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Xilinx XC3S200AN-4FTG256I

Spartan-3AN XC3S200AN-4FTG256I

ISO14001 ISO9001 DUNS

Brands: Amd

Mfr.Part #: XC3S200AN-4FTG256I

Datasheet: XC3S200AN-4FTG256I Datasheet (PDF)

Package/Case: FBGA-256

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 3636 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Please submit RFQ for XC3S200AN-4FTG256I or email to us: Email: [email protected], we will contact you within 12 hours.

XC3S200AN-4FTG256I General Description

The XC3S200AN-4FTG256I is a member of the Spartan-3A family of Field-Programmable Gate Arrays (FPGAs) developed by Xilinx. It features a total of 200,000 system gates, 276,480 bits of block RAM, and 288 I/O pins, making it suitable for a wide range of applications that require medium-density logic and signal processing capabilities.This FPGA operates with a supply voltage of 1.14V to 1.26V and supports a wide range of temperatures from -40°C to +85°C. It features 256-ball fine-pitch Ball Grid Array (FTBGA) packaging, making it suitable for applications where space constraints are a concern.The XC3S200AN-4FTG256I also features various built-in features to enhance its functionality, including integrated power-saving modes, SelectI/O technology for implementing a variety of interfaces, and Digital Clock Manager (DCM) blocks for clock management. Additionally, it supports various FPGA configuration methods, including JTAG, Master Serial, Slave Serial, and SelectMAP configuration.

xc3s200an-4ftg256i

Features

  • Spartan-3AN FPGA family
  • 200K system gates
  • 512 Kbits of fast block RAM
  • Integrated DSP blocks
  • SelectIO technology
  • Clock management tiles
  • Built-in Power-on Reset (POR)
  • RoHS compliant
  • FTG256 package
  • -4 speed grade

Application

  • Telecommunications
  • Industrial automation
  • Medical equipment
  • Consumer electronics
  • Automotive applications
  • Networking
  • Military and aerospace
  • Data processing
  • High-speed data acquisition
  • Digital signal processing
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Specifications

Parameter Value Parameter Value
Product Category FPGA - Field Programmable Gate Array RoHS Details
Series XC3S200AN Number of Logic Elements 4032 LE
Adaptive Logic Modules - ALMs 1792 ALM Embedded Memory 288 kbit
Number of I/Os 195 I/O Supply Voltage - Min 1.14 V
Supply Voltage - Max 1.26 V Minimum Operating Temperature - 40 C
Maximum Operating Temperature + 100 C Mounting Style SMD/SMT
Package / Case FBGA-256 Brand AMD / Xilinx
Distributed RAM 28 kbit Embedded Block RAM - EBR 288 kbit
Maximum Operating Frequency 250 MHz Moisture Sensitive Yes
Number of Gates 200000 Operating Supply Voltage 1 V
Product Type FPGA - Field Programmable Gate Array Factory Pack Quantity 1
Subcategory Programmable Logic ICs Tradename Spartan
Unit Weight 0.014110 oz

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC3S200AN-4FTG256I component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC3S200A-4VQG100C

Brands :  

Package :   100-TQFP

Description :   Extended Spartan-3A FPGAs, FBGA

Part Number :   XC3S200A-4TQG144C

Brands :  

Package :  

Description :  

Part Number :   XC3S200A-4VQ100C

Brands :  

Package :   TQFP100

Description :   Extended Spartan-3A FPGAs, Package: 4VQ100C

Part Number :   XC3S200A-4FT256C

Brands :  

Package :   BGA256

Description :   FPGA Spartan-3A Family 200K Gates 4032 Cells 667MHz 90nm Technology 1.2V

Part Number :   XC3S200A-4FTG256C

Brands :  

Package :   FBGA-256

Description :   FPGA Spartan®-3A Family 200K Gates 4032 Cells 667MHz 90nm Technology 1.2V FBGA

Part Number :   XC3S200A-4FGG256C

Brands :  

Package :  

Description :  

Part points

  • The XC3S200AN-4FTG256I chip is a Field-Programmable Gate Array (FPGA) manufactured by Xilinx. It belongs to the Spartan-3AN family and has 200,000 system gates. This chip can be reprogrammed to perform a wide range of digital functions, making it highly flexible and customizable for various applications in the fields of telecommunications, automotive, industrial control, and more.
  • Equivalent

    Some equivalent products of the XC3S200AN-4FTG256I chip include the XC3S200AN-4FTG256C, XC3S200AN-4FFG256I, and XC3S200-4FTG256C chips. These products offer similar specifications and features but may have slight differences in packaging and other details.
  • Features

    The XC3S200AN-4FTG256I is a field-programmable gate array (FPGA) with 200,000 system gates, operating at a clock frequency of up to 350 MHz. It has 1,336 inputs/outputs (I/Os), 192 user I/Os, and 12 digital main voltage supplies. It offers low power consumption and is housed in a 256-pin fine-pitch ball grid array (FBGA) package.
  • Pinout

    The XC3S200AN-4FTG256I is a 256-pin Field Programmable Gate Array (FPGA) with 200,000 system gates. It belongs to the Spartan-3AN family and is designed for high-performance applications. Each pin on the package is used for various functions such as input/output, clocking, power, and programming.
  • Manufacturer

    The XC3S200AN-4FTG256I is manufactured by Xilinx Inc. It is an American technology company specializing in the development and production of programmable logic devices, including field-programmable gate arrays (FPGAs) and related software tools.
  • Application Field

    The XC3S200AN-4FTG256I is a field-programmable gate array (FPGA) with 200,000 logic cells and is suitable for applications such as consumer electronics, industrial automation, medical imaging, and telecommunications. It offers high performance and flexibility for custom design and system integration in various industry sectors.
  • Package

    The XC3S200AN-4FTG256I chip is delivered in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package.

Datasheet PDF

Preliminary Specification XC3S200AN-4FTG256I PDF Download

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