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Infineon BSC027N04LSG 48HRS

N-Channel 40 V 24A (Ta), 100A (Tc) 2.5W (Ta), 83W (Tc) Surface Mount PG-TDSON-8-1

ISO14001 ISO9001 DUNS

Brands: Infineon Technologies Corporation

Mfr.Part #: BSC027N04LSG

Datasheet: BSC027N04LSG Datasheet (PDF)

Package/Case: SUPERSO8

RoHS Status:

Stock Condition: 2603 pcs, New Original

Product Type: Transistors

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $0.816 $0.816
10 $0.671 $6.710
30 $0.598 $17.940
100 $0.525 $52.500
500 $0.452 $226.000
1000 $0.429 $429.000

In Stock:2603 PCS

- +

Quick Quote

Please submit RFQ for BSC027N04LSG or email to us: Email: [email protected], we will contact you within 12 hours.

BSC027N04LSG General Description

N-Channel 40 V 24A (Ta), 100A (Tc) 2.5W (Ta), 83W (Tc) Surface Mount PG-TDSON-8-1

bsc027n04lsg

Features

  • Drain-source voltage (VDS) rating of 40V
  • Continuous drain current (ID) rating of 100A
  • Low on-resistance (RDS(on)) of 2.7 milliohms
  • Fast switching speed
  • High efficiency and reliability
  • RoHS compliant

Application

  • Power supplies
  • DC-DC converters
  • Motor control
  • Inverters
  • LED lighting
  • Audio amplifiers
  • Battery management systems

Specifications

Parameter Value Parameter Value
Source Content uid BSC027N04LSG Pbfree Code Yes
Rohs Code Yes Part Life Cycle Code Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG Package Description GREEN, PLASTIC, TDSON-8
Pin Count 8 Reach Compliance Code not_compliant
ECCN Code EAR99 Samacsys Manufacturer Infineon
Additional Feature LOGIC LEVEL COMPATIBLE Avalanche Energy Rating (Eas) 115 mJ
Case Connection DRAIN Configuration SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 40 V Drain Current-Max (ID) 24 A
Drain-source On Resistance-Max 0.0041 Ω FET Technology METAL-OXIDE SEMICONDUCTOR
JESD-30 Code R-PDSO-F8 JESD-609 Code e3
Moisture Sensitivity Level 1 Number of Elements 1
Number of Terminals 8 Operating Mode ENHANCEMENT MODE
Operating Temperature-Max 150 °C Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 Polarity/Channel Type N-CHANNEL
Power Dissipation-Max (Abs) 83 W Pulsed Drain Current-Max (IDM) 400 A
Qualification Status Not Qualified Surface Mount YES
Terminal Finish TIN Terminal Form FLAT
Terminal Position DUAL Transistor Application SWITCHING
Transistor Element Material SILICON

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The BSC027N04LSG is a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) chip designed for high power applications. It features a low on-resistance and high current capability, making it suitable for various power management and switching applications. The chip is housed in a small outline package (SOP) for easy installation and integration into electronic systems.
  • Equivalent

    The equivalent products of the BSC027N04LSG chip are the Infineon IPP027N04N3G and the Infineon BSC027N04NSG. These chips have similar specifications and can be used as replacements for the BSC027N04LSG in various applications.
  • Features

    BSC027N04LSG is a 40V N-channel power MOSFET with a low Rds(on) of 3.7mΩ. It has a high power density in a TO263 package, making it suitable for high power applications. The MOSFET also features high avalanche energy capability, low gate charge, and is RoHS compliant.
  • Pinout

    The BSC027N04LSG is a Power MOSFET with a pin count of 8 (including the exposed pad) and functions as a N-channel enhancement mode transistor. It is designed for high current applications in power supplies, motor drives, and DC-DC converters.
  • Manufacturer

    The BSC027N04LSG is manufactured by Infineon Technologies AG, a semiconductor manufacturer specializing in power and sensing solutions. They are a German multinational corporation with their headquarters in Neubiberg, Germany. Infineon produces a wide range of semiconductors for various industries including automotive, industrial, and consumer electronics.
  • Application Field

    The BSC027N04LSG is a power MOSFET designed for use in applications such as motor control, power supplies, and DC-DC converters. It is suitable for high frequency and high current operations, making it ideal for a wide range of power electronics applications requiring efficient power switching and control.
  • Package

    The BSC027N04LSG chip comes in a D2PAK package type, with a TO-263 form, and has a size of 10.3 x 15.7 x 4.5 mm.

Datasheet PDF

Preliminary Specification BSC027N04LSG PDF Download

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  • quantity

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