Xilinx XC7K325T-2FBG676C
FPGA - Field Programmable Gate Array XC7K325T-2FBG676C
Brands: AMD Xilinx, Inc
Mfr.Part #: XC7K325T-2FBG676C
Datasheet: XC7K325T-2FBG676C Datasheet (PDF)
Package/Case: FCBGA-676
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 3099 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC7K325T-2FBG676C General Description
Fpga, Kintex-7 , 250 I/O, Fcbga-676; No. Of Logic Blocks:50950; No. Of Macrocells:326080; Fpga Family:Kintex-7; Logic Case Style:Fcbga; No. Of Pins:676Pins; No. Of Speed Grades:2; Total Ram Bits:16020Kbit; No. Of I/O S:250I/O S; Rohs Compliant: Yes |Amd Xilinx XC7K325T-2FBG676C
Features
IC FPGA 400 I/O 676FCBGAIC FPGA 400 I/O 676FCBGASpecifications
Parameter | Value | Parameter | Value |
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Pin Count | 676 | Package Category | BGA |
Released Date | Jan 18, 2021 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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XC7K325T-2FBG676C is a chip from the Xilinx 7 series FPGA family. It features a high capacity of 325,000 logic cells and a speed grade of 2. The chip is packaged in a 676-ball grid array (BGA) form factor and offers advanced features for a range of applications including aerospace, defense, and telecommunications.
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Equivalent
The equivalent products of the XC7K325T-2FBG676C chip are XC7K325T-2FFG900C, XC7K325T-2FFG900I, XC7K325T-2FFG900M, XC7K325T-2FBG900C, XC7K325T-2FBG900I, and XC7K325T-2FBG900M. -
Features
The XC7K325T-2FBG676C is a field-programmable gate array (FPGA) with a 325,000 logic cell count. It operates at a maximum frequency of 725MHz and supports a wide range of I/O standards. It has 78,480 flip-flops and 62,784 6-input LUTs. The FPGA also features integrated block RAM and DSP slices for advanced signal processing applications. -
Pinout
The XC7K325T-2FBG676C is a FPGA device with a pin count of 676. It is part of the Xilinx Kintex-7 family and can be used for various applications, such as aerospace, defense, and wireline communication. -
Manufacturer
The manufacturer of the XC7K325T-2FBG676C is Xilinx Inc. Xilinx is a technology company that specializes in the development and manufacture of programmable logic devices, including field-programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs). They provide solutions for a wide range of industries, including aerospace, automotive, industrial, and telecommunications. -
Application Field
The XC7K325T-2FBG676C is an FPGA (Field-Programmable Gate Array) with application areas in various fields such as telecommunications, automotive, aerospace, and industrial automation. Its high-performance capabilities, configurable logic, and high-speed serial connectivity make it suitable for applications requiring complex digital signal processing, data processing, and real-time control. -
Package
The XC7K325T-2FBG676C chip has a package type of FBG676, a form factor of 676-ball BGA, and a size of 27x27 mm.
Datasheet PDF
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