Xilinx XC3SD3400A-4FGG676C

Part points

• The XC3SD3400A-4FGG676C is a Field Programmable Gate Array (FPGA) chip developed by Xilinx. It belongs to the Spartan-3A FPGA family and has 3400 logic cells. With 4 input/output banks and a 676-pin Fine-pitch BGA package, it is designed for complex digital logic applications requiring high performance and flexibility. The chip can be configured and reconfigured to perform various tasks based on user-defined circuits.

• Features

  The features of the XC3SD3400A-4FGG676C include a Spartan-3A FPGA architecture, 3,400 slices, 768 Kbits of block RAM, 96 DSP slices, 500 MHz maximum frequency, 676-pin BGA package, and 4.8 Gbps serial transceivers.

• Pinout

  The XC3SD3400A-4FGG676C is an FPGA device with a pin count of 676. Its specific function and features can be found in the datasheet of the device provided by the manufacturer.

• Manufacturer

  The manufacturer of the XC3SD3400A-4FGG676C is Xilinx Inc. It is a leading American technology company specializing in the development and production of field-programmable gate arrays (FPGAs), system on chips (SoCs), and other programmable logic devices. Xilinx caters to various markets such as communications, automotive, industrial, and aerospace and defense, providing integrated solutions for complex digital and mixed-signal designs.

• Application Field

  The XC3SD3400A-4FGG676C is a Field-Programmable Gate Array (FPGA) that is commonly used in applications requiring high-performance processing and programmable logic capabilities. It is suitable for a wide range of applications, including telecommunications, automotive, aerospace, industrial automation, and medical devices.

• Package

  The XC3SD3400A-4FGG676C chip is an integrated circuit that comes in a very fine pitch ball grid array (VFBGA) package. The form factor is 676-ball and the size of the package is determined by the size of the ball grid array.