Orders Over
$5000NXP BLF888A
BLF888A is an N-channel RF MOSFET optimized for radio frequency tasks, accommodating voltages up to 110V and encapsulated in a 5-pin SOT-539A package
Brands: Ampleon
Mfr.Part #: BLF888A
Datasheet: BLF888A Datasheet (PDF)
Package/Case: SOT-539A
Product Type: RF FETs, MOSFETs
RoHS Status:
Stock Condition: 3,346 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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BLF888A General Description
The BLF888A is a high-power RF transistor designed for use in the broadcast industry, specifically for FM radio and TV applications. It is a silicon N-channel enhancement mode lateral DMOS transistor capable of operating at frequencies up to 500 MHz. The BLF888A is capable of delivering output power levels of up to 1.2 kW with a gain of 12 dB, making it suitable for high-power broadcast amplification.This transistor is housed in a bolt-down package for easy installation and heat dissipation. It features a thermistor for temperature sensing and protection, as well as internal input matching for optimal performance. The BLF888A is designed for reliable operation in harsh environments, with enhanced ruggedness and thermal stability.With a drain efficiency of up to 75% at rated output power, the BLF888A offers high performance while minimizing power consumption. It has a low thermal resistance to ensure efficient heat dissipation and reliability under high power operation. The BLF888A is RoHS compliant and is suitable for use in a variety of broadcast applications where high-power amplification is required
Features
- High power and high gain
- Excellent linearity and low intermodulation distortion
- Designed for broadband commercial and military applications
- Capable of handling high VSWR mismatch
- Integrated ESD protection
- Available in bolt down or solder down flange package
Application
- Industrial RF power amplification
- Mobile radio transmitters
- RF heating applications
- Avionics
- Marine radar systems
- Amateur radio
- Medical equipment
- Television and FM broadcast transmitters
- Microwave ovens
- Scientific research
Specifications
Parameter | Value | Parameter | Value |
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ECCN (US) | EAR99 | Part Status | Active |
Configuration | Dual Common Source | Channel Mode | Enhancement |
Channel Type | N | Number of Elements per Chip | 1 |
Mode of Operation | Pulsed RF Class-AB|DVB-T|2-Tone Class-AB | Process Technology | LDMOS |
Maximum Drain Source Voltage (V) | 110 | Maximum Gate Source Voltage (V) | 11 |
Maximum VSWR | 10 | Maximum Drain Source Resistance (mOhm) | 143(Typ)@6.15V |
Typical Input Capacitance @ Vds (pF) | 220@50V | Typical Reverse Transfer Capacitance @ Vds (pF) | 1.2@50V |
Typical Output Capacitance @ Vds (pF) | 74@50V | Output Power (W) | 250(Min) |
Typical Power Gain (dB) | 21 | Maximum Frequency (MHz) | 860 |
Minimum Frequency (MHz) | 470 | Typical Drain Efficiency (%) | 46 |
Minimum Operating Temperature (°C) | -65 | Maximum Operating Temperature (°C) | 200 |
Mounting | Screw | Package Height | 4.7(Max) |
Package Width | 10.29(Max) | Package Length | 41.28(Max) |
PCB changed | 5 | Supplier Package | SOT-539A |
Pin Count | 5 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The BLF888A is a power amplifier chip commonly used in RF (radio frequency) applications. It belongs to the LDMOS (laterally-diffused metal–oxide–semiconductor) transistor family and offers high power and efficiency. With its excellent linearity and thermal performance, it is widely used in telecommunications, broadcasting, and other wireless infrastructure systems. The BLF888A chip provides a reliable and efficient solution for amplifying RF signals.
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Features
BLF888A is a high-power LDMOS transistor designed for applications in the VHF to UHF frequency range. It operates at a maximum power output of 1500 Watts and delivers high gain and efficiency. This transistor also offers excellent thermal stability, suitable for a wide range of RF power amplifier circuits. -
Pinout
The BLF888A is a power transistor with a package pin count of three. The pin functions are as follows: Pin 1 is the emitter, Pin 2 is the base, and Pin 3 is the collector. -
Manufacturer
The manufacturer of the BLF888A is NXP Semiconductors. NXP is a global semiconductor company that offers a wide range of products and solutions for various industries, including automotive, industrial, and communication sectors. -
Application Field
The BLF888A is a power transistor commonly used in RF (radio frequency) amplifier applications, such as base stations for wireless communication systems, radar systems, and industrial applications that require high power and efficiency. -
Package
The BLF888A chip has a package type of SOT502A, a form of SMD, and a size of 11.3mm x 5.3mm.
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