Xilinx XC7K325T-2FBG900I
Kintex®-7 Field Programmable Gate Array (FPGA) IC 500 16404480 326080 900-BBGA, FCBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC7K325T-2FBG900I
Datasheet: XC7K325T-2FBG900I Datasheet (PDF)
Package/Case: BGA900
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 3866 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC7K325T-2FBG900I General Description
Kintex®-7 Field Programmable Gate Array (FPGA) IC 500 16404480 326080 900-BBGA, FCBGA
Features
IC FPGA 500 I/O 900FCBGAIC FPGA 500 I/O 900FCBGASpecifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Pbfree Code | Yes | Rohs Code | Yes |
Part Life Cycle Code | Transferred | Ihs Manufacturer | XILINX INC |
Part Package Code | BGA | Pin Count | 900 |
Reach Compliance Code | compliant | ECCN Code | 3A991.D |
HTS Code | 8542.39.00.01 | Samacsys Manufacturer | XILINX |
Clock Frequency-Max | 1818 MHz | Combinatorial Delay of a CLB-Max | 0.61 ns |
JESD-30 Code | S-PBGA-B900 | JESD-609 Code | e1 |
Length | 31 mm | Moisture Sensitivity Level | 4 |
Number of CLBs | 25475 | Number of Inputs | 500 |
Number of Logic Cells | 326080 | Number of Outputs | 500 |
Number of Terminals | 900 | Operating Temperature-Max | 100 °C |
Operating Temperature-Min | -40 °C | Organization | 25475 CLBS |
Package Body Material | PLASTIC/EPOXY | Package Code | BGA |
Package Equivalence Code | BGA900,30X30,40 | Package Shape | SQUARE |
Package Style | GRID ARRAY | Peak Reflow Temperature (Cel) | 245 |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | Qualification Status | Not Qualified |
Seated Height-Max | 2.54 mm | Supply Voltage-Max | 1.03 V |
Supply Voltage-Min | 0.97 V | Supply Voltage-Nom | 1 V |
Surface Mount | YES | Technology | CMOS |
Temperature Grade | INDUSTRIAL | Terminal Finish | TIN SILVER COPPER |
Terminal Form | BALL | Terminal Pitch | 1 mm |
Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | 30 |
Width | 31 mm |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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XC7K325T-2FBG900I is a chip from the Kintex-7 family of Field-Programmable Gate Arrays (FPGAs) manufactured by Xilinx. It has 325,000 logic cells and can operate at a maximum frequency of 400MHz. The chip is built on a 28nm process and features various I/O interfaces, including Ethernet and PCIe. It offers high-performance and flexibility for various applications, such as telecommunications, industrial automation, and aerospace.
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Equivalent
There are no direct equivalents to the XC7K325T-2FBG900I chip. However, some similar alternatives from Xilinx's Kintex-7 FPGA family include XC7K325T-2FFG900I, XC7K355T-2FBG900I, and XC7K355T-2FFG900I. It is important to consider specific requirements and features when selecting an alternative FPGA chip. -
Features
The XC7K325T-2FBG900I is a field-programmable gate array (FPGA) with a 325,000 logic cell capacity. It operates at a speed of up to 550 MHz and has a 900-ball grid array (BGA) package. Features include high-speed serial connectivity, DDR3 memory interface, and multiple clock management resources. -
Pinout
The XC7K325T-2FBG900I is a Field Programmable Gate Array (FPGA) with 900 Ball Grid Array (BGA) packaging. It has 325,000 logic cells and 588 user I/O pins. The specific functions of the pins can vary depending on the design and programming. -
Manufacturer
The manufacturer of the XC7K325T-2FBG900I is Xilinx Inc. It is an American technology company specializing in the development and production of programmable logic devices and associated software. Xilinx is known for its field-programmable gate arrays (FPGAs) and programmable SoCs, offering solutions for various industries, including automotive, aerospace, telecommunications, and data centers. -
Application Field
The XC7K325T-2FBG900I is a Xilinx FPGA with application areas in industries like aerospace and defense, automotive, telecommunications, and data center. It can be used for tasks such as real-time processing, data acceleration, advanced driver assistance systems, high-performance computing, and network infrastructure. -
Package
The XC7K325T-2FBG900I chip is in a BGA (Ball Grid Array) package type, with a 900-ball grid array. Its form factor is FBG (Fine-pitch BGA) and its size is 29mm x 29mm.
Datasheet PDF
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