EP3C5F256C8N

Part points

• The EP3C5F256C8N is a field-programmable gate array (FPGA) chip from the Cyclone III family manufactured by Altera. It features 5,000 logic elements, 271 Kbits of RAM, and 56 18 x 18 multipliers. The EP3C5F256C8N is designed for low-power, high-performance applications in industries such as telecommunications, automotive, and industrial automation.

• Equivalent

  Some equivalent products of the EP3C5F256C8N chip are Altera Cyclone III EP3C5F256C8N, Cyclone III EP3C5F256C8, and EP3C5F256C8. These chips are part of the same Cyclone III FPGA family and offer similar features and performance capabilities.

• Features

  The EP3C5F256C8N is a low-cost and low-power FPGA with 5,888 logic elements, 374Kbits of RAM, and 126 user I/O pins. It has on-chip flash memory for configuration and offers high performance and reliability for a variety of applications.

• Pinout

  EP3C5F256C8N is a Cyclone III FPGA with a 256-pin BGA package. It features 5,405 logic elements, 6 Embedded Multiplier Blocks (EMBs), and 270 Kbits of embedded memory. It also includes PLLs for clock generation and various I/O standards for interface connectivity.

• Manufacturer

  Intel Corporation is the manufacturer of EP3C5F256C8N, a field-programmable gate array (FPGA). Intel is an American multinational corporation and technology company that designs and manufactures computer processors, chipsets, and other semiconductor solutions for a variety of industries, including cloud computing, data centers, and artificial intelligence.

• Application Field

  EP3C5F256C8N is commonly used in applications such as industrial control systems, telecommunications equipment, test and measurement devices, automotive electronics, and consumer electronics. Its versatility, low power consumption, and high-performance capabilities make it suitable for a wide range of applications requiring programmable logic devices.

• Package

  The EP3C5F256C8N chip is a field programmable gate array (FPGA) with a package type of FBGA, a form factor of chip-scale package (CSP), and a size of 256-ball grid array (8x8mm).