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Xilinx XC3S200AN-4FTG256C

XILINX - XC3S200AN-4FTG256C. - FPGA, SPARTAN-3AN, 200K ELE, 256FTBGA

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC3S200AN-4FTG256C

Datasheet: XC3S200AN-4FTG256C Datasheet (PDF)

Package/Case: BGA-256

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2036 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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Please submit RFQ for XC3S200AN-4FTG256C or email to us: Email: [email protected], we will contact you within 12 hours.

XC3S200AN-4FTG256C General Description

SPARTAN-3AN FPGA, 250MHZ, FTBGA-256; No. of Logic Blocks:4032; No. of Macrocells:4032Macrocells; FPGA Family:Spartan-3AN; Logic Case Style:BGA; No. of Pins:256Pins; No. of Speed Grades:4; Total RAM Bits:288Kbit; No. of I/O s:195I/O s

xc3s200an-4ftg256c

Features

  • 200,000 system gates
  • 622 Mb/s data transfer rate
  • 256-pin fine pitch ball grid array (BGA) package
  • 1.2V core voltage
  • 90nm process technology
  • 3.2 ns minimum clock period
xc3s200an-4ftg256c

Application

  • Industrial control systems
  • Automotive infotainment systems
  • Medical equipment
  • Aerospace and defense systems
  • Video and image processing
  • Telecommunications

Specifications

Parameter Value Parameter Value
Manufacturer: Xilinx Product Category: FPGA - Field Programmable Gate Array
RoHS: Details Series: XC3S200AN
Number of Logic Elements: 4032 LE Adaptive Logic Modules - ALMs: 1792 ALM
Embedded Memory: 288 kbit Number of I/Os: 195 I/O
Supply Voltage - Min: 1.14 V Supply Voltage - Max: 1.26 V
Minimum Operating Temperature: 0 C Maximum Operating Temperature: + 85 C
Data Rate: - Number of Transceivers: -
Mounting Style: SMD/SMT Package / Case: FBGA-256
Brand: Xilinx Distributed RAM: 28 kbit
Embedded Block RAM - EBR: 288 kbit Maximum Operating Frequency: 250 MHz
Moisture Sensitive: Yes Number of Gates: 200000
Operating Supply Voltage: 1 V Product Type: FPGA - Field Programmable Gate Array
Factory Pack Quantity: 1 Subcategory: Programmable Logic ICs
Tradename: Spartan

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Equivalent Parts

For the XC3S200AN-4FTG256C component, you may consider these replacement and alternative parts:

Part Number

Brands

Package

Description

Part Number :   XC3S200-4FTG256C

Brands :  

Package :   BGA-256

Description :   Spartan®-3 Family 200K Gates 4320 Cells 630MHz 90nm Technology 1.2V

Part Number :   XC3S200-4VQG100C

Brands :  

Package :   100-TQFP

Description :   200000 SYSTEM GATE 1.2 VOLT FPGA

Part Number :   XC3S200-4VQ100I

Brands :  

Package :   QFP-100

Description :   FPGA Spartan®-3 Family 200K Gates 4320 Cells 630MHz 90nm Technology 1.2V

Part Number :   XC3S200-4VQG100I

Brands :  

Package :   VQFP-100

Description :   200K Gates 4320 Cells 630MHz 90nm Technology 1.2V

Part Number :   XC3S200-4VQG44C

Brands :  

Package :  

Description :  

Part Number :   XC3S200-4VQG44I

Brands :  

Package :  

Description :  

Part Number :   XC3S200-4VQG64C

Brands :  

Package :  

Description :  

Part Number :   XC3S200-4VQG64I

Brands :  

Package :  

Description :  

Part Number :   XC3S200-5PQG208C

Brands :  

Package :   PQ208

Description :   FPGA Spartan®-3 Family 200K Gates 4320 Cells 725MHz 90nm Technology 1.2V

Part Number :   XC3S200-5PQG208I

Brands :  

Package :   QFP208

Description :   FPGA Spartan?-3 Family 200K Gates 4320 Cells 725MHz 90nm Technology 1.2V 208-Pin PQFP

Part points

  • XC3S200AN-4FTG256C is a Field Programmable Gate Array (FPGA) chip. It is a type of programmable logic device that can be customized by the user after manufacturing. The chip offers 200,000 system gates and 21,504 logic cells. It operates at a maximum frequency of 360 MHz and has 4 input/output banks. The XC3S200AN-4FTG256C chip is commonly used in various applications that require high-performance digital circuitry.
  • Equivalent

    The equivalent products of the XC3S200AN-4FTG256C chip are XC3S200AN-4FTG256I, XC3S200AN-4FG256C, XC3S200AN-4FG256I, XC3S200ANT-4FG256C, and XC3S200ANT-4FG256I.
  • Features

    The XC3S200AN-4FTG256C is a member of Xilinx's Spartan-3AN FPGA family. It offers 200,000 system gates, 4Mbit of internal RAM, 216 I/O pins, a 16-bit LVDS interface, and a maximum operating frequency of 133 MHz. It is designed for low-power applications, with its advanced power management features providing optimal power efficiency.
  • Pinout

    The XC3S200AN-4FTG256C is an FPGA (Field-Programmable Gate Array) with a pin count of 256. It consists of programmable logic blocks and memory elements that can be programmed to perform various functions, making it suitable for applications such as digital signal processing, high-speed communication, and embedded systems.
  • Manufacturer

    The manufacturer of the XC3S200AN-4FTG256C is Xilinx, Inc. It is a semiconductor company that specializes in developing programmable logic devices, software design tools, and intellectual property cores.
  • Application Field

    The XC3S200AN-4FTG256C FPGA can be used in various application areas such as industrial control systems, automotive electronics, consumer electronics, telecommunications, and aerospace and defense. It offers flexibility and high-performance capabilities for designing and implementing complex digital systems.
  • Package

    The XC3S200AN-4FTG256C chip is packaged in a FTG 256-pin Grid Array (PGA) package with a form factor of 15mm × 15mm and a size of 256 pins.

Datasheet PDF

Preliminary Specification XC3S200AN-4FTG256C PDF Download

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