Xilinx XC4VLX100-10FFG1148C

Part points

• The XC4VLX100-10FFG1148C is a high-performance and high-density FPGA chip manufactured by Xilinx. It offers 100,000 logic cells, allowing for complex and customizable digital designs. With a speed grade of -10, it operates at a frequency of up to 500 MHz. The chip belongs to the Virtex-4 family and is commonly used in applications like telecommunications, industrial automation, aerospace, and defense.

• Equivalent

  Some equivalent products to the XC4VLX100-10FFG1148C chip are the XC4VLX100-10FF1148I, XC4VLX100-10FF1148C, and XC4VLX100-10FF1148LVX. These chips are all part of the same Xilinx Virtex-4 family, offering similar specifications and functionality.

• Features

  The XC4VLX100-10FFG1148C is a field-programmable gate array (FPGA) with 100,000 logic cells, a maximum operating frequency of 10 MHz, and a flip chip packaging. It features low power consumption, high-performance logic fabric, 900+ inputs and outputs, and various connectivity options.

• Pinout

  The XC4VLX100-10FFG1148C is a FPGA IC with a pin count of 1148. It belongs to the Virtex-4 family from Xilinx and is designed for high-performance applications. The specific function and pin assignments of this IC can be found in the device datasheet provided by the manufacturer.

• Manufacturer

  The manufacturer of the XC4VLX100-10FFG1148C is Xilinx. Xilinx is a technology company specializing in the development and production of programmable logic devices, including field-programmable gate arrays (FPGAs). They design and manufacture these semiconductor devices for various industries such as telecommunications, automotive, aerospace, and many others.

• Application Field

  The XC4VLX100-10FFG1148C is commonly used in applications such as telecommunications, medical imaging, high-performance computing, automotive, and aerospace. It offers high processing power, low power consumption, and excellent performance, making it suitable for a wide range of demanding applications that require advanced processing capabilities and high-speed data processing.

• Package

  The XC4VLX100-10FFG1148C chip has a Ball Grid Array (BGA) package type. It is in the form of a square shape with leads arranged in a grid pattern on the bottom side. The size of the chip is 31 x 31 mm.