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Xilinx XC3S700AN-4FGG484C
Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 667MHz, 13248-Cell, CMOS, PBGA484
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S700AN-4FGG484C
Datasheet: XC3S700AN-4FGG484C Datasheet (PDF)
Package/Case: BGA484
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 3680 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC3S700AN-4FGG484C General Description
PLD Logic; Programmable Logic Type:FPGA; Logic Type:FPGA; Logic Family:CMOS; Logic Base Number:3S700; No. of I/O Pins:372; Frequency Max:667MHz; I/O Output Drive:24 mA; Supply Voltage Min:1.14V; Supply Voltage Max:1.26V ;RoHS Compliant: Yes
Features
- It has 700,000 system gates and 1,152 digital input/output (I/O) pins.
- The device operates at a maximum frequency of 400 MHz.
- It has 20 block RAMs, each of which can store 18 Kb of data.
- The FPGA supports multiple I/O standards, including LVDS, HSTL, SSTL, and PCI.
Application
- The XC3S700AN-4FGG484C FPGA can be used in a wide range of applications, including digital signal processing, networking, wireless communication, video processing, and high-performance computing.
- It can also be used in industrial automation, medical equipment, and automotive applications.
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Case/Package | FBGA | Mount | Surface Mount |
| Number of Pins | 484 | Frequency | 667 MHz |
| Max Operating Temperature | 85 °C | Max Supply Voltage | 1.26 V |
| Min Operating Temperature | 0 °C | Min Supply Voltage | 1.14 V |
| Number of Gates | 700000 | Number of I/Os | 372 |
| Number of Logic Blocks (LABs) | 1472 | Number of Logic Elements/Cells | 13248 |
| Number of Macrocells | 13248 | Operating Supply Voltage | 1.2 V |
| RAM Size | 45 kB | Speed Grade | 4 |
| Termination | SMD/SMT | Height | 1.7 mm |
| Length | 23 mm |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3S700AN-4FGG484C component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : XC3S700AN-4FTG256C
Brands :
Package :
Description :
Part Number : XC3S700AN-4FTG484I
Brands :
Package :
Description :
Part Number : XC3S700AN-4FTG484C
Brands :
Package :
Description :
Part Number : XC3S700AN-4FTG676I
Brands :
Package :
Description :
Part Number : XC3S700AN-4FTG676C
Brands :
Package :
Description :
Part Number : XC3S700AN-4FGG484I
Brands :
Package : BGA-484
Description : FPGA Spartan-3AN Family 700K Gates 13248 Cells 667MHz 90nm Technology 1.2V
Part Number : XC3S700AN-4FGG676I
Brands :
Package :
Description :
Part Number : XC3S700AN-4FGG676C
Brands :
Package :
Description :
Part points
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The XC3S700AN-4FGG484C is a Field-Programmable Gate Array (FPGA) chip from Xilinx. It belongs to the Spartan-3A family and comes in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package. The chip offers 717,568 system gate capacity and supports advanced features like 18-bit datapath width, up to 418 I/O pins, and various configurable resources. It can be synthesized and programmed for various applications in industries like telecommunications, automotive, and aerospace.
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Equivalent
The equivalent products of XC3S700AN-4FGG484C chip are XC3S700AN-4FGG484I and XC3S700AN-4FGG484E chips. -
Features
XC3S700AN-4FGG484C is a Spartan-3AN FPGA by Xilinx. It has 700K system gates, 500K equivalent ASIC gates, 12,288 logic cells, and 576Kbits RAM. It operates at a maximum frequency of 550 MHz, has 192 user I/Os, and includes 6 integrated adjustable delay locked loops (DLLs). It uses 1.2V core supply and supports embedded trace analyzer. -
Pinout
The pin count of the XC3S700AN-4FGG484C is 484 pins. The functions of this field-programmable gate array (FPGA) vary depending on the configuration, but it generally includes logic elements, memory blocks, I/O interfaces, and more for digital circuit design and implementation. -
Manufacturer
XC3S700AN-4FGG484C is manufactured by Xilinx Inc., a leading semiconductor company specializing in programmable logic devices and software tools. It is known for its field-programmable gate arrays (FPGAs) which are widely used in various industries including telecommunications, automotive, aerospace, and consumer electronics. They provide high-performance and flexible solutions for a wide range of applications. -
Application Field
The XC3S700AN-4FGG484C is a field-programmable gate array (FPGA) that can be used in various applications, including telecommunications, aerospace, industrial automation, and consumer electronics. It offers a high level of programmability, making it suitable for a wide range of design requirements in these and other fields. -
Package
The XC3S700AN-4FGG484C chip has a Fine-pitch Ball Grid Array (FBGA) package type, a 484-ball grid array (BGA) form, and a size of 23mm x 23mm.
Datasheet PDF
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