Intel 10M08SAU169I7G
MAX® 10 Field Programmable Gate Array (FPGA) IC 130 387072 8000 169-LFBGA
Brands: Intel
Mfr.Part #: 10M08SAU169I7G
Datasheet: 10M08SAU169I7G Datasheet (PDF)
Package/Case: 169-LFBGA
RoHS Status:
Stock Condition: 7346 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To Bom10M08SAU169I7G General Description
MAX® 10 Field Programmable Gate Array (FPGA) IC 130 387072 8000 169-LFBGA
Specifications
Parameter | Value | Parameter | Value |
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Series | MAX® 10 | Package | Tray |
Product Status | Active | Programmabe | Not Verified |
Number of LABs/CLBs | 500 | Number of Logic Elements/Cells | 8000 |
Total RAM Bits | 387072 | Number of I/O | 130 |
Voltage - Supply | 2.85V ~ 3.465V | Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 100°C (TJ) | Package / Case | 169-LFBGA |
Supplier Device Package | 169-UBGA (11x11) |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The 10M08SAU169I7G chip is a programmable logic device manufactured by Intel. It belongs to the MAX 10 family of FPGAs. With 9,600 Logic Elements and various I/O interfaces, this chip provides designers with a versatile solution for implementing their digital designs. It offers low power consumption, high performance, and flexibility, making it suitable for a wide range of applications in industries such as automotive, industrial automation, and consumer electronics.
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Equivalent
The equivalent products of the 10M08SAU169I7G chip are other members of the MAX 10 FPGA family, such as 10M08S, 10M08SC, 10M08SAM, 10M08SCE, and 10M08SAE. These chips offer similar functionalities but may have variations in speed grade, package type, and features. -
Features
The 10M08SAU169I7G is an Intel FPGA (Field-Programmable Gate Array) device with features including 10,000 logic elements, 169 I/O pins, and an Intel MAX 10 FPGA family architecture. -
Pinout
The 10M08SAU169I7G is a Field-Programmable Gate Array (FPGA) with 169 pins. It is part of the Intel MAX 10 series and offers general-purpose I/O, high-speed transceivers, and reconfigurable digital processing capabilities for various applications. -
Manufacturer
The manufacturer of the 10M08SAU169I7G is Intel Corporation. Intel is a multinational technology company that specializes in the development and manufacturing of semiconductor chips and related products for various industries, including computing, communications, and data storage. -
Application Field
The 10M08SAU169I7G is a Field Programmable Gate Array (FPGA) that can be used in a variety of application areas. Some examples include industrial automation, telecommunications, aerospace, defense, medical imaging, automotive, and data centers. -
Package
The package type of the 10M08SAU169I7G chip is UF676. It comes in a form of a 169-ball fine-pitch BGA (Ball Grid Array) package with a size of 10mm x 10mm.
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Minimum order quantity starts from 1pcs.
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365 days quality guarantee for all products