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Xilinx XCKU115-2FLVA1517I

Product Description Demo for Development.

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XCKU115-2FLVA1517I

Datasheet: XCKU115-2FLVA1517I Datasheet (PDF)

Package/Case: FBGA-1517

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2763 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Please submit RFQ for XCKU115-2FLVA1517I or email to us: Email: [email protected], we will contact you within 12 hours.

XCKU115-2FLVA1517I General Description

Fpga, Kintex Ultrascale, Fcbga-1517; No. Of Logic Blocks:663360; No. Of Macrocells:1451100; Fpga Family:Kintex Ultrascale Series; Logic Case Style:Fcbga; No. Of Pins:1517Pins; No. Of Speed Grades:2; Total Ram Bits:77722Kbit; No. Of Rohs Compliant: Yes |Amd Xilinx XCKU115-2FLVA1517I

xcku115-2flva1517i

Features

  • It is based on the UltraScale+ architecture, which is designed to deliver high performance and low power consumption.
  • It has a maximum capacity of 1.4 million logic cells, which allows for complex designs and applications.
  • It has a maximum operating frequency of 1.2 GHz, which enables fast processing of data and signals.
  • It has multiple built-in connectivity options, including high-speed transceivers and Ethernet interfaces.
  • It supports multiple programming modes, including partial reconfiguration, which allows for flexible and dynamic system configurations.

Application

  • High-performance computing (HPC) applications, such as data centers, scientific computing, and financial modeling.
  • Video and image processing applications, including real-time video encoding and decoding, and high-resolution image processing.
  • Aerospace and defense applications, such as radar processing, signal intelligence, and electronic warfare.
  • Networking and communication applications, including routers, switches, and network security appliances.
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Specifications

Parameter Value Parameter Value
Pin Count 1517 Package Category BGA
Released Date Apr 16, 2021

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XCKU115-2FLVA1517I chip is a field-programmable gate array (FPGA) from Xilinx. It belongs to the Kintex UltraScale+ family and is designed for high-performance applications. The chip offers advanced processing capabilities, abundant logic resources, and high-speed I/Os. It provides flexibility in system design and integration, enabling users to customize and optimize their applications efficiently.
  • Equivalent

    There are no direct equivalent products to the XCKU115-2FLVA1517I chip. However, other members of the Xilinx Kintex UltraScale+ FPGA family may offer similar features and capabilities, such as the XCKU060-2FLVA1517I, XCKU095-2FLVA1517I, or XCKU160-2FLVA1517I chips.
  • Features

    The XCKU115-2FLVA1517I is a field-programmable gate array (FPGA) with 1.97 million logic cells, 16.3 Mb of embedded memory, and 78 transceivers supporting various high-speed protocols. It operates at a maximum speed of 862.5 MHz, with extensive I/O capabilities including PCIe and Ethernet interfaces, making it suitable for high-performance applications in industries like telecommunications, aerospace, and defense.
  • Pinout

    The XCKU115-2FLVA1517I has 1517 pins and is an integrated circuit (IC) of the Xilinx Kintex Ultrascale+ family. It functions as an FPGA (Field-Programmable Gate Array) with high-performance capabilities, suitable for various applications requiring programmable logic.
  • Manufacturer

    The manufacturer of the XCKU115-2FLVA1517I is Xilinx Inc. Xilinx is a leading American technology company that specializes in designing and manufacturing programmable logic devices and associated technologies. They provide a range of products and solutions for the semiconductor and electronics industry, particularly in the field of FPGA (Field-Programmable Gate Array) and SoC (System-on-a-Chip) technologies.
  • Application Field

    The XCKU115-2FLVA1517I is a field-programmable gate array (FPGA) primarily used in high-performance computing, data centers, and network processing applications. It is suitable for applications such as data analytics, machine learning, artificial intelligence (AI), and digital signal processing (DSP).
  • Package

    The XCKU115-2FLVA1517I chip is a Field Programmable Gate Array (FPGA). It comes in a flip chip BGA (Ball Grid Array) package with a size of 35x35 mm.

Datasheet PDF

Preliminary Specification XCKU115-2FLVA1517I PDF Download

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