Xilinx XC6SLX150-3FGG676I

Part points

• The XC6SLX150-3FGG676I chip is a field-programmable gate array (FPGA) manufactured by Xilinx. It belongs to the Spartan-6 family and has 150,000 logic cells, making it suitable for a wide range of applications. The "3FGG676I" denotes its package type and pinout configuration. This chip provides high-speed processing capabilities and is often used in industries such as telecommunications, medical devices, and automotive systems.

• Equivalent

  The equivalent products of the XC6SLX150-3FGG676I chip are the XC6SLX150-2FGG676I and XC6SLX150-3FGG484I chips, which have similar features and capabilities.

• Features

  XC6SLX150-3FGG676I is an FPGA (Field-Programmable Gate Array) device in the Spartan-6 family. It offers 147,443 logic cells, 7,680 slices, 504 I/O pins, and supports a maximum operating frequency of 550 MHz. It also provides integrated features like DSP slices, memory controllers, and high-speed serial connectivity.

• Pinout

  The XC6SLX150-3FGG676I is a Field-Programmable Gate Array (FPGA) with a pin count of 676. The specific function of this FPGA model may vary, as it depends on the specific design programmed into it by the user.

• Manufacturer

  The manufacturer of the XC6SLX150-3FGG676I is Xilinx. Xilinx is an American technology company specializing in the design and manufacture of Field-Programmable Gate Arrays (FPGAs) and programmable logic devices. They provide solutions for a wide range of industries including aerospace, automotive, telecommunications, and data centers.

• Application Field

  The XC6SLX150-3FGG676I is a Field Programmable Gate Array (FPGA) that can be used in a variety of applications including high-performance computing, industrial automation, communication systems, video processing, and automotive electronics. It provides a versatile and flexible platform for implementing complex digital logic functions.

• Package

  The XC6SLX150-3FGG676I chip comes in a Flip Chip Ball Grid Array (BGA) package type. It has a form factor of 676 Ball Grid Array (BGA) and a size of 27mm x 27mm.