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Xilinx XC6SLX25T-2CSG324I

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 190 958464 24051 324-LFBGA, CSPBGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC6SLX25T-2CSG324I

Datasheet: XC6SLX25T-2CSG324I Datasheet (PDF)

Package/Case: CSBGA-324

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3713 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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XC6SLX25T-2CSG324I General Description

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 190 958464 24051 324-LFBGA, CSPBGA

AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Case/Package BGA Mount Surface Mount
Number of Pins 324 Max Operating Temperature 100 °C
Min Operating Temperature -40 °C Number of I/Os 190
Number of Logic Blocks (LABs) 1879 Number of Logic Elements/Cells 24051
Number of Registers 30064 Operating Supply Voltage 1.2 V
RAM Size 117 kB

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Payment

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Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

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    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XC6SLX25T-2CSG324I chip is a member of the Xilinx Spartan-6 FPGA family. It features a superior combination of low cost, low power, and high-performance capabilities, making it suitable for a wide range of applications. It offers programmable logic, digital signal processing (DSP) slices, and configurable I/Os, making it versatile and adaptable for various designs.
  • Equivalent

    Some equivalent products of the XC6SLX25T-2CSG324I chip are the XC6SLX25-2FTG256C, XC6SLX25-2CSG324C, and the XC6SLX25-2FGG324C.
  • Features

    The XC6SLX25T-2CSG324I is a FPGA from Xilinx. It is part of the Spartan-6 family and has a gate count of 25,000. It operates at a maximum frequency of 550 MHz and is available in a 324-pin BGA package. It offers various features like integrated memory, digital clock management, and power optimization.
  • Pinout

    The XC6SLX25T-2CSG324I is a field-programmable gate array (FPGA) with 324 pins in a grid array (CSG) package. The pin count and function may vary, but typically include general-purpose input/output (GPIO) pins, configuration pins, clock pins, and other specialized pins for data transfer and control functions. For the specific pin count and function of the XC6SLX25T-2CSG324I, please refer to the datasheet provided by the manufacturer.
  • Manufacturer

    XC6SLX25T-2CSG324I is manufactured by Xilinx, Inc., a technology company that specializes in the development of programmable logic devices and associated software tools. They are a prominent player in the field of field-programmable gate arrays (FPGAs) and provide solutions for a variety of industries including aerospace, automotive, telecommunications, and consumer electronics.
  • Application Field

    Possible application areas for the XC6SLX25T-2CSG324I include automotive, aerospace, telecommunications, industrial automation, and consumer electronics. This FPGA (Field-Programmable Gate Array) can be used in various electronic systems that require high-level processing, programmability, and integration of multiple functions.
  • Package

    The XC6SLX25T-2CSG324I chip has a package type of CS324 and a form and size of 324-ball chip scale grid array (CSG324).

Datasheet PDF

Preliminary Specification XC6SLX25T-2CSG324I PDF Download

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