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Xilinx XC3S700AN-4FGG484I
FPGA - Field Programmable Gate Array XC3S700AN-4FGG484I
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S700AN-4FGG484I
Datasheet: XC3S700AN-4FGG484I Datasheet (PDF)
Package/Case: BGA-484
Product Type: Programmable Logic ICs
XC3S700AN-4FGG484I General Description
FPGA, SPARTAN-3A, 700K GATES, 484FBGA; No. of Logic Blocks:1472; No. of Gates:700000; No. of Macrocells:13248; Family Type:Spartan-3AN; No. of Speed Grades:4; Series:Spartan-3AN; Total RAM Bits:368640; No. of I/O's:372; Clock Management:DLL; Core Supply Voltage Range:1.14V to 1.26V; Operating Frequency Max:250MHz; Operating Temperature Range:-40°C to +85°C; Logic Case Style:FBGA; No. of Pins:484; MSL:MSL 3 - 168 hours; SVHC:No SVHC (20-Jun-2011); Frequency:667MHz; I/O Interface Standard:LVTTL, LVCMOS, HSTL, SSTL; I/O Output Drive:3.3V, 2.5V, 1.8V, 1.5V, 1.2V; Logic IC Base Number:3S700; Logic IC Function:FPGA; No. of I/O's:372; Operating Frequency Max:250MHz; Package / Case:FBGA; Programmable Logic Type:FPGA; Supply Voltage Max:1.26V; Supply Voltage Min:1.14V; Termination Type:SMD
Features
- Contains 700,000 system gates, which can be configured and interconnected by the user to perform a wide range of digital functions.
- Includes 896 programmable I/O pins, enabling the device to interface with other digital components.
- Uses a 4-input lookup table (LUT) architecture, which is a type of digital circuit that allows for flexible and efficient logic implementation.
- Supports various configuration modes, including serial and parallel, to enable fast and easy programming.
- Operates on a 1.2V core voltage and has a maximum operating frequency of 400 MHz.
Application
- XC3S700AN-4FGG484I can be used in a variety of applications, including aerospace, defense, telecommunications, and industrial automation.
- It can be used to implement digital signal processing, control logic, and communication protocols.
- The chip's reprogrammable nature makes it ideal for prototyping and system development.
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Pin Count | 484 | Package Category | BGA |
| Released Date | Jul 26, 2022 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
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After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3S700AN-4FGG484I component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : XC3S700A-4FGG484C
Brands :
Package : FBGA484
Description : Extended Spartan-3A FPGAs, Package: 4FGG484C
Part Number : XC3S700AN-4FGG676I
Brands :
Package :
Description :
Part Number : XC3S700AN-4FGG676C
Brands :
Package :
Description :
Part Number : XC3S700AN-4FGG484C
Brands :
Package : BGA484
Description : FPGA Spartan®-3AN Family 700K Gates 13248 Cells 667MHz 90nm Technology 1.2V
Part Number : XC3S700AN-4FGG676CES
Brands :
Package :
Description :
Part points
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The XC3S700AN-4FGG484I chip is a field-programmable gate array (FPGA) developed by Xilinx. It offers 700,000 system gates, making it suitable for various applications. The chip can be reprogrammed to implement different digital circuits, allowing for flexibility and customization. It is housed in a 484-ball fine pitch ball grid array (FBGA) package.
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Equivalent
There are several equivalent products of the XC3S700AN-4FGG484I chip, including XC3S700AN-4FGG484C, XC3S700AN-4FGG484M, and XC3S700AN-4FGG484Q. These chips are part of the Xilinx Spartan-3AN FPGA family and have similar specifications and features. -
Features
XC3S700AN-4FGG484I is an FPGA (Field Programmable Gate Array) chip from Xilinx. It has 700,000 system gates, 864 I/O pins, programmable logic cells, and embedded memory blocks. It operates at a speed of 400 MHz and supports various I/O standards. This chip is designed for high-performance applications and offers flexibility in system design. -
Pinout
The XC3S700AN-4FGG484I is an FPGA with a pin count of 484. It is a part of the Spartan-3AN family and has a speed grade of -4. The specific functions and pin assignments of this FPGA can be found in the device datasheet provided by the manufacturer. -
Manufacturer
The manufacturer of the XC3S700AN-4FGG484I is Xilinx Inc. It is a leading American technology company that specializes in the design and development of programmable logic devices, such as Field-Programmable Gate Arrays (FPGAs) and System on Chips (SoCs). -
Application Field
The XC3S700AN-4FGG484I is a field-programmable gate array (FPGA) device that can be used in various application areas including telecommunications, consumer electronics, industrial automation, and aerospace and defense. It provides programmable logic integration and high-performance processing capabilities, making it suitable for a wide range of embedded systems and digital circuit designs. -
Package
The XC3S700AN-4FGG484I chip has a Ball Grid Array (BGA) package type, a 484-pin package size, and a form called Flip Chip.
Datasheet PDF
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