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THGBMJG8C4LBAU8
MLC NAND Flash Serial e-MMC 3.3V 256G-bit 153-Pin FBGA
Brands: Kioxia
Mfr.Part #: THGBMJG8C4LBAU8
Datasheet: THGBMJG8C4LBAU8 Datasheet (PDF)
Package/Case: FBGA-153
Product Type: eMMC
RoHS Status:
Stock Condition: 9458 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomTHGBMJG8C4LBAU8 General Description
FLASH - NAND Memory IC 256Gbit eMMC 153-WFBGA (11.5x13)
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Manufacturer: | Kioxia | Product Category: | eMMC |
| Shipping Restrictions: | This product may require additional documentation to export from the United States. | RoHS: | Details |
| Series: | THGBM | Package / Case: | FBGA-153 |
| Memory Size: | 32 GB | Sequential Read: | 400 MB/s |
| Interface Type: | eMMC 5.1 | Supply Voltage - Min: | 2.7 V |
| Supply Voltage - Max: | 3.6 V | Minimum Operating Temperature: | - 40 C |
| Maximum Operating Temperature: | + 105 C | Packaging: | Tray |
| Brand: | Kioxia America | Dimensions: | 11.5 mm x13 mm x 1.2 mm |
| Moisture Sensitive: | Yes | Mounting Style: | SMD/SMT |
| Product: | eMMC Flash Drive | Product Type: | eMMC |
| Factory Pack Quantity: | 152 | Subcategory: | Memory & Data Storage |
| Unit Weight: | 0.142391 oz |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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![Product]( "Product")
Step1 :Product
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![Vacuum packaging]( "Vacuum packaging")
Step2 :Vacuum packaging
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![Anti-static bag]( "Anti-static bag")
Step3 :Anti-static bag
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![Individual packaging]( "Individual packaging")
Step4 :Individual packaging
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![Packaging boxes]( "Packaging boxes")
Step5 :Packaging boxes
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![bar-code shipping tag]( "bar-code shipping tag")
Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The THGBMJG8C4LBAU8 chip is a reliable and high-performance NAND flash memory solution. It offers fast read and write speeds, high capacity storage, and low power consumption. With its compact size and durability, this chip is suitable for a wide range of applications including smartphones, tablets, and other portable devices.
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Equivalent
The equivalent products of THGBMJG8C4LBAU8 chip are the Micron MT29F64G08CBABAWP and the Samsung K9HKGY8S0B chip. These chips have similar specifications and functionality, making them compatible alternatives for the THGBMJG8C4LBAU8 chip in various electronic devices. -
Features
1. NAND Flash Type: 3D TLC 2. Capacity: 128 GB 3. Interface: Toggle DDR 4. Package: 12x16 x1.15mm 5. VccQ: 2.7-3.6V 6. Temperature Range: -25 to 85°C 7. Performance: Sequential Read up to 740 MB/s, Sequential Write up to 515 MB/s 8. Endurance: 100 TBW -
Pinout
The THGBMJG8C4LBAU8 is a 169-ball package NAND flash memory with a pin count of 169. The main function of this component is to store data and program code in electronic devices such as smartphones, tablets, and SSDs. -
Manufacturer
The manufacturer of the THGBMJG8C4LBAU8 is Toshiba. Toshiba is a multinational conglomerate company based in Japan that specializes in various products and services, including information technology and communications equipment, consumer electronics, and home appliances. -
Application Field
The THGBMJG8C4LBAU8 is commonly used in industrial and automotive applications due to its high storage capacity, reliability, and durability. It is also utilized in consumer electronics such as smartphones, tablets, and laptops for its fast data transfer speeds and energy efficiency. -
Package
The THGBMJG8C4LBAU8 chip is in a ball grid array (BGA) package, with a form factor of 11.5mm x 13mm x 0.8mm. The size of the chip is 256 gigabytes.
We provide high quality products, thoughtful service and after sale guarantee
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![Product]( "Product")
We have rich products, can meet your various needs.
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![quantity]( "quantity")
Minimum order quantity starts from 1pcs.
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![shipping]( "shipping")
Lowest international shipping fee starts from $0.00
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![guarantee]( "guarantee")
365 days quality guarantee for all products
