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NXP BLF647

RF Mosfet 28 V 600MHz 14.5dB 120W LDMOST

ISO14001 ISO9001 DUNS

Brands: Ampleon Usa Inc.

Mfr.Part #: BLF647

Datasheet: BLF647 Datasheet (PDF)

Package/Case: SOT-540A

Product Type: Transistors

RoHS Status:

Stock Condition: 3885 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Quick Quote

Please submit RFQ for BLF647 or email to us: Email: [email protected], we will contact you within 12 hours.

BLF647 General Description

RF Mosfet 28 V 600MHz 14.5dB 120W LDMOST

blf647
blf647
blf647

Specifications

Parameter Value Parameter Value
Packaging Tray Part Status Obsolete
Technology LDMOS Configuration Dual, Common Source
Frequency 600MHz Gain 14.5dB
Voltage - Test 28 V Current Rating (Amps) 18A
Power - Output 120W Voltage - Rated 65 V
Mounting Type Chassis Mount Package / Case SOT-540A
Supplier Device Package LDMOST

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • BLF647 chip is an integrated circuit used for power amplification in wireless communication systems, particularly for mobile devices operating in the RF frequency range. It offers high power efficiency and supports multiple wireless technologies, including LTE and 5G. This chip plays a crucial role in improving signal transmission and performance in wireless devices.
  • Equivalent

    The equivalent products of the BLF647 chip include the BDA4108R and the BLC0108MM chips.
  • Features

    The BLF647 is a power transistor with the following features: high gain, low output capacitance, high efficiency, high linearity, high power density, and excellent thermal stability. It is designed for use in linear FM and digital applications within the UHF range.
  • Pinout

    The BLF647 is a power transistor with a pin count of 4. It functions as a VHF power amplifier in mobile radio systems, providing high output power with excellent efficiency, reliability, and linearity.
  • Manufacturer

    The manufacturer of the BLF647 is NXP Semiconductors. NXP is a global semiconductor company that designs and manufactures a wide range of integrated circuits and system solutions for various industries, including automotive, industrial, mobile, and IoT.
  • Application Field

    The BLF647 is a high-power LDMOS transistor typically used in RF power amplifier applications. It is commonly used in mobile communications, radio and television broadcasting, radar systems, and other applications that require high-power amplification at microwave frequencies.
  • Package

    The BLF647 chip is available in a SOT669 (LFPAK56) package type, and its form is surface mount (SMD). The dimensions of the package size are approximately 5.7mm x 6.3mm.

We provide high quality products, thoughtful service and after sale guarantee

  • Product

    We have rich products, can meet your various needs.

  • quantity

    Minimum order quantity starts from 1pcs.

  • shipping

    Lowest international shipping fee starts from $0.00

  • guarantee

    365 days quality guarantee for all products

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