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Xilinx XC3S500E-4FGG320C

Field Programmable Gate Array, 1164 CLBs, 500000 Gates, 572MHz, 10476-Cell, CMOS, PBGA320

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC3S500E-4FGG320C

Datasheet: XC3S500E-4FGG320C Datasheet (PDF)

Package/Case: BGA320

Product Type: FPGAs (Field Programmable Gate Array)

RoHS Status:

Stock Condition: 3,881 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

Quick Quote

Please submit RFQ for XC3S500E-4FGG320C or email to us: Email: [email protected], we will contact you within 12 hours.

XC3S500E-4FGG320C General Description

PLD Logic; Programmable Logic Type:FPGA; Logic Type:FPGA; Logic Family:CMOS; Logic Base Number:3S500; No. of I/O Pins:232; Frequency Max:572MHz; I/O Output Drive:12 mA; Supply Voltage Min:1.14V; Supply Voltage Max:1.26V ;RoHS Compliant: Yes

xc3s500e-4fgg320c

Features

  • 500,000 system gates
  • 18,432 logic cells
  • 24 Digital Signal Processing (DSP) slices
  • 2.1 Mb Block RAM
  • 500 MHz maximum clock frequency
  • 1.2V core voltage
  • 1.5V to 3.3V I/O voltage range
  • 320-pin Fine-pitch Ball Grid Array (FBGA) package

Application

  • Industrial control systems
  • Automotive electronics
  • Aerospace and defense systems
  • High-performance computing
  • Audio and video processing
  • Medical equipment
  • Communications equipment
  • Test and measurement equipment
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Case/Package BGA Mount Surface Mount
Number of Pins 320 Frequency 572 MHz
Max Operating Temperature 85 °C Max Supply Voltage 1.26 V
Min Operating Temperature 0 °C Min Supply Voltage 1.14 V
Number of Gates 500000 Number of I/Os 232
Number of Logic Blocks (LABs) 1164 Number of Logic Elements/Cells 10476
Number of Macrocells 10476 Number of Registers 9312
Operating Supply Voltage 1.2 V RAM Size 45 kB
Speed Grade 4 Height 1.4 mm
Length 19 mm

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC3S500E-4FGG320C component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC3S500E-4FTG256C

Brands :  

Package :   BGA-256

Description :   Spartan®-3E Family 500K Gates 10476 Cells 572MHz 90nm (CMOS) Technology 1.2V

Part Number :   XC3S500E-4PQG208C

Brands :  

Package :   QFP-208

Description :   FPGA Spartan-3E Family 500K Gates 10476 Cells 572MHz 90nm (CMOS) Technology 1.2V

Part Number :   XC3S500E-4FT256C

Brands :  

Package :   BGA256

Description :   Spartan-3E Family 500K Gates 10476 Cells 572MHz 90nm (CMOS) Technology 1.2V

Part Number :   XC3S500E-4VQG100C

Brands :  

Package :   QFP-100

Description :   FPGA Spartan®-3E Family 500K Gates 10476 Cells 572MHz 90nm (CMOS) Technology 1.2V

Part Number :   XC3S500E-4VQG144C

Brands :  

Package :  

Description :  

Part Number :   XC3S500E-5FT256C

Brands :  

Package :   BGA256

Description :   Spartan-3E FPGA 190 I/O 256FTBGA

Part Number :   XC3S500E-5VQ100C

Brands :  

Package :   QFP

Description :  

Part Number :   XC3S500E-5VQG100C

Brands :  

Package :   QFP100

Description :  

Part Number :   XC3S500E-5VQG144C

Brands :  

Package :  

Description :  

Part Number :   XC3S500E-5VQG324C

Brands :  

Package :  

Description :  

Part points

  • The XC3S500E-4FGG320C chip is an FPGA (Field-Programmable Gate Array) from Xilinx. It features 500K system gates, 1.5Mbits of block RAM, and 360 multipliers. It operates with a supply voltage of 1.14 to 1.26V and has a maximum operating frequency of 550MHz. It offers various features and capabilities for designing and implementing custom digital logic circuits in electronic devices.
  • Equivalent

    Some equivalent products of the XC3S500E-4FGG320C chip are XC3S500E-4PQ208C, XC3S500E-4FTG256C, XC3S500E-4PQG208C, and XC3S500E-4VQG100C.
  • Features

    The XC3S500E-4FGG320C is an FPGA (Field Programmable Gate Array) device from Xilinx. Its features include a Spartan-3E FPGA with 4,608 logic cells, 24 digital signal processing (DSP) slices, and 216 KB of Block RAM. It operates at a maximum clock frequency of 250 MHz and offers various I/O interfaces, including LVCMOS, LVTTL, and differential signaling.
  • Pinout

    The XC3S500E-4FGG320C is a field-programmable gate array (FPGA) with a pin count of 320. The specific pin functions may vary depending on the configuration and application, but typical functions include input/output (I/O), clock, power, and ground pins.
  • Manufacturer

    The manufacturer of the XC3S500E-4FGG320C is Xilinx. It is a semiconductor manufacturing company specializing in programmable logic devices and associated technologies.
  • Application Field

    The XC3S500E-4FGG320C is commonly used in applications such as industrial automation, automotive electronics, telecommunications, and medical equipment. It is suitable for implementing a wide range of digital functions, including signal processing, data communication, and control systems.
  • Package

    The XC3S500E-4FGG320C chip comes in a Flip Chip Fine-Pitch Ball Grid Array package (FGG) with a 320 pin count. Its form factor is approximately rectangular, measuring 17 mm x 17 mm in size.

Datasheet PDF

Preliminary Specification XC3S500E-4FGG320C PDF Download

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