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Xilinx XC3S400A-4FTG256C

Field Programmable Gate Array, 896 CLBs, 400000 Gates, 770MHz, 8064-Cell, CMOS, PBGA400

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC3S400A-4FTG256C

Datasheet: XC3S400A-4FTG256C Datasheet (PDF)

Package/Case: BGA-256

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2721 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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XC3S400A-4FTG256C General Description

FPGA, SPARTAN-3A, 400K, 256FTBGA; No. of Logic Blocks:896; No. of Gates:400000; No. of Macrocells:8064; Family Type:Spartan-3A; No. of Speed Grades:4; Total RAM Bits:368640; No. of I/O's:195; Clock Management:DCM; Core Supply Voltage Range:1.14V to 1.26V; I/O Supply Voltage:3.3V; Operating Frequency Max:320MHz; Operating Temperature Range:0°C to +85°C; Logic Case Style:BGA; No. of Pins:256; MSL:MSL 3 - 168 hours; SVHC:No SVHC (19-Dec-2011)

xc3s400a-4ftg256c

Features

  • 400K system gates
  • 632 I/O pins
  • 1.2V to 1.5V core voltage
  • 4Mbit block RAM
  • Up to 648 user I/Os and up to 24 differential pairs
  • 400MHz internal clock frequency
  • Advanced configuration options such as dynamic reconfiguration and partial reconfiguration
  • Built-in JTAG boundary scan test capability

Application

  • Digital signal processing (DSP)
  • Image processing and recognition
  • Communications
  • Automotive electronics
  • Aerospace and defense
  • Industrial automation and control
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Specifications

Parameter Value Parameter Value
Case/Package BGA Mount Surface Mount
Number of Pins 256 Max Operating Temperature 85 °C
Max Supply Voltage 1.26 V Min Operating Temperature 0 °C
Min Supply Voltage 1.14 V Number of Gates 400000
Number of I/Os 195 Number of Logic Blocks (LABs) 896
Number of Logic Elements/Cells 8064 Number of Macrocells 8064
Operating Supply Voltage 1.2 V RAM Size 45 kB
Speed Grade 4 Height 1 mm
Length 17 mm

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC3S400A-4FTG256C component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC3S400A-4VQG100C

Brands :  

Package :  

Description :  

Part Number :   XC3S400A-4PQ208C

Brands :  

Package :  

Description :  

Part Number :   XC3S400A-4FGG676C

Brands :  

Package :  

Description :  

Part Number :   XC3S400A-4FT256C

Brands :  

Package :   BGA256

Description :   400K Gates 8064 Cells 667MHz 90nm Technology 1.2V

Part Number :   XC3S400A-4FTG256I

Brands :  

Package :   BGA256

Description :   FPGA Spartan -3A Family 400K Gates 8064 Cells 667MHz 90nm Technology 1.2V 256Pin FTBGA

Part points

  • The XC3S400A-4FTG256C chip is a Field-Programmable Gate Array (FPGA) by Xilinx. It belongs to the Spartan-3A family and features 400,000 system gates, 4,560 logic slices, and 16 multipliers. The chip is housed in a 256-pin Fine-Pitch Ball Grid Array (FPBGA) package. It offers flexible reprogramming capabilities and is suitable for various applications in telecommunications, industrial automation, and consumer electronics.
  • Equivalent

    Some equivalent products of the XC3S400A-4FTG256C chip include the Xilinx XC3S400A-4FTG256I, XC3S400A-4VQG100I, and the XC3S400A-4VQG100I-C chips.
  • Features

    The XC3S400A-4FTG256C is a field-programmable gate array (FPGA) with 400K logic cells. It has a high-performance, low-power architecture and multiple I/O standards, making it suitable for a wide range of applications. The device also supports advanced features such as clock management, high-speed serial connectivity, and embedded memory blocks for efficient processing.
  • Pinout

    The XC3S400A-4FTG256C is a Field Programmable Gate Array (FPGA) chip. It has 256 pins and supports various functions such as logic functions, arithmetic functions, and memory functions.
  • Manufacturer

    The manufacturer of the XC3S400A-4FTG256C is Xilinx. Xilinx is a multinational technology company that specializes in the design and manufacturing of programmable logic devices, including field-programmable gate arrays (FPGAs), system on chips (SoCs), and other related products.
  • Application Field

    The XC3S400A-4FTG256C is a field-programmable gate array (FPGA) with 400K system gates. It is commonly used in various applications, including telecommunications, automotive, industrial control, medical systems, and high-performance computing. It can be employed for tasks such as digital signal processing, image and video processing, data encryption, and network routing.
  • Package

    The XC3S400A-4FTG256C chip is in a FBGA (Fine-pitch Ball Grid Array) package, with a 256-ball count and a 0.8mm pitch. It has a size of approximately 17mm x 17mm.

Datasheet PDF

Preliminary Specification XC3S400A-4FTG256C PDF Download

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