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Xilinx XC3S500E-4FTG256I

Spartan®-3E Field Programmable Gate Array (FPGA) IC 190 368640 10476 256-LBGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC3S500E-4FTG256I

Datasheet: XC3S500E-4FTG256I Datasheet (PDF)

Package/Case: BGA-256

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 3,554 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for XC3S500E-4FTG256I or email to us: Email: [email protected], we will contact you within 12 hours.

XC3S500E-4FTG256I General Description

Spartan®-3E Field Programmable Gate Array (FPGA) IC 190 368640 10476 256-LBGA

xc3s500e-4ftg256i

Features

  • 500,000 system gates (equivalent to 1.5 million ASIC gates)
  • 12.8 Mb of RAM
  • 476 user I/O pins
  • 4 input global clock network and 4 output global clock network
  • 356 user I/Os (input/output pins)
  • Maximum operating frequency of 450 MHz
  • 256-pin Fine-pitch Ball Grid Array (FBGA) package
  • Operating voltage of 1.2V

Application

  • Video processing and transmission systems
  • Medical imaging equipment
  • Aerospace and defense systems
  • Industrial automation and control systems
  • High-speed data communication equipment
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Manufacturer: Xilinx Product Category: FPGA - Field Programmable Gate Array
RoHS: Details Series: XC3S500E
Number of Logic Elements: 10476 LE Adaptive Logic Modules - ALMs: 4656 ALM
Embedded Memory: 360 kbit Number of I/Os: 190 I/O
Supply Voltage - Min: 1.14 V Supply Voltage - Max: 1.26 V
Minimum Operating Temperature: - 40 C Maximum Operating Temperature: + 100 C
Data Rate: - Number of Transceivers: -
Mounting Style: SMD/SMT Package / Case: FBGA-256
Brand: Xilinx Distributed RAM: 73 kbit
Embedded Block RAM - EBR: 360 kbit Maximum Operating Frequency: 300 MHz
Moisture Sensitive: Yes Number of Gates: 500000
Operating Supply Voltage: 1.2 V Product Type: FPGA - Field Programmable Gate Array
Factory Pack Quantity: 1 Subcategory: Programmable Logic ICs
Tradename: Spartan

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC3S500E-4FTG256I component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC3S500E-4FT256C

Brands :  

Package :   BGA256

Description :   Spartan-3E Family 500K Gates 10476 Cells 572MHz 90nm (CMOS) Technology 1.2V

Part Number :   XC3S500E-4FG320C

Brands :  

Package :   BGA-320

Description :   500K Gates 10476 Cells 572MHz 90nm (CMOS) Technology 1.2V

Part Number :   XC3S500E-4FGG320C

Brands :  

Package :   BGA320

Description :   FPGA Spartan-3E Family 500K Gates 10476 Cells 572MHz 90nm Technology 1.2V 320Pin FBGA

Part Number :   XC3S500E-4FT256I

Brands :  

Package :   FTBGA-256

Description :   500K Gates 10476 Cells 572MHz 90nm (CMOS) Technology 1.2V

Part Number :   XC3S500E-4FGG320I

Brands :  

Package :   BGA320

Description :   Spartan-3E FPGA 232 I/O 320FBGA

Part Number :   XC3S500E-4FTG256C

Brands :  

Package :   BGA-256

Description :   Spartan®-3E Family 500K Gates 10476 Cells 572MHz 90nm (CMOS) Technology 1.2V

Part Number :   XC3S500E-4FGG320I

Brands :  

Package :   BGA320

Description :   Spartan-3E FPGA 232 I/O 320FBGA

Part Number :   XC3S500E-4PQG208C

Brands :  

Package :   QFP-208

Description :   FPGA Spartan-3E Family 500K Gates 10476 Cells 572MHz 90nm (CMOS) Technology 1.2V

Part points

  • The XC3S500E-4FTG256I chip is a field-programmable gate array (fpga) product from xilinx. it offers a large capacity of 500,000 system gates and features an integrated powerpc processor. this fpga chip is used for various applications, including digital signal processing, embedded systems, and protocol bridging. it provides high-performance capabilities and flexibility for designers to develop custom hardware solutions.
  • Equivalent

    Some equivalent products of the XC3S500E-4FTG256I chip include xc3s500e-4vqg100i, xc3s500e-4ftg256, and xc3s500e-4fgg320i.
  • Features

    The main features of the XC3S500E-4FTG256I are as follows: it is a field-programmable gate array (fpga) with 500k system gates, 256-pin fine-pitch ball grid array (fbga) package, 4 speed grades, -4 operating speed, and industrial temperature range. it also offers a high-performance, low-power solution for various applications requiring programmable digital logic.
  • Pinout

    The XC3S500E-4FTG256I is an fpga (field-programmable gate array) device. it has a pin count of 256 and is designed for general-purpose digital logic implementations. the specific pin functions and their assignments would be outlined in the device's datasheet available from the manufacturer.
  • Manufacturer

    The manufacturer of the XC3S500E-4FTG256I is xilinx. xilinx is a semiconductor manufacturing company that specializes in field-programmable gate array (fpga) technology. they develop and produce programmable logic devices that can be customized for various applications such as telecommunications, automotive, aerospace, and industrial sectors.
  • Application Field

    The XC3S500E-4FTG256I is an fpga (field-programmable gate array) that can be used in various application areas such as communications, industrial automation, automotive, aerospace, defense, and consumer electronics. it offers high performance and flexibility for designing and implementing various digital systems.
  • Package

    The XC3S500E-4FTG256I chip is packaged in a 256-pin thin grid array (tga) package form. its size is not explicitly mentioned in the given information.

Datasheet PDF

Preliminary Specification XC3S500E-4FTG256I PDF Download

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