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Xilinx XC3S400-4FTG256C
ROHS compliant FTBGA-256 Programmable Logic Device XC3S400-4FTG256C
Brands: Amd
Mfr.Part #: XC3S400-4FTG256C
Datasheet: XC3S400-4FTG256C Datasheet (PDF)
Package/Case: FBGA-256
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 3207 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC3S400-4FTG256C General Description
The XC3S400-4FTG256C is a Field Programmable Gate Array (FPGA) manufactured by Xilinx. It is part of the Spartan-3A family of FPGAs and features 400,000 system gates, 5664 logic cells, and 70 I/O pins. The device has a total of 256 available I/Os with 188 user I/Os and 68 dedicated inputs/outputs. The XC3S400-4FTG256C operates at a maximum clock frequency of 294 MHz and supports various I/O standards such as LVCMOS, LVTTL, and LVDS. It has 7260 logic slices, each consisting of a four-input lookup table (LUT) and a flip-flop. The device also includes 144 block RAM/FIFO elements with a total capacity of 864 kilobits.In terms of package type, the XC3S400-4FTG256C comes in a 256-pin fine pitch Ball Grid Array (BGA) package with a footprint of 17x17 mm. It is ideal for various applications such as telecommunications, industrial control, and consumer electronics due to its high logic density and performance capabilities
Features
- FPGA Family: Spartan 3E
- Logic Elements: 400K
- RAM: 18 Kb
- Number of Logic Cells: 24,192
- Number of IOs: 192
- Package: FT256
- Operating Temperature: 0°C to 85°C
- Speed Grade: -4
Application
- Telecommunications
- Network infrastructure
- Industrial automation
- Medical imaging
- Automotive
- Consumer electronics
- Defense and aerospace
- Video and image processing
- Wireless communication
- High-performance computing
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Product Category | FPGA - Field Programmable Gate Array | RoHS | Details |
| Series | XC3S400 | Number of Logic Elements | 8064 LE |
| Adaptive Logic Modules - ALMs | 3584 ALM | Embedded Memory | 288 kbit |
| Number of I/Os | 173 I/O | Supply Voltage - Min | 1.14 V |
| Supply Voltage - Max | 1.26 V | Minimum Operating Temperature | 0 C |
| Maximum Operating Temperature | + 85 C | Mounting Style | SMD/SMT |
| Package / Case | FBGA-256 | Brand | AMD / Xilinx |
| Distributed RAM | 56 kbit | Embedded Block RAM - EBR | 288 kbit |
| Maximum Operating Frequency | 280 MHz | Moisture Sensitive | Yes |
| Number of Gates | 400000 | Operating Supply Voltage | 1.2 V |
| Product Type | FPGA - Field Programmable Gate Array | Factory Pack Quantity | 1 |
| Subcategory | Programmable Logic ICs | Tradename | Spartan |
| Unit Weight | 1 oz |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
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Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3S400-4FTG256C component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : EP3C40F484C8N
Brands :
Package : FBGA-484
Description : FPGA Cyclone® III Family 39600 Cells 402MHz 65nm Technology 1.2V
Part Number : A3P1000-PQ208M
Brands : Microsemi.
Package :
Description :
Part Number : LFXP2-5E-5TN144C
Brands : Lattice Semiconductor.
Package :
Description :
Part points
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The XC3S400-4FTG256C chip is a field-programmable gate array (fpga) integrated circuit by xilinx. it belongs to the spartan-3 family and offers 400,000 system gates. it comes in a 256-ball fine-pitch bga package and operates at a maximum speed of 392 mhz. the chip offers numerous configurable logic blocks (clbs), i/o ports, and other features that make it suitable for various applications like telecommunications, automotive, industrial, and consumer electronics.
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Equivalent
There are no direct equivalent products for the XC3S400-4FTG256C chip. however, alternative options for fpgas with similar specifications and capabilities include intel cyclone iv gx ep4cgx15cf23c8, xilinx spartan-6 lx9 fpga, and altera max 10 10m50daf484c7g. -
Features
The features of XC3S400-4FTG256C include a spartan-3 fpga with 400,000 system gates, a -4 speed grade, and a 256-ball grid array (bga) package. it supports 3.3v i/o operation and offers up to 103 i/o pins. this device also provides advanced features such as high-performance digital signal processing (dsp) capabilities and multiple integrated pci interfaces. -
Pinout
The XC3S400-4FTG256C is a field programmable gate array (fpga) with 400,000 system gates. it has a pin count of 256 and offers various functions necessary for digital circuit design and implementation in embedded systems, such as logic functions, clock management, and i/o interfaces. -
Manufacturer
Xilinx is the manufacturer of the XC3S400-4FTG256C. it is a leading american technology company specializing in the development and production of programmable logic devices, including field-programmable gate arrays (fpgas) and system on chips (socs). -
Application Field
The application areas of the XC3S400-4FTG256C include telecommunications, data processing, industrial control systems, and medical equipment. it can also be used in automotive electronics, aerospace systems, and high-performance computing applications. -
Package
The XC3S400-4FTG256C chip has a package type of ftg256 and a size of 256 pins. it is available in a fine-pitch ball grid array (bga) package form.
Datasheet PDF
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