Xilinx XC3S200-4PQG208C
Spartan®-3 Field Programmable Gate Array (FPGA) IC 141 221184 4320 208-BFQFP
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S200-4PQG208C
Datasheet: XC3S200-4PQG208C Datasheet (PDF)
Package/Case: 208-BFQFP
Product Type: Programmable Logic ICs
RoHS Status:
Stock Condition: 2397 pcs, New Original
Warranty: 1 Year Ovaga Warranty - Find Out More
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Add To BomXC3S200-4PQG208C General Description
Spartan®-3 Field Programmable Gate Array (FPGA) IC 141 221184 4320 208-BFQFP
Features
IC FPGA 141 I/O 208PQFPIC FPGA 141 I/O 208PQFPSpecifications
Parameter | Value | Parameter | Value |
---|---|---|---|
Mfr | AMD | Series | Spartan®-3 |
Package | Tray | Product Status | Obsolete |
Programmabe | Not Verified | Number of LABs/CLBs | 480 |
Number of Logic Elements/Cells | 4320 | Total RAM Bits | 221184 |
Number of I/O | 141 | Number of Gates | 200000 |
Voltage - Supply | 1.14V ~ 1.26V | Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) | Package / Case | 208-BFQFP |
Supplier Device Package | 208-PQFP (28x28) |
Shipping
Shipping Type | Ship Fee | Lead Time | |
---|---|---|---|
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days | |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days | |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days | |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days | |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time:Shipping fee depend on different zone and country.
Payment
Terms of payment | Hand Fee | |
---|---|---|
Wire Transfer | charge US$30.00 banking fee. | |
Paypal | charge 4.0% service fee. | |
Credit Card | charge 3.5% service fee. | |
Western Union | charge US.00 banking fee. | |
Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Step1 :Product
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Step2 :Vacuum packaging
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Step3 :Anti-static bag
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Step4 :Individual packaging
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Step5 :Packaging boxes
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Step6 :bar-code shipping tag
All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Part points
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The XC3S200-4PQG208C chip is a field-programmable gate array (FPGA) with 200,000 system gates. It operates at a maximum frequency of 275.4 MHz and includes 192 macrocells. This chip is manufactured by Xilinx and follows the Spartan-3 FPGA family. It offers low power consumption and high performance, making it suitable for a wide range of applications, including digital signal processing, communications, industrial control, and more.
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Equivalent
The equivalent products of the XC3S200-4PQG208C chip are the XC3S200-4FTG256C and XC3S200-4FGG320C chips. -
Features
The XC3S200-4PQG208C is a Field-Programmable Gate Array (FPGA) from Xilinx. It has 200,000 logic cells, operates at a maximum frequency of 400 MHz, and has 152 user I/O pins. It supports various I/O standards, has embedded Block RAM and DSP slices, and offers a wide range of configuration options. -
Pinout
The XC3S200-4PQG208C is a field-programmable gate array (FPGA) manufactured by Xilinx. It has 208 pins and the "4PQG208C" refers to its package and speed grade. The pin count and function may vary depending on the specific design and configuration used. -
Manufacturer
The manufacturer of the XC3S200-4PQG208C is Xilinx Inc. Xilinx is a semiconductor company that specializes in the design, development, and production of programmable logic devices. Their products are widely used in various industries such as aerospace, defense, automotive, communications, and more. -
Application Field
The XC3S200-4PQG208C FPGA can be used in various application areas, including telecommunications, automotive, industrial automation, medical devices, consumer electronics, and aerospace. Its features, such as high-speed data processing, flexible design customization, and low power consumption, make it suitable for a wide range of applications that require programmable logic and digital signal processing capabilities. -
Package
The XC3S200-4PQG208C chip is of BGA (Ball Grid Array) package type, with a PQG208C form factor. It has a 208-pin count and follows a 0.8 mm pitch.
Datasheet PDF
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