Xilinx XC7VX690T-2FFG1157I

Part points

• The XC7VX690T-2FFG1157I is a high-performance field-programmable gate array (FPGA) chip designed by Xilinx. It belongs to the Virtex-7 family and offers a large number of logic cells, high-speed transceivers, and a wide range of configurable resources. It is commonly used in applications that require high processing capabilities, such as telecommunications, aerospace, and data center infrastructure.

• Equivalent

  Some equivalent products of the XC7VX690T-2FFG1157I chip include the XC7VX690T-1FFG1157I, XC7VX690T-2FFG1925I, and XC7VX690T-1FFG1925I chips. These chips are part of the Xilinx Virtex-7 family, offering similar functionality and performance.

• Features

  The XC7VX690T-2FFG1157I is a high-end FPGA from Xilinx. It offers a large logic capacity, high-performance I/Os, and advanced features like DSP slices, memory interfaces, and Ethernet interfaces. It is capable of handling complex computations and communication tasks in applications such as aerospace, automotive, and telecommunications.

• Pinout

  The XC7VX690T-2FFG1157I is a Field-Programmable Gate Array (FPGA) with a pin count of 1,157. It is part of the Virtex-7 family and has various functions, including programmable logic, memory, and digital signal processing capabilities.

• Manufacturer

  XC7VX690T-2FFG1157I is manufactured by Xilinx Inc, an American technology company. They specialize in designing and producing programmable logic devices and related development software. Xilinx is known for their field-programmable gate array (FPGA) and programmable system-on-chip (SoC) solutions, catering to various industries including aerospace, automotive, telecommunications, and consumer electronics.

• Application Field

  The XC7VX690T-2FFG1157I is an FPGA (Field-Programmable Gate Array) designed by Xilinx. It is commonly used in high-performance computing, aerospace and defense, telecommunications, and video processing applications. Its advanced features and capabilities make it suitable for various industries that require high processing power, speed, and flexibility in their systems.

• Package

  The XC7VX690T-2FFG1157I chip is in a package type known as Flip Chip Fine Pitch Ball Grid Array (FFG). Its form is integrated into a rectangular shape, commonly used for microchips. The size is 1157 square millimeters.