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XC6SLX25-2FTG256I

FPGA, 1879 configurable logic blocks, 667MHz, in a PBGA256 package

ISO14001 ISO9001 DUNS

Brands: Amd

Mfr.Part #: XC6SLX25-2FTG256I

Datasheet: XC6SLX25-2FTG256I Datasheet (PDF)

Package/Case: FBGA-256

RoHS Status:

Stock Condition: 7175 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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XC6SLX25-2FTG256I General Description

The XC6SLX25-2FTG256I is a member of the Spartan-6 family of Field-Programmable Gate Arrays (FPGAs) manufactured by Xilinx. Here's a concise breakdown:1. **Family and Series**: Part of the Spartan-6 family. 2. **Device Type**: FPGA (Field-Programmable Gate Array).3. **Model Number**: XC6SLX25-2FTG256I.4. **Package Type**: Available in a 256-pin Fine-Pitch Ball Grid Array (FTG256) package.5. **Logic Cells**: Contains 25,000 logic cells.6. **Speed Grade**: The "-2" indicates a commercial speed grade.7. **I/O Pins**: The "FTG256" package provides 256 user I/O pins.8. **Voltage**: Operates at a standard voltage level.9. **Features**: Offers programmable logic, configurable I/Os, block RAM, DSP slices, and other resources typical of Spartan-6 FPGAs.10. **Applications**: Suitable for a wide range of applications including telecommunications, automotive, industrial automation, and consumer electronics.In summary, the XC6SLX25-2FTG256I is a versatile FPGA with 25,000 logic cells, 256 user I/O pins, and is commonly used across various industries for its programmable capabilities

XC6SLX25-2FTG256I

Features

  • The XC6SLX25-2FTG256I is an FPGA chip
  • It features 24,576 logic cells, 768 Kb block RAM, and 16 DSP slices
  • It operates at a maximum speed of 550 MHz
  • The chip has 256 pins and is built on a 45nm process
  • It offers advanced programmability and versatility for various applications
  • Application

  • The XC6SLX25-2FTG256I is commonly used in aerospace, automotive, telecommunications, and industrial applications
  • It's suitable for tasks requiring moderate processing power and flexibility, such as sensor interfacing, motor control, signal processing, and communication protocols implementation
  • Its compact size and low power consumption make it ideal for embedded systems and portable devices
  • Specifications

    Parameter Value Parameter Value
    Product Category FPGA - Field Programmable Gate Array RoHS Details
    Series XC6SLX25 Number of Logic Elements 24051 LE
    Adaptive Logic Modules - ALMs 3758 ALM Embedded Memory 936 kbit
    Number of I/Os 186 I/O Supply Voltage - Min 1.14 V
    Supply Voltage - Max 1.26 V Minimum Operating Temperature - 40 C
    Maximum Operating Temperature + 100 C Mounting Style SMD/SMT
    Package / Case FBGA-256 Brand AMD / Xilinx
    Distributed RAM 229 kbit Embedded Block RAM - EBR 936 kbit
    Maximum Operating Frequency 1.08 GHz Moisture Sensitive Yes
    Number of Logic Array Blocks - LABs 1879 LAB Operating Supply Voltage 1.2 V
    Product Type FPGA - Field Programmable Gate Array Factory Pack Quantity 1
    Subcategory Programmable Logic ICs Tradename Spartan
    Unit Weight 0.515063 oz

    Shipping

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    Payment

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    Wire Transfer Wire Transfer charge US$30.00 banking fee.
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    Guarantees

    1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

    2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

    Packing

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    • Vacuum packaging

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    • Anti-static bag

      Step3 :Anti-static bag

    • Individual packaging

      Step4 :Individual packaging

    • Packaging boxes

      Step5 :Packaging boxes

    • bar-code shipping tag

      Step6 :bar-code shipping tag

    All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

    Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

    We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

    After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

    • ESD
    • ESD

    Part points

    • The XC6SLX25-2FTG256I is a Field-Programmable Gate Array (FPGA) chip from Xilinx. It belongs to the Spartan-6 family and features 25,000 Logic Cells, 720 Kb of Block RAM, and 64 DSP slices. The chip is in a 256-pin Fine-pitch Ball Grid Array (FBGA) package. It is known for its low power consumption and high-performance capabilities, making it suitable for a wide range of applications.
    • Equivalent

      The equivalent products of XC6SLX25-2FTG256I chip are XC6SLX25-2CPG236C, XC6SLX25-2FGG484C, XC6SLX25-2TQG144C, XC6SLX25-3CPG236C, XC6SLX25-3FGG484C, and XC6SLX25-3TQG144C.
    • Features

      1. FPGA device 2. 25,000 logic cells 3. 96 embedded memory blocks 4. 256 I/O pins 5. 2.5V core voltage 6. 2-speed grade 7. FTG package 8. −1.2V to 3.3V I/O voltage 9. SPI and JTAG programming 10. 256-ball fine pitch BGA package.
    • Pinout

      XC6SLX25-2FTG256I is a Field-Programmable Gate Array (FPGA) with a pin count of 256. It has 25,000 logic cells and features integrated blocks such as DSP slices, block RAM, and configurable IOs. The FPGA is mainly used for high-performance applications requiring parallel processing and real-time data processing.
    • Manufacturer

      XC6SLX25-2FTG256I is manufactured by Xilinx, an American technology company that specializes in field-programmable gate arrays (FPGAs) and programmable logic devices. Xilinx is known for its high-performance semiconductor products used in a variety of industries including aerospace, automotive, telecommunications, and consumer electronics.
    • Application Field

      The XC6SLX25-2FTG256I is commonly used in applications such as telecommunications, data communications, industrial automation, and automotive electronics. It is suitable for applications that require high-performance processing, low power consumption, and reconfigurability, such as signal processing, image processing, and control systems.
    • Package

      The XC6SLX25-2FTG256I chip is available in a surface mount package, the form is BGA (Ball Grid Array), and the size is 17x17 mm.

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