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Xilinx XC7Z010-1CLG225I

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Artix™-7 FPGA, 28K Logic Cells 667MHz 225-CSPBGA (13x13)

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC7Z010-1CLG225I

Datasheet: XC7Z010-1CLG225I Datasheet (PDF)

Package/Case: CSBGA-225

Product Type: System On Chip (SoC)

RoHS Status:

Stock Condition: 2454 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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XC7Z010-1CLG225I General Description

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Artix™-7 FPGA, 28K Logic Cells 667MHz 225-CSPBGA (13x13)

Features

IC SOC CORTEX-A9 ARTIX-7 225BGAIC SOC CORTEX-A9 ARTIX-7 225BGA
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Case/Package BGA Contact Plating Copper, Silver, Tin
Number of Pins 225 Core Architecture ARM
Data Bus Width 32 b Frequency 667 MHz
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB Max Frequency 667 MHz
Max Operating Temperature 100 °C Min Operating Temperature -40 °C
Number of I/Os 86 Operating Supply Voltage 1 V
Peripherals DMA

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XC7Z010-1CLG225I is a low-cost, low-power field-programmable gate array (FPGA) from Xilinx. It features a dual-core ARM Cortex-A9 processor along with programmable logic for customizable digital circuit design. With a compact form factor and a wide range of applications, this chip is suitable for embedded systems and IoT devices.
  • Equivalent

    The equivalent products of XC7Z010-1CLG225I chip are Xilinx Zynq-7000 series chips such as XC7Z014S-1CLG225C, XC7Z010-1CLG400C, and XC7Z010-1CLG225C. These chips have similar features and capabilities as the XC7Z010-1CLG225I chip.
  • Features

    The XC7Z010-1CLG225I is a single-core Zynq-7000 SoC with 28k logic cells, 17,600 LUTs, 2.5 MB of RAM, and 5 PWM outputs. It also features an ARM Cortex-A9 processor running at up to 667 MHz, a 10/100/1000 Ethernet MAC, and multiple connectivity options including SPI, I2C, UART, and GPIO.
  • Pinout

    The XC7Z010-1CLG225I is a Zynq-7000 series FPGA with 225 pins. It is designed for low-power applications and features a dual-core ARM Cortex-A9 processor, programmable logic, and various peripherals for flexible system integration.
  • Manufacturer

    The XC7Z010-1CLG225I is manufactured by Xilinx, Inc. Xilinx is a leading American technology company that specializes in the design and development of programmable devices and associated technologies, such as field-programmable gate arrays (FPGAs) and adaptive compute accelerators. Xilinx's products are used in a wide range of industries, including aerospace, automotive, telecommunications, and data processing.
  • Application Field

    XC7Z010-1CLG225I is suitable for a wide range of applications including industrial automation, automotive, telecommunications, and embedded computing. It can be used in applications that require high-performance processing, programmable logic, and integrated connectivity. The device is particularly well-suited for IoT, robotics, and machine vision applications.
  • Package

    The XC7Z010-1CLG225I chip is a programmable System-on-Chip (SoC) in a package type of 225-ball chip scale BGA (CLG225), with a form factor of 13x13 mm and a size of 1000 mm².

Datasheet PDF

Preliminary Specification XC7Z010-1CLG225I PDF Download

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