Xilinx XC7A35T-2CSG325C

Part points

• The XC7A35T-2CSG325C chip is a member of the Xilinx 7 series FPGAs (Field-Programmable Gate Arrays). It belongs to the Artix-7 family and features a maximum capacity of 33,280 logic cells and 1,800 Kbits of block RAM. The chip utilizes a 28nm process and is designed for applications requiring high-performance and low power consumption.

• Equivalent

  Some equivalent products of the XC7A35T-2CSG325C chip include the XC7A35T-1CSG325C, XC7A35T-3CSG325C, and XC7A35T-4CSG325C. They have similar specifications and functionalities but may have slight differences in features or performance.

• Features

  The XC7A35T-2CSG325C is a FPGA (Field-Programmable Gate Array) with 33,280 logic cells and 1,800 Kbits of block RAM. It operates at a maximum frequency of 800 MHz, has 53,200 flip-flops, and supports various I/O standards. It also includes DSP slices, gigabit transceivers, and integrated system-level features, making it suitable for a wide range of applications.

• Pinout

  The XC7A35T-2CSG325C is an FPGA (Field-Programmable Gate Array) with a 325-pin CSBGA (Chip-Scale Ball Grid Array) package. It is part of the Xilinx Artix-7 family and features 35k logic cells, 900kbits of block RAM, and 90 DSP slices. It can be used for various functions including general-purpose digital logic, signal processing, and control applications.

• Manufacturer

  The XC7A35T-2CSG325C is manufactured by Xilinx. Xilinx is an American technology company that specializes in the development and production of field-programmable gate arrays (FPGAs), programmable logic devices (PLDs), and related software tools.

• Application Field

  The XC7A35T-2CSG325C is a Field Programmable Gate Array (FPGA) device developed by Xilinx. It belongs to the Artix-7 family and has a capacity of 33,280 logic cells. This FPGA is commonly used in a variety of applications, including embedded processing, industrial automation, medical imaging, and automotive infotainment systems.

• Package

  The XC7A35T-2CSG325C chip is available in a very thin and small form known as the 325 chip-scale grid array (CSG325) package type. This chip has 325 solder balls on the bottom side and a size of 13 x 13 mm, making it compact and suitable for space-constrained applications.