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Xilinx XC3S1000-4FGG676C
Spartan®-3 Field Programmable Gate Array (FPGA) IC 391 442368 17280 676-BGA
Brands: AMD Xilinx, Inc
Mfr.Part #: XC3S1000-4FGG676C
Datasheet: XC3S1000-4FGG676C Datasheet (PDF)
Package/Case: FBGA-676
RoHS Status:
Stock Condition: 2714 pcs, New Original
Product Type: Programmable Logic ICs
Warranty: 1 Year Ovaga Warranty - Find Out More
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*All prices are in USD
| Qty | Unit Price | Ext Price |
|---|---|---|
| 1 | $568.214 | $568.214 |
| 200 | $226.722 | $45344.400 |
| 480 | $219.146 | $105190.080 |
| 1000 | $215.402 | $215402.000 |
In Stock:2714 PCS
XC3S1000-4FGG676C General Description
Spartan®-3 Field Programmable Gate Array (FPGA) IC 391 442368 17280 676-BGA
Features
- 1000K System Gates
- 2400 Logic Cells
- 256Kbits Distributed RAM
- 20 Multipliers (18x18)
- 4 Digital Clock Managers (DCMs)
- 456 User I/Os
- -4 speed grade
- 1.2V core voltage, 2.5V/3.3V auxiliary voltages
- 676-pin Fine-Pitch Ball-Grid Array (FBGA) package
Application
- Digital signal processing
- Communications systems
- High-speed networking equipment
- Industrial control systems
- Consumer electronics
- Medical equipment
- Aerospace and defense
Specifications
| Parameter | Value | Parameter | Value |
|---|---|---|---|
| Pbfree Code | Yes | Rohs Code | Yes |
| Part Life Cycle Code | Transferred | Ihs Manufacturer | XILINX INC |
| Part Package Code | BGA | Package Description | 27 X 27 MM, LEAD FREE, FBGA-676 |
| Pin Count | 676 | Reach Compliance Code | compliant |
| ECCN Code | 3A991.D | HTS Code | 8542.39.00.01 |
| Factory Lead Time | 35 Weeks | Samacsys Manufacturer | XILINX |
| Clock Frequency-Max | 630 MHz | Combinatorial Delay of a CLB-Max | 0.61 ns |
| JESD-30 Code | S-PBGA-B676 | JESD-609 Code | e1 |
| Length | 27 mm | Moisture Sensitivity Level | 3 |
| Number of CLBs | 1920 | Number of Equivalent Gates | 1000000 |
| Number of Inputs | 391 | Number of Logic Cells | 17280 |
| Number of Outputs | 391 | Number of Terminals | 676 |
| Operating Temperature-Max | 85 °C | Operating Temperature-Min | |
| Organization | 1920 CLBS, 1000000 GATES | Package Body Material | PLASTIC/EPOXY |
| Package Code | BGA | Package Equivalence Code | BGA676,26X26,40 |
| Package Shape | SQUARE | Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 260 | Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Qualification Status | Not Qualified | Seated Height-Max | 2.6 mm |
| Supply Voltage-Max | 1.26 V | Supply Voltage-Min | 1.14 V |
| Supply Voltage-Nom | 1.2 V | Surface Mount | YES |
| Technology | CMOS | Temperature Grade | OTHER |
| Terminal Finish | TIN SILVER COPPER | Terminal Form | BALL |
| Terminal Pitch | 1 mm | Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
Shipping
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 |
DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
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Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
TNT | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 |
REGISTERED AIR MAIL | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time：Shipping fee depend on different zone and country.
Payment
| Terms of payment | Hand Fee | |
|---|---|---|
 |
Wire Transfer | charge US$30.00 banking fee. |
 |
Paypal | charge 4.0% service fee. |
 |
Credit Card | charge 3.5% service fee. |
 |
Western Union | charge US.00 banking fee. |
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Money Gram | charge US$0.00 banking fee. |
Guarantees
1.The electronic components you purchase include 365 Days Warranty, We guarantee product quality.
2.If some of the items you received aren't of perfect quality, we would resiponsibly arrange your refund or replacement. But the items must remain their orginal condition.
Packing
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Outside ESD packing’s lable will use ourcompany’s information: Part Mumber, Brand and Quantity.
We will inspect all the goods before shipment,ensure all the products at good condition and ensure the parts are new originalmatch datasheet.
After all the goods are ensure no problems afterpacking, we will packing safely and send by global express. It exhibitsexcellent puncture and tear resistance along with good seal integrity.
Equivalent Parts
For the XC3S1000-4FGG676C component, you may consider these replacement and alternative parts:
Part Number
Brands
Package
Description
Part Number : XC3S1000-4FTG256I
Brands :
Package : BGA-256
Description : FPGA Spartan®-3 Family 1M Gates 17280 Cells 630MHz 90nm Technology 1.2V
Part Number : XC3S1000-4FT256I
Brands :
Package : BGA256
Description : Spartan-3 FPGA Family : Complete Data Sheet
Part Number : XC3S1000-4FGG320C
Brands :
Package : BGA-320
Description : FPGA Spartan-3 Family 1M Gates 17280 Cells 630MHz 90nm Technology 1.2V
Part Number : XC3S1000-4FG320C
Brands :
Package : BGA320
Description : Spartan-3 FPGA Family : Complete Data Sheet
Part points
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The XC3S1000-4FGG676C chip is a type of Field-Programmable Gate Array (FPGA) designed by Xilinx. It features a 1000K gate count and operates at a frequency of 125 MHz. The chip is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package and can be programmed to perform various digital logic functions.
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Equivalent
Some equivalent products to the XC3S1000-4FGG676C chip are: 1. XC3S1000-4FGG456C 2. XC3S1000-4FGG456I 3. XC3S1000-4FG456I 4. XC3S1000-4FGG676I 5. XC3S1000-4FGG456C-1149 -
Features
The features of XC3S1000-4FGG676C include a Spartan-3 FPGA with 1,016 I/Os, 1,171,648 system gates, 40,192 flip-flops, 40 DSP48E slices, 4 Clock Management Tiles, and a maximum frequency of 450 MHz. It also has 924 KB of distributed RAM and 1,108 KB of block RAM. -
Pinout
The XC3S1000-4FGG676C is an FPGA from the Spartan-3 series. It has 676 pins and the "4FGG" indicates a speed grade of -4. The specific pin functions vary, and can be found in the datasheet provided by Xilinx. -
Manufacturer
The manufacturer of the XC3S1000-4FGG676C is Xilinx. Xilinx is a semiconductor company that specializes in the development and production of programmable logic devices, including Field-Programmable Gate Arrays (FPGAs) like the XC3S1000-4FGG676C. They provide solutions for a wide range of industries, including telecommunications, aerospace, automotive, and consumer electronics. -
Application Field
The XC3S1000-4FGG676C is a Field-Programmable Gate Array (FPGA) and can be used in various applications such as communication systems, high-performance computing, digital signal processing, automotive electronics, and industrial control systems. It provides flexibility and programmability to implement custom logic and algorithms in these domains. -
Package
The XC3S1000-4FGG676C chip is in a FG676 package type, with a Ball Grid Array (BGA) form. It has 676 pins and measures 27mm x 27mm in size.
Datasheet PDF
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