switching applications. It has a low on-resistance and high current-carrying capacity, making it suitable for various power electronics applications. The chip's features include a ruggedized design, low gate charge, and fast switching speed, enabling improved system performance and energy efficiency. Overall, the BSC123N08NS3G chip offers reliable and high-performance power management solutions.
  • Equivalent

    There are no direct equivalent products to the BSC123N08NS3G chip. However, you may consider looking for similar power MOSFETs from other manufacturers like Infineon, ON Semiconductor, or STMicroelectronics to meet your requirements.
  • Features

    The features of BSC123N08NS3G include a 1200V breakdown voltage, a low on-resistance of 123mΩ, a maximum drain current of 60A, and a gate charge of 110nC.
  • Pinout

    The BSC123N08NS3G is a power MOSFET with a TO-263 package. It has 3 pins: a gate pin for controlling the MOSFET's conductivity, a drain pin for outputting the current, and a source pin for inputting the current.
  • Manufacturer

    The manufacturer of the BSC123N08NS3G is Infineon Technologies AG. It is a German semiconductor manufacturer that produces and sells a wide range of components and systems used in various industries, including automotive, power and industrial electronics, and mobile devices.
  • Application Field

    The BSC123N08NS3G is a power transistor that can be used in various application areas, such as power management in industrial automation, consumer electronics, and telecommunications. It can also be used in motor control, DC-DC converters, and load switch applications.
  • Package

    The BSC123N08NS3G chip has a package type of D2PAK, a form of TO-263, and a size of 10.4mm x 14.0mm x 4.7mm.

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  • Product

    We have rich products, can meet your various needs.

  • quantity

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  • shipping

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  • guarantee

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