Xilinx XC6VLX240T-1FF1156I
Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 600 15335424 241152 1156-BBGA, FCBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC6VLX240T-1FF1156I
Datasheet: XC6VLX240T-1FF1156I Datasheet (PDF)
Package/Case: BGA-1156
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2056 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC6VLX240T-1FF1156I General Description
Virtex®-6 LXT Field Programmable Gate Array (FPGA) IC 600 15335424 241152 1156-BBGA, FCBGA
Features
IC FPGA 600 I/O 1156FCBGAIC FPGA 600 I/O 1156FCBGASpecifications
Parameter | Value | Parameter | Value |
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Case/Package | FCBGA | Mount | Surface Mount |
Number of Pins | 1156 | Max Operating Temperature | 100 °C |
Min Operating Temperature | -40 °C | Number of I/Os | 600 |
Number of Logic Blocks (LABs) | 18840 | Number of Logic Elements/Cells | 241152 |
Operating Supply Voltage | 1 V | RAM Size | 1.8 MB |
Speed Grade | 1 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC6VLX240T-1FF1156I is a high-performance FPGA (Field-Programmable Gate Array) chip manufactured by Xilinx. It offers a large capacity of configurable logic cells and various I/O options, making it suitable for complex digital designs. The chip operates at a high clock frequency and includes multiple memory resources, enabling designers to implement advanced applications in areas such as telecommunications, networking, and high-performance computing.
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Features
The XC6VLX240T-1FF1156I is an FPGA from Xilinx. Its features include 240,000 logic cells, 9,600 Kb of block RAM, 4,800 DSP48E1 slices, maximum 720 I/O pins, six power supplies, and a 1.0 V core voltage. It supports a range of interfaces and offers high-performance processing capabilities for various applications. -
Pinout
The XC6VLX240T-1FF1156I is a field-programmable gate array (FPGA) with a pin count of 1156. It belongs to the Virtex-6 LX family from Xilinx. The specific pin functions of this FPGA vary depending on the design it is used for and the user's configuration. -
Manufacturer
Xilinx Inc. is the manufacturer of the XC6VLX240T-1FF1156I. It is a technology company specializing in the development and production of programmable logic devices and associated software tools. -
Application Field
The XC6VLX240T-1FF1156I is a field-programmable gate array (FPGA) commonly used in various application areas such as aerospace and defense, wired and wireless communications, automotive systems, and high-performance computing. It offers high-speed performance, large capacity, and flexible programmability, making it suitable for complex applications requiring real-time processing and advanced logic functions. -
Package
The XC6VLX240T-1FF1156I chip is available in a Flip Chip Ball Grid Array (FCBGA) package. It is a form factor that uses an array of solder balls on the bottom of the chip for connecting to the circuit board. The size of the package is approximately 31mm x 31mm.
Datasheet PDF
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