Images are for reference only See Product Specifications
Xilinx XC3SD1800A-4FGG676C
FPGA - Field Programmable Gate Array XC3SD1800A-4FGG676C
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3SD1800A-4FGG676C
Datasheet: XC3SD1800A-4FGG676C Datasheet (PDF)
Package/Case: BGA-676
RoHS Status:
Stock Condition: 3922 pcs, New Original
Product Type: Programmable Logic ICs
Warranty: 1 Year Ovaga Warranty - Find Out More
0
1
*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $104.308 | $104.308 |
| 200 | $40.366 | $8073.200 |
| 500 | $38.948 | $19474.000 |
| 1000 | $38.248 | $38248.000 |
In Stock:3922 PCS
XC3SD1800A-4FGG676C General Description
FPGA, SPARTAN-3ADSP, 1800K, 676FBGA; No. of Macrocells:37440; Operating Temperature Range:0°C to +85°C; No. of Pins:676; SVHC:No SVHC (18-Jun-2010); Package / Case:FBGA; Logic IC Base Number:3SD1800; Logic IC Function:FPGA; Supply Voltage Max:1.26V; Supply Voltage Min:1.14V; Termination Type:SMD; Frequency:667MHz; I/O Interface Standard:LVTTL, LVCMOS, HSTL, SSTL; I/O Output Drive:3.3V, 2.5V, 1.8V, 1.5V, 1.2V; No. of I/O Lines:519; Programmable Logic Type:FPGA
Features
- 1800K system gates (logic cells)
- 4.6 Mb block RAM
- 784 user I/Os
- 8 Digital Clock Managers (DCMs)
- 256-bit AES encryption
- SelectIO technology for interfacing with various I/O standards
- Built-in MicroBlaze processor for embedded applications
Application
- Video and audio processing
- Networking and communication systems
- Industrial control and automation
- Aerospace and defense systems
- Medical imaging
- Test and measurement equipment
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Case/Package | FBGA | Mount | Surface Mount |
| Number of Pins | 676 | Frequency | 667 MHz |
| Max Operating Temperature | 85 °C | Max Supply Voltage | 1.26 V |
| Min Operating Temperature | 0 °C | Min Supply Voltage | 1.14 V |
| Number of Gates | 1.8e+06 | Number of I/Os | 519 |
| Number of Logic Blocks (LABs) | 4160 | Number of Logic Elements/Cells | 37440 |
| Number of Macrocells | 37440 | Operating Supply Voltage | 1.2 V |
| RAM Size | 189 kB | Speed Grade | 4 |
| Termination | SMD/SMT | Height | 1.75 mm |
| Length | 27 mm |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
 |
Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
 |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
-
![Product]( "Product")
Step1 :Product
-
![Vacuum packaging]( "Vacuum packaging")
Step2 :Vacuum packaging
-
![Anti-static bag]( "Anti-static bag")
Step3 :Anti-static bag
-
![Individual packaging]( "Individual packaging")
Step4 :Individual packaging
-
![Packaging boxes]( "Packaging boxes")
Step5 :Packaging boxes
-
![bar-code shipping tag]( "bar-code shipping tag")
Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3SD1800A-4FGG676C component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : XC3SD1800A-4CSG484C
Brands :
Package : BGA-484
Description : Extended Spartan-3A FPGAs, Package: 4CSG484C
Part Number : XC3SD1800A-4FTG256C
Brands :
Package :
Description :
Part Number : XC3SD1800A-4FTG400C
Brands :
Package :
Description :
Part Number : XC3SD1800A-4FTG676C
Brands :
Package :
Description :
Part Number : XC3SD1800A-4FFG676C
Brands :
Package :
Description :
Part points
-
XC3SD1800A-4FGG676C is a programmable logic chip commonly used in electronic systems. It belongs to the Xilinx Spartan-3 family and has 1.8 million system gates. The "4FGG676C" represents the package type and pin configuration. This chip provides a high level of integration and flexibility, making it suitable for a wide range of applications, including communication systems, industrial control, and aerospace.
-
Equivalent
Some equivalent products of the XC3SD1800A-4FGG676C chip are the Xilinx XC3SD1800A-4FGG676I, XC3SD1800A-4FGG676E, XC3SD1800A-4FGG676CES, and XC3SD1800A-4FTG256I chips. -
Features
The features of XC3SD1800A-4FGG676C include a Spartan-3A field-programmable gate array (FPGA) with 1,800,000 system gates, 768 kilobits of block RAM, 2,304 embedded multipliers, 224 bidirectional I/Os, and a 4.5 nanosecond pin-to-pin maximum delay. -
Pinout
The XC3SD1800A-4FGG676C is a Field-Programmable Gate Array (FPGA) with a pin count of 676. The specific functions of the pins can vary depending on the configuration and application of the FPGA, as it is programmable. -
Manufacturer
The manufacturer of the XC3SD1800A-4FGG676C is Xilinx. Xilinx is an American technology company that specializes in the development and manufacturing of programmable logic devices, including field-programmable gate arrays (FPGAs). -
Application Field
The XC3SD1800A-4FGG676C is an FPGA (Field-Programmable Gate Array) commonly used in various applications including communications, industrial automation, aerospace, defense, and medical equipment. Its programmable nature allows it to be adopted in a wide range of electronic systems where flexibility, high performance, and fast time-to-market are essential. -
Package
The XC3SD1800A-4FGG676C chip comes in a 676-pin FBGA (Fine-Pitch Ball Grid Array) package. The form factor is square with a size of approximately 27 x 27 mm.
Datasheet PDF
We provide high quality products, thoughtful service and after sale guarantee
-
![Product]( "Product")
We have rich products, can meet your various needs.
-
![quantity]( "quantity")
Minimum order quantity starts from 1pcs.
-
![shipping]( "shipping")
Lowest international shipping fee starts from $0.00
-
![guarantee]( "guarantee")
365 days quality guarantee for all products
