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Xilinx XC5VLX50-1FFG676C

FPGA Virtex-5 LX Family 46080 Cells

ISO14001 ISO9001 DUNS

Brands: Amd

Mfr.Part #: XC5VLX50-1FFG676C

Datasheet: XC5VLX50-1FFG676C Datasheet (PDF)

Package/Case: FBGA-676

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3344 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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XC5VLX50-1FFG676C General Description

The XC5VLX50-1FFG676C is a member of the Virtex-5 family of field-programmable gate array (FPGA) devices from Xilinx. It features 50,000 logic cells, making it suitable for mid-range applications that require moderate levels of logic processing and input/output capabilities. This specific variant, the -1FFG676C, is housed in a 676-pin Fine-pitch Ball Grid Array (FFG676) package, which provides a good balance of size and pin count for a variety of applications. The device operates at a maximum speed grade of -1, allowing for clock frequencies of up to 550 MHz. In terms of input/output capabilities, the XC5VLX50-1FFG676C features 275 I/O pins, which can be used for connecting to external devices and peripherals. It also includes four integrated PowerPC 440 processors for embedded processing tasks, as well as dedicated hardware for high-speed serial communication protocols such as PCI Express and Gigabit Ethernet.

xc5vlx50-1ffg676c

Features

  • Logic cells: 50,000
  • CLB flip-flops: 100,000
  • DSP48E1 slices: 240
  • Block RAM: 1,080 kb
  • Max user I/Os: 400
  • Available in FF676 package
  • High-performance 65 nm technology
  • Low power consumption

Application

  • Automotive industry for advanced driver assistance systems
  • Aerospace industry for radar and communication systems
  • Telecommunications for high-speed data processing
  • Networking for routers and switches
  • Industrial automation for control systems
  • Medical devices for image processing and diagnostics
  • Defense industry for secure communication and encryption
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Specifications

Parameter Value Parameter Value
Product Category FPGA - Field Programmable Gate Array RoHS Details
Series XC5VLX50 Number of Logic Elements 46080 LE
Adaptive Logic Modules - ALMs 7200 ALM Embedded Memory 1.69 Mbit
Number of I/Os 440 I/O Supply Voltage - Min 950 mV
Supply Voltage - Max 1.05 V Minimum Operating Temperature 0 C
Maximum Operating Temperature + 85 C Mounting Style SMD/SMT
Package / Case FBGA-676 Brand AMD / Xilinx
Distributed RAM 480 kbit Embedded Block RAM - EBR 1728 kbit
Maximum Operating Frequency 550 MHz Moisture Sensitive Yes
Number of Logic Array Blocks - LABs 3600 LAB Operating Supply Voltage 1 V
Product Type FPGA - Field Programmable Gate Array Factory Pack Quantity 1
Subcategory Programmable Logic ICs Tradename Virtex
Unit Weight 11.382378 oz

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XC5VLX50-1FFG676C is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It is part of the Virtex-5 family and offers 50,000 logic cells, with a capacity for complex digital circuit design. The chip features high-performance and low-power consumption, making it suitable for applications in industries like aerospace, telecommunications, and automotive.
  • Equivalent

    Some equivalent products of the XC5VLX50-1FFG676C chip include the XC5VLX50-2FFG676I, XC5VLX50-3FFG676C, and XC5VLX50-4FFG676C. These chips are part of Xilinx's Virtex-5 family and offer similar features and functionalities.
  • Features

    The XC5VLX50-1FFG676C is a Field-Programmable Gate Array (FPGA) from Xilinx. It has a density of 50,000 logic cells, providing versatile programmable logic capabilities. It offers a 676-pins Fine-Pitch Ball Grid Array (FBGA) package, making it suitable for advanced electronics projects. This FPGA also supports various communication protocols, including Gigabit Ethernet and Serial RapidIO.
  • Pinout

    The XC5VLX50-1FFG676C is an FPGA from Xilinx. It has a pin count of 676 and belongs to the Virtex-5 LX family. The specific function of this device may vary depending on the configuration, but it generally allows for programmable logic and digital signal processing applications.
  • Manufacturer

    Xilinx is the manufacturer of the XC5VLX50-1FFG676C. It is a semiconductor company specializing in programmable logic devices and associated technologies.
  • Application Field

    The XC5VLX50-1FFG676C is a Field Programmable Gate Array (FPGA) that can be used in various application areas such as telecommunications, networking, and high-performance computing. It offers high-speed processing capabilities, versatile connectivity options, and customizable logic functions, making it suitable for a wide range of tasks requiring complex digital signal processing and data manipulation.
  • Package

    The XC5VLX50-1FFG676C chip has a package type of flip chip, the form is BGA (Ball Grid Array), and the size is 676 pins.

Datasheet PDF

Preliminary Specification XC5VLX50-1FFG676C PDF Download

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