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Xilinx XC3S200A-4FTG256C 48HRS

FPGA - Field Programmable Gate Array XC3S200A-4FTG256C

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC3S200A-4FTG256C

Datasheet: XC3S200A-4FTG256C Datasheet (PDF)

Package/Case: FBGA-256

RoHS Status:

Stock Condition: 2249 pcs, New Original

Product Type: Programmable Logic ICs

Warranty: 1 Year Ovaga Warranty - Find Out More

Pricing

*All prices are in USD

Qty Unit Price Ext Price
1 $21.572 $21.572
30 $20.523 $615.690

In Stock:2249 PCS

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Quick Quote

Please submit RFQ for XC3S200A-4FTG256C or email to us: Email: [email protected], we will contact you within 12 hours.

XC3S200A-4FTG256C General Description

FPGA, SPARTAN-3A, 200K, 256FTBGA; No. of Logic Blocks:448; No. of Gates:200000; No. of Macrocells:4032; Family Type:Spartan-3A; No. of Speed Grades:4; Total RAM Bits:294912; No. of I/O's:195; Clock Management:DCM; Core Supply Voltage Range:1.14V to 1.26V; I/O Supply Voltage:3.3V; Operating Frequency Max:320MHz; Operating Temperature Range:0°C to +85°C; Logic Case Style:BGA; No. of Pins:256; MSL:MSL 3 - 168 hours; SVHC:No SVHC (19-Dec-2011)

xc3s200a-4ftg256c

Features

  • 200,000 logic cells
  • 4-input look-up tables (LUTs)
  • 1,152 Kb block RAM
  • 360 multipliers (18x18)
  • Up to 784 user I/O pins
  • Support for various I/O standards, such as LVCMOS, LVDS, and SSTL
xc3s200a-4ftg256c

Application

  • Video and image processing
  • Networking and communications
  • Embedded systems
  • Industrial automation and control
  • Aerospace and defense electronics

Specifications

Parameter Value Parameter Value
Last Modified Date Jun 6, 2023 6:59 PM UTC

Shipping

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TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

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Payment

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Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
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Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • XC3S200A-4FTG256C is a Field-Programmable Gate Array (FPGA) chip manufactured by Xilinx. It has a capacity of 200,000 logic cells and 18,432 configurable logic blocks, making it suitable for various digital logic applications. The chip uses a 1.2V core voltage and has a maximum operating frequency of 401.4MHz. It comes in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package and offers advanced features for system integration and flexibility in design implementations.
  • Equivalent

    Some equivalent products of the XC3S200A-4FTG256C chip include XC3S200AN-4FTG256C, XC3S200-4TQG144C, and XC3S200-4TQG144I.
  • Features

    The XC3S200A-4FTG256C is a Field-Programmable Gate Array (FPGA) with 200,000 system gates, 378 pins, and a 4ns minimum clock period. It operates at a maximum frequency of 125MHz and has 202 user I/Os, 4 low-power differential I/Os, and 16 dedicated differential inputs.
  • Pinout

    The XC3S200A-4FTG256C is a Field Programmable Gate Array (FPGA) with 256 pins. It has various functions such as digital signal processing, telecommunications, and high-performance computing.
  • Manufacturer

    The manufacturer of the XC3S200A-4FTG256C is Xilinx Inc. It is an American technology company specializing in programmable logic devices and related software. They are known for their field-programmable gate arrays (FPGAs) which are used in various applications including telecommunications, automotive, industrial automation, and more.
  • Application Field

    The XC3S200A-4FTG256C is a Field Programmable Gate Array (FPGA) used in various applications including telecommunications, audio/video processing, automotive, industrial control systems, and test and measurement equipment. It is often used for prototyping, low-power applications, and small to medium-sized projects due to its compact size, low cost, and low power consumption.
  • Package

    The XC3S200A-4FTG256C chip is packaged in a FBGA (Fine-pitch Ball Grid Array) package type with a 256 ball grid array. The form factor is Small Form Factor (SFF), and its size is 17mm x 17mm x 1.4mm.

Datasheet PDF

Preliminary Specification XC3S200A-4FTG256C PDF Download

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