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Xilinx XC3S1000-4FGG676I
Spartan®-3 Field Programmable Gate Array (FPGA) IC 391 442368 17280 676-BGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S1000-4FGG676I
Datasheet: XC3S1000-4FGG676I Datasheet (PDF)
Package/Case: 676-BGA
RoHS Status:
Stock Condition: 3931 pcs, New Original
Product Type: Programmable Logic ICs
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $257.487 | $257.487 |
| 200 | $99.645 | $19929.000 |
| 500 | $96.142 | $48071.000 |
| 1000 | $94.411 | $94411.000 |
In Stock:3931 PCS
XC3S1000-4FGG676I General Description
Spartan®-3 Field Programmable Gate Array (FPGA) IC 391 442368 17280 676-BGA
Features
- Device family: Spartan-3
- Logic cells: 1,031
- System gates: 84,480
- Block RAM: 576 Kb
- Maximum user I/Os: 620
- Package: 676-ball Fine-Pitch Ball-Grid Array (FBGA)
Application
- Video and image processing
- Wireless communications
- Industrial control systems
- Aerospace and defense
- Automotive systems
- Medical equipment
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Pbfree Code | Yes | Rohs Code | Yes |
| Part Life Cycle Code | Transferred | Ihs Manufacturer | XILINX INC |
| Part Package Code | BGA | Package Description | 27 X 27 MM, LEAD FREE, FBGA-676 |
| Pin Count | 676 | Reach Compliance Code | compliant |
| ECCN Code | 3A991.D | HTS Code | 8542.39.00.01 |
| Factory Lead Time | 35 Weeks | Samacsys Manufacturer | XILINX |
| Clock Frequency-Max | 630 MHz | Combinatorial Delay of a CLB-Max | 0.61 ns |
| JESD-30 Code | S-PBGA-B676 | JESD-609 Code | e1 |
| Length | 27 mm | Moisture Sensitivity Level | 3 |
| Number of CLBs | 1920 | Number of Equivalent Gates | 1000000 |
| Number of Inputs | 391 | Number of Logic Cells | 17280 |
| Number of Outputs | 391 | Number of Terminals | 676 |
| Organization | 1920 CLBS, 1000000 GATES | Package Body Material | PLASTIC/EPOXY |
| Package Code | BGA | Package Equivalence Code | BGA676,26X26,40 |
| Package Shape | SQUARE | Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 260 | Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Qualification Status | Not Qualified | Seated Height-Max | 2.6 mm |
| Supply Voltage-Max | 1.26 V | Supply Voltage-Min | 1.14 V |
| Supply Voltage-Nom | 1.2 V | Surface Mount | YES |
| Technology | CMOS | Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL | Terminal Pitch | 1 mm |
| Terminal Position | BOTTOM | Time@Peak Reflow Temperature-Max (s) | 30 |
| Width | 27 mm |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
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TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
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Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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All the products will packing in anti-staticbag. Ship with ESD antistatic protection.
Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3S1000-4FGG676I component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : XC3S1000-4FT256C
Brands :
Package : BGA256
Description : Spartan-3 FPGA Family : Complete Data Sheet
Part Number : XC3S1000-4FTG256C
Brands :
Package : BGA-256
Description : FPGA Spartan®-3 Family 1M Gates 17280 Cells 630MHz 90nm Technology 1.2V
Part Number : XC3S1000-4FG320C
Brands :
Package : BGA320
Description : Spartan-3 FPGA Family : Complete Data Sheet
Part Number : XC3S1000-4FT256I
Brands :
Package : BGA256
Description : Spartan-3 FPGA Family : Complete Data Sheet
Part Number : XC3S1000-4FTG256I
Brands :
Package : BGA-256
Description : FPGA Spartan®-3 Family 1M Gates 17280 Cells 630MHz 90nm Technology 1.2V
Part Number : XC3S1000-4FG320I
Brands :
Package : BGA-320
Description : Spartan-3 Family 1M Gates 17280 Cells 630MHz 90nm Technology 1.2V
Part points
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The XC3S1000-4FGG676I is a high-performance field-programmable gate array (FPGA) chip. It is part of the Spartan-3 series from Xilinx. This chip offers various features, such as a fast processing speed, abundant logic cells, and programmable I/O. It is commonly used in applications that require real-time processing, high-speed data transfer, and complex digital signal processing.
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Equivalent
XC3S1000-4FGG676I is an FPGA chip from Xilinx. Equivalent products include XC3S50-4VQG100I, XC3S200-4VQG100C, XC3S500E-4FGG320C, XC3S1200E-4FGG320C, XC3S2000-4FGG320C, XC3S4000-4FGG320C, and XC3S1600E-4BG400I, among others. These chips have different capacities and configurations but can offer similar functionality and performance characteristics. -
Features
The XC3S1000-4FGG676I is a field-programmable gate array (FPGA) with a density of 1,016 configurable logic blocks (CLBs), 32 multipliers, and 48 I/O pins. It operates at a maximum frequency of 400MHz and supports 3.3V power supply. The device is housed in a 676-ball grid array (BGA) package. -
Pinout
The XC3S1000-4FGG676I has a pin count of 676. It is a field-programmable gate array (FPGA) with 1,024 logic cells and 32,000 system gates. The "4FGG" designation indicates a 4-input LUT (look-up table) with global buffer, and the "I" denotes the industrial temperature range. -
Manufacturer
The manufacturer of the XC3S1000-4FGG676I is Xilinx Inc. It is a leading American semiconductor company specializing in field-programmable gate arrays (FPGAs) and programmable logic devices. -
Application Field
The XC3S1000-4FGG676I is an FPGA (Field-Programmable Gate Array) and can be used in a variety of application areas such as communications, industrial controls, automotive, aerospace, and consumer electronics. It is commonly used for purposes like data processing, digital signal processing, and system integration due to its flexibility and reconfigurable nature. -
Package
The XC3S1000-4FGG676I chip has a package type of FG676, a form factor of BGA, and a size of 27mm x 27mm with a 1.0mm ball pitch.
Datasheet PDF
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