Xilinx XC3S500E-4FTG256C
Spartan®-3E Field Programmable Gate Array (FPGA) IC 190 368640 10476 256-LBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S500E-4FTG256C
Datasheet: XC3S500E-4FTG256C Datasheet (PDF)
Package/Case: BGA-256
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2458 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC3S500E-4FTG256C General Description
Spartan®-3E Field Programmable Gate Array (FPGA) IC 190 368640 10476 256-LBGA
Features
- 500K system gates
- 18,816 logic cells
- 360 macrocells (each macrocell can implement up to 64 flip-flops or up to 8 18x18-bit multipliers)
- 500MHz maximum operating frequency
- 1.2V core voltage
- 3.3V I/O voltage
- 256-pin Fine-Pitch Ball-Grid Array (FBGA) package
- Built-in SelectIO technology for high-speed serial communication
- On-chip Digital Clock Manager (DCM) for precise clock generation and distribution
- On-chip PowerPC 405 processor core (optional)
Application
- Video and image processing
- Wireless communication
- Industrial automation and control
- Medical imaging and equipment
- High-performance computing
- Aerospace and defense systems
- Test and measurement equipment
Specifications
Parameter | Value | Parameter | Value |
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Pin Count | 256 | Package Category | BGA |
Released Date | Oct 4, 2021 |
Shipping
Shipping Type | Ship Fee | Lead Time | |
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC3S500E-4FTG256C chip is a field-programmable gate array (FPGA) manufactured by Xilinx. It has 500,000 system gates and is designed to be highly programmable and customizable for various applications. The 4FTG256C package denotes the physical housing of the chip. It offers flexibility and performance for digital logic implementation and is commonly used in areas such as telecommunications, aerospace, and automotive industries.
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Equivalent
Some equivalent products of the XC3S500E-4FTG256C chip are Xilinx Spartan-3E XC3S500E-FT256 and XC3S200E-4FTG256C FPGA chips. -
Features
The XC3S500E-4FTG256C is a field-programmable gate array (FPGA) with 500,000 system gates. It operates on a 1.2V core voltage and supports a maximum internal operating frequency of 450 MHz. It has 18,816 logic cells and 192 I/O pins, making it suitable for various applications requiring high-performance digital processing. -
Pinout
The pin count of the XC3S500E-4FTG256C is 256. It is a field-programmable gate array (FPGA) with 500,000 system gates and an on-chip processor. The specific functions of the pins will vary based on the configuration of the FPGA and the design implemented. -
Manufacturer
The manufacturer of the XC3S500E-4FTG256C is Xilinx Inc. Xilinx is an American technology company specializing in field-programmable gate arrays (FPGAs). They design, develop, and market programmable logic solutions used in a variety of industries including aerospace, automotive, telecommunications, and more. -
Application Field
The XC3S500E-4FTG256C is a field-programmable gate array (FPGA) that can be used in a variety of applications including telecommunications, data centers, industrial automation and control systems, aerospace and defense, and medical imaging. It offers an efficient and flexible solution for designing and implementing complex digital systems in these areas. -
Package
The XC3S500E-4FTG256C chip has a package type of FBGA (Fine-Pitch Ball Grid Array), a form of BGA (Ball Grid Array), and a size of 256 pins.
Datasheet PDF
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