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Xilinx XC7K325T-2FFG676I
KINTEX-7 XC7K325T-2FFG676I FPGA XILINX 400 I/O FCBGA-676
Brands: Amd
Mfr.Part #: XC7K325T-2FFG676I
Datasheet: XC7K325T-2FFG676I Datasheet (PDF)
Package/Case: FCBGA-676
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2651 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC7K325T-2FFG676I General Description
The XC7K325T-2FFG676I is a part of Xilinx's Kintex-7 FPGA family, specifically the -2 speed grade. It features a total of 324,720 logic cells and 12,700 slices, making it suitable for a wide range of applications from communications and data centers to video processing and more. The device also includes 1,760 KB of block RAM, as well as 1,080 DSP slices for high-performance signal processing tasks.In terms of I/O, the XC7K325T-2FFG676I offers a total of 352 I/O pins, as well as 32 GTY transceivers which can support data rates of up to 12.5 Gb/s. This makes it well-suited for demanding high-speed serial communication applications.The FPGA comes in a 676-pin Fine-Pitch Ball Grid Array (FFG676) package, providing a compact form factor that is ideal for space-constrained designs. The device operates at a maximum speed of 800 MHz, providing fast and reliable performance for demanding applications.
Features
- Advanced 28 nm technology
- 325,000 logic cells
- 16.8 Mb of block RAM
- 1,240 available DSP slices
- Integrated high-speed connectivity interfaces
- Support for PCI Express, Gigabit Ethernet, USB, and more
- 676-pin FBGA package
- Ideal for high-performance applications
Application
- Telecommunications infrastructure
- Data center networking
- Wireless communications
- Video processing and broadcasting
- Medical imaging
- Industrial automation
- Aerospace and defense
- Internet of Things (IoT)
- Automotive industry
- High-performance computing
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Product Category | FPGA - Field Programmable Gate Array | RoHS | Details |
| Series | XC7K325T | Number of Logic Elements | 326080 LE |
| Adaptive Logic Modules - ALMs | 50950 ALM | Embedded Memory | 15.64 Mbit |
| Number of I/Os | 400 I/O | Supply Voltage - Min | 970 mV |
| Supply Voltage - Max | 1.03 V | Minimum Operating Temperature | - 40 C |
| Maximum Operating Temperature | + 100 C | Data Rate | 12.5 Gb/s |
| Number of Transceivers | 8 Transceiver | Mounting Style | SMD/SMT |
| Package / Case | FCBGA-676 | Brand | AMD / Xilinx |
| Distributed RAM | 4000 kbit | Embedded Block RAM - EBR | 16020 kbit |
| Maximum Operating Frequency | 640 MHz | Moisture Sensitive | Yes |
| Number of Logic Array Blocks - LABs | 25475 LAB | Operating Supply Voltage | 1.2 V to 3.3 V |
| Product Type | FPGA - Field Programmable Gate Array | Factory Pack Quantity | 1 |
| Subcategory | Programmable Logic ICs | Tradename | Kintex |
| Unit Weight | 8.570603 oz |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC7K325T-2FFG676I component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : XC7K325T-2FBG676I
Brands :
Package : FCBGA676
Description : FPGA, Kintex-7, MMCM, PLL, 250 I/O's, 710 MHz, 326080 Cells, 970 mV to 1.03 V, FCBGA-676
Part Number : XC7K325T-1FFG676I
Brands :
Package : BGA-676
Description : FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V
Part Number : XC7K325T-2FBG900I
Brands :
Package : BGA900
Description : FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V 900-Pin Lidless FCBGA Tray
Part Number : XC7K325T-1FBG900I
Brands :
Package : 900-BBGA, FCBGA
Description : FPGA, Kintex-7, MMCM, PLL, 350 I/O's, 625 MHz, 326080 Cells, 970 mV to 1.03 V, FCBGA-900
Part points
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The XC7K325T-2FFG676I is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It belongs to the Kintex-7 family and offers a combination of high performance, low power consumption, and flexibility. The "2FFG676I" part number refers to the package type and pin count of the chip. It is commonly used in various applications such as aerospace, automotive, and telecommunications, where rapid and efficient processing is required.
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Features
The XC7K325T-2FFG676I is a field-programmable gate array (FPGA) with 325,000 logic cells, characterized by a maximum capacity to implement up to a 600 MHz clock frequency. It features advanced DSP capabilities, high-speed serial connectivity, and 585 user I/Os, making it suitable for a wide range of applications demanding high performance and flexibility. -
Pinout
The XC7K325T-2FFG676I is a FPGA device from Xilinx with a pin count of 676 and comes in a Flip-Chip Fine-pitch Ball Grid Array (FFG676) package. The device is part of the Kintex-7 family and offers various features and functions for programmable logic applications. -
Manufacturer
The manufacturer of the XC7K325T-2FFG676I is Xilinx Inc. Xilinx is a leading American technology company specializing in the design and manufacture of programmable logic devices, software development tools, and intellectual property cores. They are known for their field-programmable gate arrays (FPGAs) and programmable system-on-chips (SoCs). -
Application Field
The XC7K325T-2FFG676I is a field-programmable gate array (FPGA) that can be used in a wide range of applications, including telecommunications, automotive electronics, industrial control systems, aerospace, and defense. It offers high logic capacity, advanced DSP capabilities, and high-speed serial connectivity, making it suitable for demanding and complex designs in various industries. -
Package
The XC7K325T-2FFG676I chip is available in a Flip-Chip BGA (Ball Grid Array) package. The form factor of this chip is 676-pin BGA, and it measures 27mm x 27mm in size.
Datasheet PDF
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