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Xilinx XC3S5000-4FGG900I 48HRS

Spartan®-3 Field Programmable Gate Array (FPGA) IC 633 1916928 74880 900-BBGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC3S5000-4FGG900I

Datasheet: XC3S5000-4FGG900I Datasheet (PDF)

Package/Case: BGA-900

RoHS Status:

Stock Condition: 3415 pcs, New Original

Product Type: Programmable Logic ICs

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $1158.664 $1158.664
189 $462.315 $87377.535
513 $446.866 $229242.258
999 $439.232 $438792.768

In Stock:3415 PCS

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Quick Quote

Please submit RFQ for XC3S5000-4FGG900I or email to us: Email: [email protected], we will contact you within 12 hours.

XC3S5000-4FGG900I General Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 633 1916928 74880 900-BBGA

xc3s5000-4fgg900i

Features

  • Number of logic cells: 5000K
  • Number of I/O pins: 432
  • Clock management tiles: 8
  • Digital Signal Processing (DSP) slices: 352
  • Block RAM: 4.3 Mb
  • Maximum operating frequency: 625 MHz
  • Package: FG900

Application

  • Digital signal processing
  • Image processing
  • Communications
  • High-performance computing
  • Industrial control systems
  • Aerospace and defense
  • Video processing and display
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Manufacturer: Xilinx Product Category: FPGA - Field Programmable Gate Array
RoHS: Details Series: XC3S5000
Number of Logic Elements: 74880 LE Number of I/Os: 633 I/O
Supply Voltage - Min: 1.2 V Supply Voltage - Max: 1.2 V
Minimum Operating Temperature: - 40 C Maximum Operating Temperature: + 100 C
Mounting Style: SMD/SMT Package / Case: FBGA-900
Brand: Xilinx Distributed RAM: 520 kbit
Embedded Block RAM - EBR: 1872 kbit Maximum Operating Frequency: 280 MHz
Moisture Sensitive: Yes Number of Gates: 5000000
Operating Supply Voltage: 1.2 V Product Type: FPGA - Field Programmable Gate Array
Factory Pack Quantity: 1 Subcategory: Programmable Logic ICs
Tradename: Spartan

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC3S5000-4FGG900I component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC3S5000-4FG900C

Brands :  

Package :   BGA900

Description :   5000000 SYSTEM GATE 1.2 VOLT FPGA

Part Number :   XC3S5000-4FG900I

Brands :  

Package :   900-BBGA

Description :   5000000 SYSTEM GATE 1.2 VOLT FPGA

Part Number :   XC3S5000-4FG900T

Brands :  

Package :  

Description :  

Part Number :   XC3S5000-4FG901C

Brands :  

Package :  

Description :  

Part Number :   XC3S5000-4FG901I

Brands :  

Package :  

Description :  

Part Number :   XC3S5000-4FG901T

Brands :  

Package :  

Description :  

Part points

  • The XC3S5000-4FGG900I chip is a high-performance field-programmable gate array (FPGA) produced by Xilinx. It features a capacity of 5 million system gates and belongs to the Spartan-3 family. This chip offers various benefits, including programmable logic, embedded memory, and built-in digital signal processing (DSP) capabilities. It is suitable for a wide range of applications, such as telecommunications, automotive, and aerospace industries.
  • Equivalent

    There are no direct equivalent products to the XC3S5000-4FGG900I chip, as it is a specific model from Xilinx's Spartan-3 family of FPGAs. However, there are other FPGA models available in the same family, such as the XC3S2000-4FGG900I and XC3S4000-4FGG900I, which have different capabilities and specifications.
  • Features

    The features of XC3S5000-4FGG900I are as follows: it has a 5 million system gate capacity, operates with a supply voltage of 1.2V, offers up to 900MHz performance, has 4 GTX multi-gigabit transceivers, and supports up to 500 user I/Os for versatile designs.
  • Pinout

    The XC3S5000-4FGG900I is an FPGA (Field-Programmable Gate Array) with 900 pins. The pin count refers to the number of external connections or pins available for input/output. The specific pin functions will depend on the configuration and programming of the FPGA.
  • Manufacturer

    The XC3S5000-4FGG900I is manufactured by Xilinx, Inc. It is an American technology company that specializes in the development and manufacturing of field-programmable gate arrays (FPGAs) and other semiconductor devices. Xilinx is known for its programmable logic solutions that enable customers to create differentiated designs and perform complex digital functions.
  • Application Field

    The XC3S5000-4FGG900I is a field-programmable gate array (FPGA) suitable for use in a wide range of applications such as telecommunications, data communication, networking equipment, industrial control systems, video and image processing, and high-performance computing.
  • Package

    The XC3S5000-4FGG900I chip comes in a Ball Grid Array (BGA) package type, with a form factor (size) of 900 pins.

Datasheet PDF

Preliminary Specification XC3S5000-4FGG900I PDF Download

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