Xilinx XC3SD3400A-4FG676I
Spartan®-3A DSP Field Programmable Gate Array (FPGA) IC 469 2322432 53712 676-BGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3SD3400A-4FG676I
Datasheet: XC3SD3400A-4FG676I Datasheet (PDF)
Package/Case: BGA-676
RoHS Status:
Stock Condition: 3572 pcs, New Original
Product Type: Programmable Logic ICs
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
Qty | Unit Price | Ext Price |
---|---|---|
1 | $193.089 | $193.089 |
200 | $74.724 | $14944.800 |
500 | $72.097 | $36048.500 |
1000 | $70.799 | $70799.000 |
In Stock:3572 PCS
XC3SD3400A-4FG676I General Description
Spartan®-3A DSP Field Programmable Gate Array (FPGA) IC 469 2322432 53712 676-BGA
Features
IC FPGA 469 I/O 676FCBGAIC FPGA 469 I/O 676FCBGASpecifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Pbfree Code | No | Rohs Code | No |
Part Life Cycle Code | Transferred | Ihs Manufacturer | XILINX INC |
Part Package Code | BGA | Package Description | FBGA-676 |
Pin Count | 676 | Reach Compliance Code | not_compliant |
ECCN Code | 3A991.D | HTS Code | 8542.39.00.01 |
Factory Lead Time | 52 Weeks | Samacsys Manufacturer | XILINX |
Clock Frequency-Max | 250 MHz | Combinatorial Delay of a CLB-Max | 0.71 ns |
JESD-30 Code | S-PBGA-B676 | JESD-609 Code | e0 |
Length | 27 mm | Moisture Sensitivity Level | 3 |
Number of CLBs | 5968 | Number of Equivalent Gates | 3400000 |
Number of Inputs | 469 | Number of Logic Cells | 53712 |
Number of Outputs | 409 | Number of Terminals | 676 |
Operating Temperature-Max | 100 °C | Operating Temperature-Min | -40 °C |
Organization | 5968 CLBS, 3400000 GATES | Package Body Material | PLASTIC/EPOXY |
Package Code | BGA | Package Equivalence Code | BGA676,26X26,40 |
Package Shape | SQUARE | Package Style | GRID ARRAY |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | Qualification Status | Not Qualified |
Seated Height-Max | 2.6 mm | Supply Voltage-Max | 1.26 V |
Supply Voltage-Min | 1.14 V | Supply Voltage-Nom | 1.2 V |
Surface Mount | YES | Technology | CMOS |
Terminal Finish | TIN LEAD | Terminal Form | BALL |
Terminal Pitch | 1 mm | Terminal Position | BOTTOM |
Width | 27 mm |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC3SD3400A-4FG676I chip is a Field Programmable Gate Array (FPGA) manufactured by Xilinx. It belongs to the Spartan-3A family and has 3,400 slices, 422Kbits of RAM, 181 I/Os, and a core frequency of up to 350MHz. It is widely used in various applications, including telecommunications, automotive, industrial automation, and consumer electronics, due to its high performance and flexibility in digital circuit design.
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Features
XC3SD3400A-4FG676I is a field-programmable gate array (FPGA) by Xilinx. It has 3,400K system gates, 21,840 slices, and 1,679KB of memory. It operates at a maximum frequency of 320MHz and supports various I/O standards. The FPGA is targeted at applications requiring high-performance and high-capacity programmable logic solutions. -
Pinout
The XC3SD3400A-4FG676I is a Field Programmable Gate Array (FPGA) with a pin count of 676. It is used for advanced digital design and prototyping and offers various functions, including flexible logic and routing capabilities, high-performance processing, and integrated programmable I/O interfaces. -
Manufacturer
The manufacturer of the XC3SD3400A-4FG676I is Xilinx. Xilinx is a leading semiconductor company specializing in field-programmable gate arrays (FPGAs) and programmable logic devices (PLDs). They design and manufacture integrated circuits that can be reprogrammed by customers, allowing for flexibility in hardware design and functionality. -
Application Field
The XC3SD3400A-4FG676I FPGA can be used in a range of applications, including digital signal processing, high-performance computing, advanced communication systems, automotive electronics, and industrial automation. It offers high logic capacity, high-speed performance, and flexibility making it suitable for a wide array of sophisticated applications. -
Package
The XC3SD3400A-4FG676I chip is available in a FG676 package type, which refers to a fine-pitch ball grid array (BGA) package. The form of the chip is a BGA, and the dimensions of this package size are 27mm x 27mm, with a 1mm ball pitch.
Datasheet PDF
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