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Xilinx XC3S2000-4FG676C
Spartan®-3 Field Programmable Gate Array (FPGA) IC 489 737280 46080 676-BGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S2000-4FG676C
Datasheet: XC3S2000-4FG676C Datasheet (PDF)
Package/Case: BGA676
RoHS Status:
Stock Condition: 3871 pcs, New Original
Product Type: Programmable Logic ICs
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $236.649 | $236.649 |
| 200 | $91.581 | $18316.200 |
| 500 | $88.363 | $44181.500 |
| 1000 | $86.772 | $86772.000 |
In Stock:3871 PCS
XC3S2000-4FG676C General Description
Spartan®-3 Field Programmable Gate Array (FPGA) IC 489 737280 46080 676-BGA
Features
- It has a capacity of 2 million system gates
- 2,048 input/output (I/O) pins
- Configurable Logic Blocks (CLBs)
- Digital Signal Processing (DSP) blocks
- Block RAM and Distributed RAM
- Built-in clock management circuitry
- PowerPC Processor Core
Application
- High-performance digital signal processing
- Video and image processing
- Aerospace and defense systems
- Industrial automation and control systems
- Telecommunications and networking
- Medical equipment
- Automotive and transportation systems
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Manufacturer: | Xilinx | Product Category: | FPGA - Field Programmable Gate Array |
| Series: | XC3S2000 | Number of Logic Elements: | 46080 LE |
| Number of I/Os: | 489 I/O | Supply Voltage - Min: | 1.2 V |
| Supply Voltage - Max: | 1.2 V | Minimum Operating Temperature: | 0 C |
| Maximum Operating Temperature: | + 85 C | Mounting Style: | SMD/SMT |
| Package / Case: | FBGA-676 | Brand: | Xilinx |
| Distributed RAM: | 320 kbit | Embedded Block RAM - EBR: | 720 kbit |
| Maximum Operating Frequency: | 280 MHz | Moisture Sensitive: | Yes |
| Number of Gates: | 2000000 | Operating Supply Voltage: | 1.2 V |
| Product Type: | FPGA - Field Programmable Gate Array | Factory Pack Quantity: | 1 |
| Subcategory: | Programmable Logic ICs | Tradename: | Spartan |
| Unit Weight: | 0.352740 oz |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
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DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
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UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
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EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
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Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
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Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3S2000-4FG676C component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : Virtex-4
Brands :
Package : BGA
Description :
Part Number : Virtex-5
Brands :
Package :
Description :
Part Number : Virtex-6
Brands :
Package :
Description : XC6VLX75T-1FF784C
Part Number : Virtex-7
Brands :
Package :
Description : XC7VX690T-2FFG1761C
Part Number : Kintex-7
Brands :
Package :
Description : XC7K325T-2FFG900C
Part points
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The XC3S2000-4FG676C chip is a field-programmable gate array (FPGA) device manufactured by Xilinx. It has a capacity of 2 million system gates, uses 65nm technology, and is housed in a 676-ball grid array package. The chip offers high-performance computing capabilities, allowing for flexible programming and reconfigurability in various applications such as telecommunications, aerospace, and industrial automation.
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Equivalent
XC3S2000-4FG676C is an FPGA chip from Xilinx. Equivalent products in terms of specifications and features would be other Xilinx FPGA chips, such as XC3S2000 in different package options or chips from the same series like XC3S4000-4FG676C, which has a larger capacity. The exact choice depends on individual requirements and availability. -
Features
The key features of XC3S2000-4FG676C are a Spartan-3 FPGA, 2 million system gates, 204,800 logic cells, 4-input Look-Up Tables, 2,592 Kbits of block RAM, 516 Kbits distributed RAM, and 104 dedicated multiplier blocks. It also offers up to 622 user I/Os, 48 DSP slices, and a maximum operating frequency of 500 MHz. -
Pinout
The XC3S2000-4FG676C is a field-programmable gate array (FPGA) with 676 pins. The function of this FPGA is to perform digital logic functions and can be programmed to implement custom digital designs. -
Manufacturer
The manufacturer of the XC3S2000-4FG676C is Xilinx Inc. Xilinx is a multinational technology company that designs and develops programmable logic devices (PLDs) and associated software tools. They are known for their advancements in Field-Programmable Gate Array (FPGA) technology, providing solutions for industries such as aerospace, automotive, telecommunications, and more. -
Application Field
The XC3S2000-4FG676C is used in various application areas including telecommunications, automotive, consumer electronics, medical devices, and industrial automation. It is suitable for applications that require high-performance and low-power consumption, such as data processing, image and video processing, signal processing, networking, and control systems. -
Package
The XC3S2000-4FG676C chip is in a FG676 package type, has a 4FG speed grade, and has a size of 676 pins.
Datasheet PDF
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