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Xilinx XC4VSX35-11FFG668I

Name: XC4VSX35-11FFG668I
Rating: 4.5 (10 reviews)

XC4VSX35-11FFG668I CPLD/FPGA

Brands: Amd

Mfr.Part #: XC4VSX35-11FFG668I

Datasheet: XC4VSX35-11FFG668I Datasheet (PDF)

Package/Case: FBGA-668

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2632 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Remark

XC4VSX35-11FFG668I General Description

The XC4VSX35-11FFG668I is an FPGA (Field-Programmable Gate Array) manufactured by Xilinx. Here's a concise breakdown of its key details:1. **Family**: Belongs to the Xilinx Virtex-4 series, known for its high performance and versatility.2. **Model**: Designated as XC4VSX35, indicating its specific variant within the Virtex-4 family.3. **Speed Grade**: Rated at -11, indicating its maximum operating speed grade.4. **Package**: Housed in a FFG668I package, which refers to the specific physical packaging and pin configuration.5. **Logic Cells**: Contains a certain number of logic cells, typically ranging in the tens of thousands for Virtex-4 FPGAs.6. **I/Os**: Offers a variety of input/output pins for interfacing with external components.7. **Features**: Supports advanced features such as embedded multipliers, DSP slices, and configurable logic blocks.8. **Application**: Suitable for a wide range of applications including telecommunications, aerospace, and industrial automation.

Features

35,000 logic cells
11Mbps data rate
668-ball Fine-pitch BGA packaging
3.3V voltage
Industrial temperature range
Available in RoHS compliant
Integrated PowerPC 405 processor
16 RocketIO transceivers
Enhanced system performance

Application

Telecommunications
Networking
Industrial automation
Medical imaging
Consumer electronics
Aerospace and defense
Automotive
Test and measurement equipment
Wireless communication systems

Specifications

Parameter	Value	Parameter	Value
Product Category	FPGA - Field Programmable Gate Array	RoHS	Details
Series	XC4VSX35	Number of Logic Elements	34560 LE
Adaptive Logic Modules - ALMs	15360 ALM	Embedded Memory	3.38 Mbit
Number of I/Os	448 I/O	Supply Voltage - Min	1.2 V
Supply Voltage - Max	1.2 V	Minimum Operating Temperature	- 40 C
Maximum Operating Temperature	+ 100 C	Mounting Style	SMD/SMT
Package / Case	FBGA-668	Brand	AMD / Xilinx
Distributed RAM	240 kbit	Embedded Block RAM - EBR	3456 kbit
Maximum Operating Frequency	500 MHz	Moisture Sensitive	Yes
Number of Logic Array Blocks - LABs	3840 LAB	Operating Supply Voltage	1.2 V
Product Type	FPGA - Field Programmable Gate Array	Factory Pack Quantity	1
Subcategory	Programmable Logic ICs	Tradename	Virtex
Unit Weight	7.543160 oz

Shipping

	Ship Fee	Lead Time
DHL	$20.00-$40.00 (0.50 KG)	2-5 days
Fedex	$20.00-$40.00 (0.50 KG)	2-5 days
UPS	$20.00-$40.00 (0.50 KG)	2-5 days
TNT	$20.00-$40.00 (0.50 KG)	2-5 days
EMS	$20.00-$40.00 (0.50 KG)	2-5 days
REGISTERED AIR MAIL	$20.00-$40.00 (0.50 KG)	2-5 days

Processing Time：Shipping fee depend on different zone and country.

Payment

Terms of payment		Hand Fee
	Wire Transfer	charge US$30.00 banking fee.
	Paypal	charge 4.0% service fee.
	Credit Card	charge 3.5% service fee.
	Western Union	charge US.00 banking fee.
	Money Gram	charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

Step1 :Product
Step2 :Vacuum packaging
Step3 :Anti-static bag
Step4 :Individual packaging
Step5 :Packaging boxes
Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

Equivalent Parts

For the XC4VSX35-11FFG668I component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number : XC4VSX35-11FFG668

Brands :

Package :

Description :

Part Number : XC4VSX35-11FFG668C

Brands :

Package : BGA-668

Description : FPGA VIRTEX-4 34560 CELLS 90NM 1.2V 668FCBGA - Trays

Part Number : XC4VSX35-11FFG668I0964

Brands :

Package :

Description :

Part Number : XC4VSX35-11FFG668I0974

Brands :

Package :

Description :

Part points

The XC4VSX35-11FFG668I chip is a field-programmable gate array (FPGA) manufactured by Xilinx. It belongs to the Virtex-4 family and features 35,888 logic cells, 720 DSP slices, and 768 I/O pins. It operates with a supply voltage of 1.2V and offers various configurable options for digital and analog signal processing applications.
Equivalent

The equivalent products of the XC4VSX35-11FFG668I chip are the XC4VSX35-11FF668I and the XC4VSX35-12FF668I chips.
Features

The XC4VSX35-11FFG668I is a field-programmable gate array (FPGA) with 35,200 logic cells and 1,008 Kb of RAM. It operates at a maximum frequency of 692 MHz and has 684 input/output pins. It supports various features like multi-voltage and multi-standard support, advanced power management, and various high-speed serial interfaces.
Pinout

The XC4VSX35-11FFG668I is an FPGA (Field-Programmable Gate Array) with a pin count of 668. It is part of the Virtex-4 family by Xilinx. The specific pin functions can be found in the device datasheet provided by the manufacturer.
Manufacturer

The manufacturer of the XC4VSX35-11FFG668I is Xilinx Inc. It is a technology company that specializes in designing and developing programmable logic devices and associated software.
Application Field

The XC4VSX35-11FFG668I is a field-programmable gate array (FPGA) that is commonly used in high-performance applications such as digital signal processing, telecommunications, and scientific research. It offers versatile programmability and high-speed data processing capabilities, making it suitable for a wide range of applications.
Package

The XC4VSX35-11FFG668I chip has a Ball Grid Array (BGA) package type, a 668-pin package form, and its size is 27 x 27 mm.

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Datasheet PDF

Preliminary Specification XC4VSX35-11FFG668I PDF Download

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