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Xilinx XCS30-3PQ240C

Spartan® Field Programmable Gate Array (FPGA) IC 192 18432 1368 240-BFQFP

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XCS30-3PQ240C

Datasheet: XCS30-3PQ240C Datasheet (PDF)

Package/Case: QFP240

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2227 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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XCS30-3PQ240C General Description

Spartan® Field Programmable Gate Array (FPGA) IC 192 18432 1368 240-BFQFP

xcs30-3pq240c

Features

  • It has a capacity of 30,000 logic cells and 1,080Kbits of block RAM.
  • It operates at a maximum frequency of 400 MHz.
  • It has 240 pins arranged in a plastic quad flat pack (PQFP) package.
  • It supports various I/O standards, such as LVCMOS, LVTTL, PCI, and LVDS.

Application

  • Digital signal processing
  • Video processing
  • High-speed communication systems
  • Industrial automation
  • Medical equipment
  • Aerospace and defense systems
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Specifications

Parameter Value Parameter Value
Manufacturer Xilinx Inc. Product Category Embedded - FPGAs (Field Programmable Gate Array)
Series SpartanR Package-Case 240-BFQFP
Operating-Temperature 0°C ~ 85°C (TJ) Mounting-Type Surface Mount
Voltage-Supply 4.75 V ~ 5.25 V Supplier-Device-Package 240-PQFP (32x32)
Number-of-Gates 30000 Number-of-I-O 192
Number-of-LABs-CLBs 576 Number-of-Logic-Elements-Cells 1368
Total-RAM-Bits 18432 Tags XCS30-3PQ24, XCS30-3PQ2, XCS30-3PQ, XCS30-3P, XCS30-3, XCS30, XCS3, XCS
Rohs Code No Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC Part Package Code QFP
Package Description PLASTIC, QFP-240 Pin Count 240
Reach Compliance Code HTS Code 8542.39.00.01
Additional Feature MAXIMUM USABLE GATES 30000 Clock Frequency-Max 125 MHz
Combinatorial Delay of a CLB-Max 1.6 ns JESD-30 Code S-PQFP-G240
JESD-609 Code e0 Length 32 mm
Moisture Sensitivity Level 3 Number of CLBs 576
Number of Equivalent Gates 10000 Number of Inputs 196
Number of Logic Cells 576 Number of Outputs 196
Number of Terminals 240 Operating Temperature-Max 85 °C
Operating Temperature-Min Organization 576 CLBS, 10000 GATES
Package Body Material PLASTIC/EPOXY Package Code FQFP
Package Equivalence Code QFP240,1.3SQ,20 Package Shape SQUARE
Package Style FLATPACK, FINE PITCH Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY Qualification Status Not Qualified
Seated Height-Max 4.1 mm Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V Supply Voltage-Nom 5 V
Surface Mount YES Technology CMOS
Temperature Grade OTHER Terminal Finish Tin/Lead (Sn85Pb15)
Terminal Form GULL WING Terminal Pitch 0.5 mm
Terminal Position QUAD Time@Peak Reflow Temperature-Max (s) 30
Width 32 mm

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • XCS30-3PQ240C is a programmable logic chip manufactured by Xilinx. It belongs to the XCS30 family and comes in a 240-pin PQFP package. The chip offers high performance, low power consumption, and is suitable for various applications such as telecommunications, automotive, and aerospace. It provides designers with flexibility by allowing them to program the chip for specific functions and features.
  • Equivalent

    The equivalent products of the XCS30-3PQ240C chip are XCS30-3TQ100C, XCS30-3PQ208C, XCS30-3BG256C and XCS30-3TQ144C.
  • Features

    The XCS30-3PQ240C is a field-programmable gate array (FPGA) with 30,000 logic cells and is housed in a 240-pin quad flat pack (QFP) package. It features high-performance, reconfigurable logic and embedded system capabilities, making it suitable for various applications that require flexibility and customization.
  • Pinout

    The XCS30-3PQ240C is an electronic component with a pin count of 240. Its main function is to serve as a field-programmable gate array (FPGA) for various digital logic applications. It supports up to 26,880 logic cells and provides programmable interconnect resources, making it versatile for system integration.
  • Manufacturer

    The XCS30-3PQ240C is manufactured by Xilinx, Inc. It is an American technology company specializing in the development and production of programmable logic devices, including field-programmable gate arrays (FPGAs).
  • Application Field

    The XCS30-3PQ240C is a field-programmable gate array (FPGA) that can be used in various application areas such as telecommunications, automotive, industrial automation, and aerospace. It is commonly used for high-performance computing tasks, signal processing, and system integration due to its flexibility and reconfigurability.
  • Package

    The XCS30-3PQ240C chip comes in a plastic quad flat pack (PQFP) package. It has a 240-pin count and measures 14 x 14 mm in size.

Datasheet PDF

Preliminary Specification XCS30-3PQ240C PDF Download

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