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Altera EP4CE22E22C8N

FPGA - Field Programmable Gate Array FPGA - Cyclone IV E 1395 LABs 79 IOs

ISO14001 ISO9001 DUNS

Brands: Altera Corporation (Intel)

Mfr.Part #: EP4CE22E22C8N

Datasheet: EP4CE22E22C8N Datasheet (PDF)

Package/Case: QFP-144

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3204 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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EP4CE22E22C8N General Description

FPGA, CYCLONE IV, 22K, 144EQFP; No. of Logic Blocks: 1395; No. of Macrocells: 22320; FPGA Family: Cyclone IV; Logic Case Style: QFP; No. of Pins: 144Pins; No. of Speed Grades: 8; Total RAM Bits: 594Kbit; No. of I/O's: 79I/O's; Clock Management: PLL; Core Supply Voltage Min: 1.15V; Core Supply Voltage Max: 1.25V; I/O Supply Voltage: 3.3V; Operating Frequency Max: 472.5MHz; Product Range: Cyclone IV Series; MSL: MSL 3 - 168 hours; SVHC: No SVHC (17-Dec-2015); Core Supply Voltage Range: 1.15V to 1.25V; Logic Function Number: FPGA; Operating Temperature Max: 85°C; Operating Temperature Min: 0°C; Operating Temperature Range: 0°C to +85°C

Altera Corporation (Intel) Inventory

Specifications

Parameter Value Parameter Value
feature-family-name Cyclone® IV E feature-process-technology 60nm
feature-maximum-number-of-user-i-os 79 feature-number-of-registers
feature-device-logic-cells 22320 feature-device-system-gates
feature-number-of-multipliers 66 (18x18) feature-program-memory-type SRAM
feature-ram-bits-kbit 594 feature-total-number-of-block-ram 66
feature-ethernet-macs feature-supported-ip-core DS1/E1 TDM over Packet IP core|EtherNET/IP|EtherCAT|RapidIO to AXI Bridge Controller (RAB)|Sub-frame Latency JPEG 2000 Encoder (BA130)
feature-supported-ip-core-manufacture Barco Silex/Mobiveil, Inc/Beckhoff Automation GmbH/Softing AG/Aimvalley feature-maximum-number-of-serdes-channels
feature-device-logic-units 22320 feature-device-number-of-dlls-plls 4
feature-transceiver-blocks feature-transceiver-speed-gbps
feature-dedicated-dsp feature-pci-blocks
feature-programmability Yes feature-maximum-internal-frequency-mhz
feature-speed-grade 8 feature-giga-multiply-accumulates-per-second
feature-differential-i-o-standards-supported SSTL|RSDS|LVDS|LVPECL|HSTL|B-LVDS feature-single-ended-i-o-standards-supported HSTL|SSTL|PCI-X|PCI|LVCMOS|LVTTL
feature-external-memory-interface QDRII+SRAM|DDR2 SDRAM|DDR SDRAM feature-minimum-operating-supply-voltage-v 1.15
feature-maximum-operating-supply-voltage-v 1.25 feature-packaging
feature-rohs feature-rad-hard
feature-pin-count 144 feature-supplier-package EQFP EP
feature-standard-package-name1 QFP feature-cecc-qualified No
feature-esd-protection feature-escc-qualified
feature-military No feature-aec-qualified No
feature-aec-qualified-number feature-auto-motive No
feature-p-pap No feature-eccn-code EAR99
feature-svhc

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

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Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The EP4CE22E22C8N is a Cyclone IV FPGA chip manufactured by Altera. It features 22,320 logic elements, 594 Kbits of RAM, and 66 18x18 multipliers. This chip is commonly used in a variety of applications including industrial automation, telecommunications, and automotive systems due to its flexibility and processing power.
  • Equivalent

    Some equivalent products of EP4CE22E22C8N chip are XC4VLX15-11FFG668C, XC4VLX15-10FF1148C, XCV1000E-8FG456C and XC5VLX30-1FF667C.
  • Features

    The EP4CE22E22C8N is a member of the Cyclone IV E family of FPGAs by Altera. It features 22,320 Logic Elements, 594 Kbits of RAM, 126 18x18-bit multipliers, and 270 variable-precision DSP blocks. It also has support for various interfaces such as PCIe, DDR3, and Gigabit Ethernet.
  • Pinout

    EP4CE22E22C8N is a 484-pin FPGA with 22,320 logic elements, 528 embedded memory blocks, and 356 KB of RAM. It also features 22 multipliers and 8 PLLs. This FPGA can be used for a variety of applications, including digital signal processing, communications, and control systems.
  • Manufacturer

    The manufacturer of EP4CE22E22C8N is Intel Corporation, and it is known as a multinational technology company specializing in semiconductor and platform solutions for the cloud, IoT, and other connected devices. It is one of the largest and most influential technology companies in the world, providing a wide range of products and services for various industries.
  • Application Field

    EP4CE22E22C8N can be used in applications such as industrial automation, telecommunications, automotive, and consumer electronics. It is suitable for applications that require high processing power, low power consumption, and high-speed data processing, making it ideal for a wide range of embedded and programmable logic applications.
  • Package

    The EP4CE22E22C8N chip is a Field-Programmable Gate Array (FPGA) with a Ball Grid Array (BGA) package type. It is available in a 324-pin package form with a size of 19mm x 19mm.

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