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Xilinx XCS30-3PQ208C

Spartan® Field Programmable Gate Array (FPGA) IC 169 18432 1368 208-BFQFP

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XCS30-3PQ208C

Datasheet: XCS30-3PQ208C Datasheet (PDF)

Package/Case: 208-BFQFP

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3460 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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XCS30-3PQ208C General Description

Spartan® Field Programmable Gate Array (FPGA) IC 169 18432 1368 208-BFQFP

xcs30-3pq208c

Features

  • It belongs to the Spartan-3 family of FPGAs.
  • It has 30,000 logic cells and 1,296 kilobits of block RAM.
  • It has 139 user I/Os, 8 digital clock managers (DCMs), and 4 phase-locked loops (PLLs).
  • It supports a variety of configuration modes, including master serial, slave serial, SelectMAP, and JTAG.
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Specifications

Parameter Value Parameter Value
Case/Package PQFP Mount Surface Mount
Number of Pins 208 Max Operating Temperature 85 °C
Min Operating Temperature 0 °C Number of Gates 30000
Number of I/Os 169 Number of Logic Blocks (LABs) 576
Number of Logic Elements/Cells 1368 Packaging Bulk
RAM Size 2.3 kB

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XCS30-3PQ208C chip is a programmable logic device (PLD) manufactured by Xilinx. It offers 30,000 system gates, making it capable of handling a range of complex digital logic functions. The chip is based on the x22C5V5XC series and features a PQ208 package. It can be programmed using Xilinx's development tools and is commonly used in applications requiring high-speed processing, such as telecommunications, industrial automation, and automotive industries.
  • Equivalent

    Equivalent products of the XCS30-3PQ208C chip include XCS30XL-3PQ208C, XCS30XL-4PQ208C, XCS30XLTQ144C, XCS30XL-5PQG208C, XCS30-4PQ208C, and XCS30XL-4TQG144C.
  • Features

    The XCS30-3PQ208C features a Field Programmable Gate Array (FPGA) with 30,000 System Gates, 208-pin Plastic Quad Flat Pack (PQFP) package, and three Power Terminals.
  • Pinout

    The XCS30-3PQ208C is an integrated circuit with 208 pins. It is a CoolRunner XPLA3 CPLD (Complex Programmable Logic Device) designed for high-performance, low-power applications. The specific pin functions and their descriptions can be found in the datasheet provided by the manufacturer.
  • Manufacturer

    XCS30-3PQ208C is manufactured by Xilinx, which is a leading American semiconductor company specializing in programmable logic devices. The company designs and develops field-programmable gate arrays (FPGAs) and related technologies.
  • Application Field

    The XCS30-3PQ208C is a programmable logic device with 600,000 system gates. It is commonly used in various industrial applications such as robotics, automation, and industrial control systems. It can also be applied in aerospace and defense industries for various mission-critical systems. Additionally, it is suitable for applications in the telecommunications and transportation sectors.
  • Package

    The XCS30-3PQ208C chip is in a PQFP (Plastic Quad Flat Pack) package type. It has a 208-pin configuration, meaning it has 208 pins on its body. The form of the chip is a rectangular shape with a length and width of approximately 0.823 inches (20.9 mm).

Datasheet PDF

Preliminary Specification XCS30-3PQ208C PDF Download

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