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Xilinx XC7K325T-2FBG676C

FPGA - Field Programmable Gate Array XC7K325T-2FBG676C

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC7K325T-2FBG676C

Datasheet: XC7K325T-2FBG676C Datasheet (PDF)

Package/Case: FCBGA-676

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3099 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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XC7K325T-2FBG676C General Description

Fpga, Kintex-7 , 250 I/O, Fcbga-676; No. Of Logic Blocks:50950; No. Of Macrocells:326080; Fpga Family:Kintex-7; Logic Case Style:Fcbga; No. Of Pins:676Pins; No. Of Speed Grades:2; Total Ram Bits:16020Kbit; No. Of I/O S:250I/O S; Rohs Compliant: Yes |Amd Xilinx XC7K325T-2FBG676C

Features

IC FPGA 400 I/O 676FCBGAIC FPGA 400 I/O 676FCBGA
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Pin Count 676 Package Category BGA
Released Date Jan 18, 2021

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

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Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • XC7K325T-2FBG676C is a chip from the Xilinx 7 series FPGA family. It features a high capacity of 325,000 logic cells and a speed grade of 2. The chip is packaged in a 676-ball grid array (BGA) form factor and offers advanced features for a range of applications including aerospace, defense, and telecommunications.
  • Equivalent

    The equivalent products of the XC7K325T-2FBG676C chip are XC7K325T-2FFG900C, XC7K325T-2FFG900I, XC7K325T-2FFG900M, XC7K325T-2FBG900C, XC7K325T-2FBG900I, and XC7K325T-2FBG900M.
  • Features

    The XC7K325T-2FBG676C is a field-programmable gate array (FPGA) with a 325,000 logic cell count. It operates at a maximum frequency of 725MHz and supports a wide range of I/O standards. It has 78,480 flip-flops and 62,784 6-input LUTs. The FPGA also features integrated block RAM and DSP slices for advanced signal processing applications.
  • Pinout

    The XC7K325T-2FBG676C is a FPGA device with a pin count of 676. It is part of the Xilinx Kintex-7 family and can be used for various applications, such as aerospace, defense, and wireline communication.
  • Manufacturer

    The manufacturer of the XC7K325T-2FBG676C is Xilinx Inc. Xilinx is a technology company that specializes in the development and manufacture of programmable logic devices, including field-programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs). They provide solutions for a wide range of industries, including aerospace, automotive, industrial, and telecommunications.
  • Application Field

    The XC7K325T-2FBG676C is an FPGA (Field-Programmable Gate Array) with application areas in various fields such as telecommunications, automotive, aerospace, and industrial automation. Its high-performance capabilities, configurable logic, and high-speed serial connectivity make it suitable for applications requiring complex digital signal processing, data processing, and real-time control.
  • Package

    The XC7K325T-2FBG676C chip has a package type of FBG676, a form factor of 676-ball BGA, and a size of 27x27 mm.

Datasheet PDF

Preliminary Specification XC7K325T-2FBG676C PDF Download

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