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Xilinx XCV50-6BG256C
Virtex® Field Programmable Gate Array (FPGA) IC 180 32768 1728 256-BBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XCV50-6BG256C
Datasheet: XCV50-6BG256C Datasheet (PDF)
Package/Case: BGA256
Product Type: Programmable Logic ICs
XCV50-6BG256C General Description
Virtex® Field Programmable Gate Array (FPGA) IC 180 32768 1728 256-BBGA
Features
- Number of Logic Cells: 50,000
- Number of CLBs (Configurable Logic Blocks): 2,560
- Number of IOBs (Input/Output Blocks): 216
- Number of DSP (Digital Signal Processing) Slices: 20
- Number of Block RAM: 1.3 Mb
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Manufacturer | Xilinx Inc. | Product Category | Embedded - FPGAs (Field Programmable Gate Array) |
| Series | VirtexR | Package-Case | 256-BBGA |
| Operating-Temperature | 0°C ~ 85°C (TJ) | Mounting-Type | Surface Mount |
| Voltage-Supply | 2.375 V ~ 2.625 V | Supplier-Device-Package | 256-PBGA (27x27) |
| Number-of-Gates | 57906 | Number-of-I-O | 180 |
| Number-of-LABs-CLBs | 384 | Number-of-Logic-Elements-Cells | 1728 |
| Total-RAM-Bits | 32768 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XCV50-6BG256C chip is a field-programmable gate array (FPGA) by Xilinx. It offers 50,000 logic cells and can be used for various applications requiring high-performance processing. With a 6-speed grade, it provides enhanced performance and flexibility. The chip is housed in a 256-ball grid array (BGA) package, making it suitable for compact designs and low-power applications.
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Equivalent
There are no direct equivalent products to the XCV50-6BG256C chip. However, you may look for similar devices like XCV50, Virtex-I E FPGAs, or other members of the Xilinx Virtex-I E FPGA family that offer similar features and capabilities. -
Features
The XCV50-6BG256C is a field-programmable gate array (FPGA) with 50,000 logic cells, a 1360 MHz maximum operating frequency, 256 I/O pins, 18-bit input/output width, and 6,000 CLBs (Configurable Logic Blocks). It offers high-performance and flexible programmability for various applications in industries like telecommunications, automotive, and aerospace. -
Pinout
The XCV50-6BG256C has 256 pins. It is an FPGA (Field-Programmable Gate Array) with 50,000 logic cells and a speed grade of -6. It has various functions, including digital signal processing, high-speed communication interfaces, and general-purpose logic applications. -
Manufacturer
The manufacturer of the XCV50-6BG256C is Xilinx Inc. Xilinx Inc. is a semiconductor company that specializes in the development and production of programmable logic devices, including Field-Programmable Gate Arrays (FPGAs). They provide programmable platforms and solutions that enable a wide range of applications, such as data centers, embedded systems, and aerospace/defense projects. -
Application Field
The XCV50-6BG256C FPGA is commonly used in various application areas including telecommunications, industrial automation, automotive, aerospace, and defense sectors. It is specifically designed for high-performance applications that require programmable logic flexibility and advanced processing capabilities. -
Package
The XCV50-6BG256C chip package type is BGA (Ball Grid Array), form factor is 256-BGA (17x17), and the size is 256-ball with a pitch of 1 mm.
Datasheet PDF
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