Xilinx XC3S5000-4FGG900I
Spartan®-3 Field Programmable Gate Array (FPGA) IC 633 1916928 74880 900-BBGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S5000-4FGG900I
Datasheet: XC3S5000-4FGG900I Datasheet (PDF)
Package/Case: BGA-900
RoHS Status:
Stock Condition: 3415 pcs, New Original
Product Type: Programmable Logic ICs
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
Qty | Unit Price | Ext Price |
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1 | $1158.664 | $1158.664 |
189 | $462.315 | $87377.535 |
513 | $446.866 | $229242.258 |
999 | $439.232 | $438792.768 |
In Stock:3415 PCS
XC3S5000-4FGG900I General Description
Spartan®-3 Field Programmable Gate Array (FPGA) IC 633 1916928 74880 900-BBGA
Features
- Number of logic cells: 5000K
- Number of I/O pins: 432
- Clock management tiles: 8
- Digital Signal Processing (DSP) slices: 352
- Block RAM: 4.3 Mb
- Maximum operating frequency: 625 MHz
- Package: FG900
Application
- Digital signal processing
- Image processing
- Communications
- High-performance computing
- Industrial control systems
- Aerospace and defense
- Video processing and display
Specifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
RoHS: | Details | Series: | XC3S5000 |
Number of Logic Elements: | 74880 LE | Number of I/Os: | 633 I/O |
Supply Voltage - Min: | 1.2 V | Supply Voltage - Max: | 1.2 V |
Minimum Operating Temperature: | - 40 C | Maximum Operating Temperature: | + 100 C |
Mounting Style: | SMD/SMT | Package / Case: | FBGA-900 |
Brand: | Xilinx | Distributed RAM: | 520 kbit |
Embedded Block RAM - EBR: | 1872 kbit | Maximum Operating Frequency: | 280 MHz |
Moisture Sensitive: | Yes | Number of Gates: | 5000000 |
Operating Supply Voltage: | 1.2 V | Product Type: | FPGA - Field Programmable Gate Array |
Factory Pack Quantity: | 1 | Subcategory: | Programmable Logic ICs |
Tradename: | Spartan |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3S5000-4FGG900I component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : XC3S5000-4FG900C
Brands :
Package : BGA900
Description : 5000000 SYSTEM GATE 1.2 VOLT FPGA
Part Number : XC3S5000-4FG900I
Brands :
Package : 900-BBGA
Description : 5000000 SYSTEM GATE 1.2 VOLT FPGA
Part Number : XC3S5000-4FG900T
Brands :
Package :
Description :
Part Number : XC3S5000-4FG901C
Brands :
Package :
Description :
Part Number : XC3S5000-4FG901I
Brands :
Package :
Description :
Part Number : XC3S5000-4FG901T
Brands :
Package :
Description :
Part points
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The XC3S5000-4FGG900I chip is a high-performance field-programmable gate array (FPGA) produced by Xilinx. It features a capacity of 5 million system gates and belongs to the Spartan-3 family. This chip offers various benefits, including programmable logic, embedded memory, and built-in digital signal processing (DSP) capabilities. It is suitable for a wide range of applications, such as telecommunications, automotive, and aerospace industries.
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Equivalent
There are no direct equivalent products to the XC3S5000-4FGG900I chip, as it is a specific model from Xilinx's Spartan-3 family of FPGAs. However, there are other FPGA models available in the same family, such as the XC3S2000-4FGG900I and XC3S4000-4FGG900I, which have different capabilities and specifications. -
Features
The features of XC3S5000-4FGG900I are as follows: it has a 5 million system gate capacity, operates with a supply voltage of 1.2V, offers up to 900MHz performance, has 4 GTX multi-gigabit transceivers, and supports up to 500 user I/Os for versatile designs. -
Pinout
The XC3S5000-4FGG900I is an FPGA (Field-Programmable Gate Array) with 900 pins. The pin count refers to the number of external connections or pins available for input/output. The specific pin functions will depend on the configuration and programming of the FPGA. -
Manufacturer
The XC3S5000-4FGG900I is manufactured by Xilinx, Inc. It is an American technology company that specializes in the development and manufacturing of field-programmable gate arrays (FPGAs) and other semiconductor devices. Xilinx is known for its programmable logic solutions that enable customers to create differentiated designs and perform complex digital functions. -
Application Field
The XC3S5000-4FGG900I is a field-programmable gate array (FPGA) suitable for use in a wide range of applications such as telecommunications, data communication, networking equipment, industrial control systems, video and image processing, and high-performance computing. -
Package
The XC3S5000-4FGG900I chip comes in a Ball Grid Array (BGA) package type, with a form factor (size) of 900 pins.
Datasheet PDF
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