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Xilinx XC3S700A-4FGG400I
Compact FBGA-400 FPGA
Brands: Amd
Mfr.Part #: XC3S700A-4FGG400I
Datasheet: XC3S700A-4FGG400I Datasheet (PDF)
Package/Case: FBGA-400
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 3607 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC3S700A-4FGG400I General Description
The XC3S700A-4FGG400I is a field-programmable gate array (FPGA) manufactured by Xilinx. It belongs to the Spartan-3A family of FPGAs and features 700,000 system gates. The "4FGG400I" designation specifies the speed grade, package type, and temperature range of the FPGA. The XC3S700A-4FGG400I offers a range of features to support a variety of applications, including 4,608 slices, 48Kb of block RAM, 280 user I/Os, and four digital clock managers (DCMs) for clock management. It also includes built-in 18x18-bit multipliers for DSP applications, as well as support for PCI Express, Ethernet, and other high-speed interfaces.The FPGA operates at a speed of up to 350MHz and supports various configuration options, including SPI, BPI, and parallel programming. It also includes advanced power management features to optimize power consumption based on the specific application requirements.
Features
- 700,000 system gates
- 5488 slices with four 6-input LUTs and 8 flip-flops each
- 2 x 36 Kb block RAMs
- 18 x 18 multipliers
- 24 DSP slices
- 400-pin Fine pitch BGA package
- Industrial grade (-I) operating temperature range
Application
- Embedded system design
- Digital signal processing
- Telecommunications
- Networking
- Industrial automation
- Consumer electronics
- Medical devices
- Defense and aerospace applications
- Video and image processing
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Product Category | FPGA - Field Programmable Gate Array | RoHS | Details |
| Series | XC3S700A | Number of Logic Elements | 13248 LE |
| Adaptive Logic Modules - ALMs | 5888 ALM | Embedded Memory | 360 kbit |
| Number of I/Os | 311 I/O | Supply Voltage - Min | 1.14 V |
| Supply Voltage - Max | 1.26 V | Minimum Operating Temperature | - 40 C |
| Maximum Operating Temperature | + 100 C | Mounting Style | SMD/SMT |
| Package / Case | FBGA-400 | Brand | AMD / Xilinx |
| Distributed RAM | 92 kbit | Embedded Block RAM - EBR | 360 kbit |
| Moisture Sensitive | Yes | Number of Gates | 700000 |
| Operating Supply Voltage | 1 V | Product Type | FPGA - Field Programmable Gate Array |
| Factory Pack Quantity | 1 | Subcategory | Programmable Logic ICs |
| Tradename | Spartan |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3S700A-4FGG400I component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : XC3S700A-4FTG256C
Brands :
Package : 256-FTBGA
Description : Extended Spartan-3A FPGAs, Package: 4FTG256C
Part Number : XC3S700A-4VQG100C
Brands :
Package :
Description :
Part Number : XC3S700A-4VQG100I
Brands :
Package :
Description :
Part Number : XC3S700AN-4FTG256C
Brands :
Package :
Description :
Part Number : XC3S700AN-4VQG100C
Brands :
Package :
Description :
Part Number : XC3S700AN-4VQG100I
Brands :
Package :
Description :
Part points
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The XC3S700A-4FGG400I is a field-programmable gate array (FPGA) chip developed by Xilinx. It offers 699,456 logic cells and 1,072 user I/O pins, making it suitable for a wide range of applications. The chip operates on a 1.2V core voltage and supports various I/O standards. It can be programmed to perform complex digital designs and is commonly used in industries such as telecommunications, automotive, and aerospace.
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Features
Some of the key features of the XC3S700A-4FGG400I FPGA include being a Spartan-3A family member with 700K logic cells, a FGGA400 package, and support for various I/O standards. It offers efficient performance and low power consumption, making it suitable for a wide range of applications. -
Pinout
The XC3S700A-4FGG400I is an FPGA (Field-Programmable Gate Array) device. It has a pin count of 400 and is a member of the Xilinx Spartan-3A family. The specific function and pin configuration can be found in the device datasheet provided by Xilinx. -
Manufacturer
The manufacturer of the XC3S700A-4FGG400I is Xilinx. Xilinx is an American technology company known for designing and producing programmable logic devices (PLDs), specifically field-programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs). -
Application Field
The XC3S700A-4FGG400I FPGA from Xilinx can be used in various applications such as data and signal processing, industrial automation, video and image processing, telecommunications, automotive electronics, and aerospace. It provides a flexible and programmable solution for a wide range of system designs requiring high-performance digital logic and processing capabilities. -
Package
The XC3S700A-4FGG400I chip comes in a BGA (Ball Grid Array) package type with 400 pins, its form is integrated circuit and its size is 400 pins.
Datasheet PDF
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