Xilinx XCS30-3PQ240C
Spartan® Field Programmable Gate Array (FPGA) IC 192 18432 1368 240-BFQFP
Brands: AMD Xilinx, Inc
Mfr.Part #: XCS30-3PQ240C
Datasheet: XCS30-3PQ240C Datasheet (PDF)
Package/Case: QFP240
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2227 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXCS30-3PQ240C General Description
Spartan® Field Programmable Gate Array (FPGA) IC 192 18432 1368 240-BFQFP
Features
- It has a capacity of 30,000 logic cells and 1,080Kbits of block RAM.
- It operates at a maximum frequency of 400 MHz.
- It has 240 pins arranged in a plastic quad flat pack (PQFP) package.
- It supports various I/O standards, such as LVCMOS, LVTTL, PCI, and LVDS.
Application
- Digital signal processing
- Video processing
- High-speed communication systems
- Industrial automation
- Medical equipment
- Aerospace and defense systems
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Manufacturer | Xilinx Inc. | Product Category | Embedded - FPGAs (Field Programmable Gate Array) |
Series | SpartanR | Package-Case | 240-BFQFP |
Operating-Temperature | 0°C ~ 85°C (TJ) | Mounting-Type | Surface Mount |
Voltage-Supply | 4.75 V ~ 5.25 V | Supplier-Device-Package | 240-PQFP (32x32) |
Number-of-Gates | 30000 | Number-of-I-O | 192 |
Number-of-LABs-CLBs | 576 | Number-of-Logic-Elements-Cells | 1368 |
Total-RAM-Bits | 18432 | Tags | XCS30-3PQ24, XCS30-3PQ2, XCS30-3PQ, XCS30-3P, XCS30-3, XCS30, XCS3, XCS |
Rohs Code | No | Part Life Cycle Code | Obsolete |
Ihs Manufacturer | XILINX INC | Part Package Code | QFP |
Package Description | PLASTIC, QFP-240 | Pin Count | 240 |
Reach Compliance Code | HTS Code | 8542.39.00.01 | |
Additional Feature | MAXIMUM USABLE GATES 30000 | Clock Frequency-Max | 125 MHz |
Combinatorial Delay of a CLB-Max | 1.6 ns | JESD-30 Code | S-PQFP-G240 |
JESD-609 Code | e0 | Length | 32 mm |
Moisture Sensitivity Level | 3 | Number of CLBs | 576 |
Number of Equivalent Gates | 10000 | Number of Inputs | 196 |
Number of Logic Cells | 576 | Number of Outputs | 196 |
Number of Terminals | 240 | Operating Temperature-Max | 85 °C |
Operating Temperature-Min | Organization | 576 CLBS, 10000 GATES | |
Package Body Material | PLASTIC/EPOXY | Package Code | FQFP |
Package Equivalence Code | QFP240,1.3SQ,20 | Package Shape | SQUARE |
Package Style | FLATPACK, FINE PITCH | Peak Reflow Temperature (Cel) | 225 |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | Qualification Status | Not Qualified |
Seated Height-Max | 4.1 mm | Supply Voltage-Max | 5.25 V |
Supply Voltage-Min | 4.75 V | Supply Voltage-Nom | 5 V |
Surface Mount | YES | Technology | CMOS |
Temperature Grade | OTHER | Terminal Finish | Tin/Lead (Sn85Pb15) |
Terminal Form | GULL WING | Terminal Pitch | 0.5 mm |
Terminal Position | QUAD | Time@Peak Reflow Temperature-Max (s) | 30 |
Width | 32 mm |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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XCS30-3PQ240C is a programmable logic chip manufactured by Xilinx. It belongs to the XCS30 family and comes in a 240-pin PQFP package. The chip offers high performance, low power consumption, and is suitable for various applications such as telecommunications, automotive, and aerospace. It provides designers with flexibility by allowing them to program the chip for specific functions and features.
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Equivalent
The equivalent products of the XCS30-3PQ240C chip are XCS30-3TQ100C, XCS30-3PQ208C, XCS30-3BG256C and XCS30-3TQ144C. -
Features
The XCS30-3PQ240C is a field-programmable gate array (FPGA) with 30,000 logic cells and is housed in a 240-pin quad flat pack (QFP) package. It features high-performance, reconfigurable logic and embedded system capabilities, making it suitable for various applications that require flexibility and customization. -
Pinout
The XCS30-3PQ240C is an electronic component with a pin count of 240. Its main function is to serve as a field-programmable gate array (FPGA) for various digital logic applications. It supports up to 26,880 logic cells and provides programmable interconnect resources, making it versatile for system integration. -
Manufacturer
The XCS30-3PQ240C is manufactured by Xilinx, Inc. It is an American technology company specializing in the development and production of programmable logic devices, including field-programmable gate arrays (FPGAs). -
Application Field
The XCS30-3PQ240C is a field-programmable gate array (FPGA) that can be used in various application areas such as telecommunications, automotive, industrial automation, and aerospace. It is commonly used for high-performance computing tasks, signal processing, and system integration due to its flexibility and reconfigurability. -
Package
The XCS30-3PQ240C chip comes in a plastic quad flat pack (PQFP) package. It has a 240-pin count and measures 14 x 14 mm in size.
Datasheet PDF
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