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Xilinx XC3S200-4PQG208C

Spartan®-3 Field Programmable Gate Array (FPGA) IC 141 221184 4320 208-BFQFP

ISO14001 ISO9001 DUNS

Brands: AMD Xilinx, Inc

Mfr.Part #: XC3S200-4PQG208C

Datasheet: XC3S200-4PQG208C Datasheet (PDF)

Package/Case: 208-BFQFP

Product Type: Programmable Logic ICs

RoHS Status:

Stock Condition: 2397 pcs, New Original

Warranty: 1 Year Ovaga Warranty - Find Out More

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XC3S200-4PQG208C General Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 141 221184 4320 208-BFQFP

Features

IC FPGA 141 I/O 208PQFPIC FPGA 141 I/O 208PQFP
AMD Xilinx, Inc Inventory

Specifications

Parameter Value Parameter Value
Mfr AMD Series Spartan®-3
Package Tray Product Status Obsolete
Programmabe Not Verified Number of LABs/CLBs 480
Number of Logic Elements/Cells 4320 Total RAM Bits 221184
Number of I/O 141 Number of Gates 200000
Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) Package / Case 208-BFQFP
Supplier Device Package 208-PQFP (28x28)

Shipping

Shipping Type Ship Fee Lead Time
DHL DHL $20.00-$40.00 (0.50 KG) 2-5 days
Fedex Fedex $20.00-$40.00 (0.50 KG) 2-5 days
UPS UPS $20.00-$40.00 (0.50 KG) 2-5 days
TNT TNT $20.00-$40.00 (0.50 KG) 2-5 days
EMS EMS $20.00-$40.00 (0.50 KG) 2-5 days
REGISTERED AIR MAIL REGISTERED AIR MAIL $20.00-$40.00 (0.50 KG) 2-5 days

Processing Time:Shipping fee depend on different zone and country.

Payment

Terms of payment Hand Fee
Wire Transfer Wire Transfer charge US$30.00 banking fee.
Paypal Paypal charge 4.0% service fee.
Credit Card Credit Card charge 3.5% service fee.
Western Union Western Union charge US.00 banking fee.
Money Gram Money Gram charge US$0.00 banking fee.

Guarantees

1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.

2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.

Packing

  • Product

    Step1 :Product

  • Vacuum packaging

    Step2 :Vacuum packaging

  • Anti-static bag

    Step3 :Anti-static bag

  • Individual packaging

    Step4 :Individual packaging

  • Packaging boxes

    Step5 :Packaging boxes

  • bar-code shipping tag

    Step6 :bar-code shipping tag

All the products will packing in anti-staticbag. Ship with ESD antistatic protection.

Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.

We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.

After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.

  • ESD
  • ESD

Part points

  • The XC3S200-4PQG208C chip is a field-programmable gate array (FPGA) with 200,000 system gates. It operates at a maximum frequency of 275.4 MHz and includes 192 macrocells. This chip is manufactured by Xilinx and follows the Spartan-3 FPGA family. It offers low power consumption and high performance, making it suitable for a wide range of applications, including digital signal processing, communications, industrial control, and more.
  • Equivalent

    The equivalent products of the XC3S200-4PQG208C chip are the XC3S200-4FTG256C and XC3S200-4FGG320C chips.
  • Features

    The XC3S200-4PQG208C is a Field-Programmable Gate Array (FPGA) from Xilinx. It has 200,000 logic cells, operates at a maximum frequency of 400 MHz, and has 152 user I/O pins. It supports various I/O standards, has embedded Block RAM and DSP slices, and offers a wide range of configuration options.
  • Pinout

    The XC3S200-4PQG208C is a field-programmable gate array (FPGA) manufactured by Xilinx. It has 208 pins and the "4PQG208C" refers to its package and speed grade. The pin count and function may vary depending on the specific design and configuration used.
  • Manufacturer

    The manufacturer of the XC3S200-4PQG208C is Xilinx Inc. Xilinx is a semiconductor company that specializes in the design, development, and production of programmable logic devices. Their products are widely used in various industries such as aerospace, defense, automotive, communications, and more.
  • Application Field

    The XC3S200-4PQG208C FPGA can be used in various application areas, including telecommunications, automotive, industrial automation, medical devices, consumer electronics, and aerospace. Its features, such as high-speed data processing, flexible design customization, and low power consumption, make it suitable for a wide range of applications that require programmable logic and digital signal processing capabilities.
  • Package

    The XC3S200-4PQG208C chip is of BGA (Ball Grid Array) package type, with a PQG208C form factor. It has a 208-pin count and follows a 0.8 mm pitch.

Datasheet PDF

Preliminary Specification XC3S200-4PQG208C PDF Download

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