Xilinx XC3S400A-4FTG256I

Part points

• The XC3S400A-4FTG256I chip is a member of the Spartan-3A FPGA family by Xilinx. It is implemented with advanced technology and offers high-performance capabilities. This chip features 400,000 system gates and 400 user I/Os, making it suitable for various applications such as industrial control and automotive systems. It is designed for reliability, flexibility, and ease of use in programmable logic applications.

• Equivalent

  Some equivalent products of the XC3S400A-4FTG256I chip are the XC3S400AFG400C, XC3S400AFG400E, XC3S400AFG676C, and XC3S400AFG676I.

• Features

  The XC3S400A-4FTG256I is a Spartan-3A FPGA (Field-Programmable Gate Array) from Xilinx. It has 400,000 system gates, 622 user I/Os, 72 I/O standards, and 4 low-voltage LVDS/SSTL differential I/O pairs. It operates at a maximum speed of 400 MHz and is packaged in a 256-ball grid array (FTG256).

• Pinout

  The XC3S400A-4FTG256I is an FPGA with a 256-pin FTG256 package. It has 400 user I/O pins and performs various functions such as programmable logic, memory, and DSP.

• Manufacturer

  The manufacturer of the XC3S400A-4FTG256I is Xilinx. It is a semiconductor company specializing in the development and manufacture of field-programmable gate arrays (FPGAs), system on chips (SoCs), and other programmable logic devices.

• Application Field

  The XC3S400A-4FTG256I is a field-programmable gate array (FPGA) that can be used in a variety of applications including industrial automation, automotive electronics, telecommunications, medical devices, and aerospace systems.

• Package

  The XC3S400A-4FTG256I chip is in the 256-pin Fine-Pitch Ball Grid Array (FBGA) package type. It comes in a form of a small rectangular package with a grid of solder balls on the underside. The size of the package is 17mm x 17mm.