Xilinx XC5VLX50-1FFG676C
FPGA Virtex-5 LX Family 46080 Cells
Brands: Amd
Mfr.Part #: XC5VLX50-1FFG676C
Datasheet: XC5VLX50-1FFG676C Datasheet (PDF)
Package/Case: FBGA-676
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 3344 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC5VLX50-1FFG676C General Description
The XC5VLX50-1FFG676C is a member of the Virtex-5 family of field-programmable gate array (FPGA) devices from Xilinx. It features 50,000 logic cells, making it suitable for mid-range applications that require moderate levels of logic processing and input/output capabilities. This specific variant, the -1FFG676C, is housed in a 676-pin Fine-pitch Ball Grid Array (FFG676) package, which provides a good balance of size and pin count for a variety of applications. The device operates at a maximum speed grade of -1, allowing for clock frequencies of up to 550 MHz. In terms of input/output capabilities, the XC5VLX50-1FFG676C features 275 I/O pins, which can be used for connecting to external devices and peripherals. It also includes four integrated PowerPC 440 processors for embedded processing tasks, as well as dedicated hardware for high-speed serial communication protocols such as PCI Express and Gigabit Ethernet.
Features
- Logic cells: 50,000
- CLB flip-flops: 100,000
- DSP48E1 slices: 240
- Block RAM: 1,080 kb
- Max user I/Os: 400
- Available in FF676 package
- High-performance 65 nm technology
- Low power consumption
Application
- Automotive industry for advanced driver assistance systems
- Aerospace industry for radar and communication systems
- Telecommunications for high-speed data processing
- Networking for routers and switches
- Industrial automation for control systems
- Medical devices for image processing and diagnostics
- Defense industry for secure communication and encryption
Specifications
Parameter | Value | Parameter | Value |
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Product Category | FPGA - Field Programmable Gate Array | RoHS | Details |
Series | XC5VLX50 | Number of Logic Elements | 46080 LE |
Adaptive Logic Modules - ALMs | 7200 ALM | Embedded Memory | 1.69 Mbit |
Number of I/Os | 440 I/O | Supply Voltage - Min | 950 mV |
Supply Voltage - Max | 1.05 V | Minimum Operating Temperature | 0 C |
Maximum Operating Temperature | + 85 C | Mounting Style | SMD/SMT |
Package / Case | FBGA-676 | Brand | AMD / Xilinx |
Distributed RAM | 480 kbit | Embedded Block RAM - EBR | 1728 kbit |
Maximum Operating Frequency | 550 MHz | Moisture Sensitive | Yes |
Number of Logic Array Blocks - LABs | 3600 LAB | Operating Supply Voltage | 1 V |
Product Type | FPGA - Field Programmable Gate Array | Factory Pack Quantity | 1 |
Subcategory | Programmable Logic ICs | Tradename | Virtex |
Unit Weight | 11.382378 oz |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC5VLX50-1FFG676C is a field-programmable gate array (FPGA) chip manufactured by Xilinx. It is part of the Virtex-5 family and offers 50,000 logic cells, with a capacity for complex digital circuit design. The chip features high-performance and low-power consumption, making it suitable for applications in industries like aerospace, telecommunications, and automotive.
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Equivalent
Some equivalent products of the XC5VLX50-1FFG676C chip include the XC5VLX50-2FFG676I, XC5VLX50-3FFG676C, and XC5VLX50-4FFG676C. These chips are part of Xilinx's Virtex-5 family and offer similar features and functionalities. -
Features
The XC5VLX50-1FFG676C is a Field-Programmable Gate Array (FPGA) from Xilinx. It has a density of 50,000 logic cells, providing versatile programmable logic capabilities. It offers a 676-pins Fine-Pitch Ball Grid Array (FBGA) package, making it suitable for advanced electronics projects. This FPGA also supports various communication protocols, including Gigabit Ethernet and Serial RapidIO. -
Pinout
The XC5VLX50-1FFG676C is an FPGA from Xilinx. It has a pin count of 676 and belongs to the Virtex-5 LX family. The specific function of this device may vary depending on the configuration, but it generally allows for programmable logic and digital signal processing applications. -
Manufacturer
Xilinx is the manufacturer of the XC5VLX50-1FFG676C. It is a semiconductor company specializing in programmable logic devices and associated technologies. -
Application Field
The XC5VLX50-1FFG676C is a Field Programmable Gate Array (FPGA) that can be used in various application areas such as telecommunications, networking, and high-performance computing. It offers high-speed processing capabilities, versatile connectivity options, and customizable logic functions, making it suitable for a wide range of tasks requiring complex digital signal processing and data manipulation. -
Package
The XC5VLX50-1FFG676C chip has a package type of flip chip, the form is BGA (Ball Grid Array), and the size is 676 pins.
Datasheet PDF
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