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Xilinx XC3S500E-4PQG208C

Spartan®-3E Field Programmable Gate Array (FPGA) IC 158 368640 10476 208-BFQFP

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC3S500E-4PQG208C

Datasheet: XC3S500E-4PQG208C Datasheet (PDF)

Package/Case: QFP-208

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2781 pcs, New Original

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XC3S500E-4PQG208C General Description

Field Programmable Gate Array, 1164 CLBs, 500000 Gates, 572MHz, 10476-Cell, CMOS, PQFP208, 30.5 X 30.5 MM, 4.10 MM HEIGHT, 0.50 MM PITCH, PLASTIC, LEAD FREE, QFP-208

xc3s500e-4pqg208c

Features

  • It has 500,000 system gates and 1,006 user I/Os.
  • It has 36,864 logic cells and 4,608 Kbits of block RAM.
  • It operates at a maximum frequency of 400 MHz.
  • It has a 1.2V core voltage and 2.5V or 3.3V I/O voltage options.
  • It supports a variety of standard communication protocols, including Ethernet, USB, PCI Express, and HDMI.
  • It has advanced features for security, power management, and system integration.

Application

  • Communications: It can be used to implement high-speed networking equipment, such as routers and switches.
  • Video and Image Processing: It can be used to implement image and video processing systems, such as video surveillance and multimedia devices.
  • Industrial Control: It can be used to implement control systems for industrial automation, such as programmable logic controllers (PLCs) and motor control.
  • Aerospace and Defense: It can be used in aerospace and defense applications, such as radar and signal processing systems.

Specifications

Parameter Value Parameter Value
Pin Count 208 Package Category Quad Flat Packages
Released Date Jul 31, 2015

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC3S500E-4PQG208C component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   EP3C40F780C8N

Brands :  

Package :   FBGA-780

Description :   FPGA, CYCLONE III, 40K LE, 780FBGA Programmable Logic Type:FPGA; Logic IC function:FPGA; Logic IC family:Cyclone III; Logic IC Base Number:3; I/O lines, No. of:535;

Part Number :   A3P1000-2FG144I

Brands :  

Package :  

Description :  

Part Number :   LX1000E-1F900C

Brands :  

Package :  

Description :  

Part Number :   EP4CE10F17C8LN

Brands :  

Package :   FBGA-256

Description :   FPGA - Field Programmable Gate Array FPGA - Cyclone IV E 645 LABs 179 IOs

Part Number :   XC6SLX9-2FTG256C

Brands :  

Package :   BGA256

Description :   Field Programmable Gate Array, 715 CLBs, 667MHz, 9152-Cell, CMOS, PBGA256, 17 X 17MM, 1MM PITCH, LEAD FREE, FBGA-256

Part points

  • The XC3S500E-4PQG208C chip is an integrated circuit with 500,000 system gates and advanced features for FPGA (Field-Programmable Gate Array) applications. It includes a variety of resources such as logic blocks, memory blocks, and routing infrastructure that can be configured based on specific requirements. The chip offers high performance, low power consumption, and flexibility, making it suitable for a wide range of digital designs.
  • Equivalent

    Some equivalent products of the XC3S500E-4PQG208C chip include the XC3S500E-4FGG320C, XC3S500E-4PQG208I, and XC3S500E-4FTG256C. These chips offer similar functionality and can be used as alternatives in certain applications.
  • Features

    The XC3S500E-4PQG208C is a Spartan-3E FPGA with 500,000 system gates, 512 macrocells, and 36 I/O pins. It operates at a maximum speed of 400 MHz, has a 1.2V core voltage, and supports various configuration options. It also includes integrated block RAM, digital clock managers, and multiple power-saving features.
  • Pinout

    The XC3S500E-4PQG208C is a field-programmable gate array (FPGA) with a pin count of 208. It is capable of implementing complex digital logic circuits. The specific functions of the pins can be found in the datasheet provided by the manufacturer.
  • Manufacturer

    The manufacturer of the XC3S500E-4PQG208C is Xilinx Inc. It is an American technology company specializing in the manufacturing of programmable logic devices.
  • Application Field

    The XC3S500E-4PQG208C is a field-programmable gate array (FPGA) that is commonly used in various applications such as telecommunications, imaging and video processing, automotive systems, aerospace, consumer electronics, and industrial automation. It offers high-performance processing, great flexibility, and versatility for different complex digital designs and applications.
  • Package

    The XC3S500E-4PQG208C chip has a package type of PQG208, a form factor of 208 pin grid array, and a size of 17 x 17 mm.

Datasheet PDF

Preliminary Specification XC3S500E-4PQG208C PDF Download

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