Altera EP3C10E144I7N
Versatile field programmable gate array technology
Brands: Altera
Mfr.Part #: EP3C10E144I7N
Datasheet: EP3C10E144I7N Datasheet (PDF)
Package/Case: EQFP-144
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 3369 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomEP3C10E144I7N General Description
EP3C10E144I7N is a field-programmable gate array (FPGA) chip manufactured by Intel Corporation.
Specification
Maximum Operating Temperature: +100°C
Operating Supply Voltage: 1.15 V to 1.25 V
Number of Logic Elements: 10320 LE
Number of I/Os: 94 I/O
Number of Logic Array Blocks - LABs: 645 LAB
Packaging: Tray
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Manufacturer: Intel
Minimum Operating Temperature: -40°C
Adaptive Logic Modules - ALMs: 645 ALM
Maximum Operating Frequency: 315 MHz
Total Memory: 423936 bit
Package / Case: EQFP-144
Embedded Memory: 414 kbit
Supply Voltage - Max: 1.25 V
Supply Voltage - Min: 1.15 V
Product Category: FPGA - Field Programmable Gate Array
Features
- It has a maximum of 10,080 logic elements (LEs) which are basic building blocks of FPGA.
- It has 588 kilobits (Kb) of embedded memory, which can be used for data storage.
- It supports various I/O standards such as LVCMOS, LVTTL, and SSTL, making it compatible with a wide range of interfaces.
- It has dedicated digital signal processing (DSP) blocks, which can be used for implementing complex mathematical operations efficiently.
- It has built-in configuration memory, which can be used to store the FPGA design during power-up.
Application
- EP3C10E144I7N FPGA can be used in a wide range of applications including digital signal processing, telecommunications, industrial automation, embedded systems, video processing, and motor control.
- It can be used for prototyping and development of custom digital circuits, as it allows for flexible reconfiguration of its logic and routing resources.
- EP3C10E144I7N FPGA can also be used in production systems where programmable logic is needed for custom functionality.
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
feature-family-name | Cyclone® III | feature-process-technology | 65nm |
feature-maximum-number-of-user-i-os | 94 | feature-number-of-registers | |
feature-device-logic-cells | 10320 | feature-device-system-gates | |
feature-number-of-multipliers | 23 (18x18) | feature-program-memory-type | SRAM |
feature-ram-bits-kbit | 414 | feature-total-number-of-block-ram | 46 |
feature-ethernet-macs | feature-supported-ip-core | Viterbi Compiler, Low-Speed/Hybrid Serial Decoder|V1 ColdFire|SpeedView Enabled JPEG Encoder (SVE-JPEG-E)|10 Gigabit Ethernet MAC|32/64-bit PCI-X bus Master/Target interface Core, 66/100/133Mhz | |
feature-supported-ip-core-manufacture | Altera/Freescale/CAST, Inc/MorethanIP/PLDA | feature-maximum-number-of-serdes-channels | |
feature-device-logic-units | 10320 | feature-device-number-of-dlls-plls | 2 |
feature-transceiver-blocks | feature-transceiver-speed-gbps | ||
feature-dedicated-dsp | feature-pci-blocks | ||
feature-programmability | No | feature-maximum-internal-frequency-mhz | 437.5 |
feature-speed-grade | 7 | feature-giga-multiply-accumulates-per-second | |
feature-differential-i-o-standards-supported | LVPECL|LVDS|HSTL-18|HSTL-15|HSTL-12|SSTL-2|SSTL-18|RSDS | feature-single-ended-i-o-standards-supported | LVTTL|LVCMOS|PCI|PCI-X|SSTL|HSTL |
feature-external-memory-interface | DDR2 SDRAM|QDRII+SRAM | feature-minimum-operating-supply-voltage-v | 1.15 |
feature-maximum-operating-supply-voltage-v | 1.25 | feature-packaging | |
feature-rohs | feature-rad-hard | ||
feature-pin-count | 144 | feature-supplier-package | EQFP EP |
feature-standard-package-name1 | QFP | feature-cecc-qualified | No |
feature-esd-protection | feature-escc-qualified | ||
feature-military | No | feature-aec-qualified | No |
feature-aec-qualified-number | feature-auto-motive | No | |
feature-p-pap | No | feature-eccn-code | EAR99 |
feature-svhc |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the EP3C10E144I7N component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : EP3C10E144I7N
Brands :
Package : QFP-144
Description : FPGA Cyclone® III Family 10320 Cells 437.5MHz 65nm Technology 1.2V
Part Number : EP3C10F256C8N
Brands :
Package : FBGA-256
Description : FPGA Cyclone III Family 10320 Cells 402MHz 65nm Technology 1.2V
Part Number : EP3C10F324C7N
Brands :
Package :
Description :
Part Number : EP3C10U256C8N
Brands :
Package : BGA-256
Description : FPGA, CYCLONE III, 10K LE, UBGA256; Logic IC family:FPGA; Logic IC Base Number:3; Logic IC function:EP3C10; Voltage, supply:1.20V; Case style:UBGA; I/O lines, No. of:182; IC Generic number:3C10U256; Logic function number:3C10U256; RoHS Compliant: Yes
Part Number : EP3C10U484C7N
Brands :
Package :
Description :
Part points
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The EP3C10E144I7N chip is a field-programmable gate array (fpga) manufactured by intel (formerly altera). it provides high performance and flexibility for various applications. the chip contains programmable logic blocks, embedded ram, and digital signal processing (dsp) blocks, making it suitable for tasks such as data processing, control systems, and communication protocols. it is commonly used in industries like automotive, aerospace, and telecommunications.
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Equivalent
The equivalent products of the EP3C10E144I7N chip are the ep3c10m164i7n, ep3c16e144i7n, and ep3c16m164i7n chips from the cyclone iii fpga family developed by altera, which is now a part of intel. these chips have similar features and capabilities as the EP3C10E144I7N. -
Features
The features of EP3C10E144I7N include 10,080 logic elements, 588 kbits of embedded memory, 144-pin fineline bga package, 270 user i/o pins, 4 phase-locked loops (plls), and support for various i/o standards such as lvds, sstl, and hstl. -
Pinout
The EP3C10E144I7N is a 144-pin package from the ep3c family of programmable logic devices. the exact pin count and pin functions for this specific device can be found in the datasheet provided by the manufacturer. -
Manufacturer
The manufacturer of the EP3C10E144I7N is altera corporation, which is a semiconductor company specializing in programmable logic devices. altera designs and manufactures integrated circuits, including field-programmable gate arrays (fpgas), system-on-chip (soc) devices, and other related solutions for various industries such as automotive, communication, and computing. -
Application Field
The EP3C10E144I7N is a field-programmable gate array (fpga) primarily used in embedded systems and digital signal processing applications. its application areas include telecommunications, automotive, defense, industrial automation, and medical devices. it provides high performance and flexibility for implementing complex logic functions and algorithms in electronic systems. -
Package
The EP3C10E144I7N chip has a package type of ball grid array (bga), a form factor of 144-pin, and a size of 13x13 mm.
Datasheet PDF
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